HK1123526A1 - Copper fine particle dispersion liquid and method for producing same - Google Patents

Copper fine particle dispersion liquid and method for producing same

Info

Publication number
HK1123526A1
HK1123526A1 HK09100758.3A HK09100758A HK1123526A1 HK 1123526 A1 HK1123526 A1 HK 1123526A1 HK 09100758 A HK09100758 A HK 09100758A HK 1123526 A1 HK1123526 A1 HK 1123526A1
Authority
HK
Hong Kong
Prior art keywords
fine particle
dispersion liquid
particle dispersion
producing same
copper fine
Prior art date
Application number
HK09100758.3A
Other languages
English (en)
Inventor
Kensaku Mori
Shintarou Okamoto
Hiroko Nakata
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of HK1123526A1 publication Critical patent/HK1123526A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
HK09100758.3A 2005-07-25 2009-01-23 Copper fine particle dispersion liquid and method for producing same HK1123526A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005213835 2005-07-25
PCT/JP2006/314566 WO2007013393A1 (ja) 2005-07-25 2006-07-24 銅微粒子分散液及びその製造方法

Publications (1)

Publication Number Publication Date
HK1123526A1 true HK1123526A1 (en) 2009-06-19

Family

ID=37683290

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09100758.3A HK1123526A1 (en) 2005-07-25 2009-01-23 Copper fine particle dispersion liquid and method for producing same

Country Status (6)

Country Link
US (1) US8083972B2 (xx)
JP (1) JP4978844B2 (xx)
KR (1) KR100967371B1 (xx)
CN (1) CN101232963B (xx)
HK (1) HK1123526A1 (xx)
WO (1) WO2007013393A1 (xx)

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JP5205786B2 (ja) * 2007-04-02 2013-06-05 住友金属鉱山株式会社 金属光沢性を有する印刷用インク組成物、その製造方法及びそれを用いた塗膜
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JP4865772B2 (ja) * 2007-08-30 2012-02-01 三ツ星ベルト株式会社 金属コロイド粒子およびその分散液
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JP5898400B2 (ja) * 2007-11-05 2016-04-06 住友金属鉱山株式会社 銅微粒子とその製造方法及び銅微粒子分散液
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JP5176824B2 (ja) * 2008-09-26 2013-04-03 住友金属鉱山株式会社 銀被覆銅微粒子とその分散液及びその製造方法
JP5239700B2 (ja) * 2008-09-30 2013-07-17 住友金属鉱山株式会社 金属微粒子分散液を用いた塗膜形成方法及びそれを用いた塗膜
JP5306966B2 (ja) * 2008-10-27 2013-10-02 古河電気工業株式会社 銅微粒子分散水溶液の製造方法、及び銅微粒子分散水溶液の保管方法
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TWI492303B (zh) 2009-03-27 2015-07-11 Applied Nanotech Holdings Inc 增進光及／或雷射燒結之緩衝層
KR20140020286A (ko) * 2011-06-14 2014-02-18 유니띠까 가부시키가이샤 피복 섬유상 구리 미립자, 및 그 피복 섬유상 구리 미립자를 포함하는 도전성 코팅제 및 도전성 필름
JP5088760B1 (ja) * 2011-11-14 2012-12-05 石原薬品株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
JP5960543B2 (ja) * 2012-08-08 2016-08-02 古河機械金属株式会社 銅微粒子の製造方法、および導電性ペーストの製造方法
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CN102898887B (zh) * 2012-10-12 2015-06-17 复旦大学 有机铜盐墨水和铜导电薄膜的制备方法
CN102924996A (zh) * 2012-10-16 2013-02-13 复旦大学 纳米铜油墨和铜导电薄膜的制备方法
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
CN105473259B (zh) * 2013-07-25 2019-06-21 石原产业株式会社 金属铜分散液、其制备方法及其用途
JP2015026567A (ja) 2013-07-29 2015-02-05 富士フイルム株式会社 導電膜形成用組成物及び導電膜の製造方法
JP6232904B2 (ja) * 2013-10-08 2017-11-22 東洋紡株式会社 導電性ペースト、導電性薄膜及び電気回路
JP6429659B2 (ja) * 2014-03-05 2018-11-28 古河電気工業株式会社 銅微粒子分散液
US20170213615A1 (en) * 2014-07-22 2017-07-27 Sumitomo Electric Industries, Ltd. Metal nanoparticle dispersion and metal coating film
CN106715009A (zh) * 2014-08-28 2017-05-24 石原产业株式会社 金属质铜粒子及其制备方法
JP6368925B2 (ja) * 2014-10-01 2018-08-08 協立化学産業株式会社 被覆銅粒子及びその製造方法
US10994331B2 (en) * 2015-03-26 2021-05-04 Mitsui Mining & Smelting Co., Ltd. Copper powder and conductive composition containing same
CN108430915B (zh) * 2016-02-02 2022-07-26 M技术株式会社 微粒分散液的精密改性方法
CN109070208B (zh) * 2016-04-22 2020-09-25 Dic株式会社 金属纳米粒子水分散液
JP6984131B2 (ja) * 2017-01-23 2021-12-17 株式会社リコー 銅粒子含有インク、銅粒子含有インクの製造方法、導電性印刷物の印刷方法、及び導電性配線の形成方法
TWI652695B (zh) * 2017-08-16 2019-03-01 昇貿科技股份有限公司 Liquid composition
JP6561100B2 (ja) * 2017-10-04 2019-08-14 Ｊｘ金属株式会社 表面処理銅微粒子の製造方法
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CN112166653A (zh) * 2018-03-15 2021-01-01 以色列商普林特电路板有限公司 双组分可印刷导电组合物
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Also Published As

Publication number Publication date
US8083972B2 (en) 2011-12-27
JPWO2007013393A1 (ja) 2009-02-05
US20090261304A1 (en) 2009-10-22
CN101232963A (zh) 2008-07-30
JP4978844B2 (ja) 2012-07-18
WO2007013393A1 (ja) 2007-02-01
KR20080017457A (ko) 2008-02-26
CN101232963B (zh) 2011-05-04
KR100967371B1 (ko) 2010-07-05

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180724