HK1069792A1 - Nonleaded solder alloy and electronic parts using it - Google Patents
Nonleaded solder alloy and electronic parts using itInfo
- Publication number
- HK1069792A1 HK1069792A1 HK05102215A HK05102215A HK1069792A1 HK 1069792 A1 HK1069792 A1 HK 1069792A1 HK 05102215 A HK05102215 A HK 05102215A HK 05102215 A HK05102215 A HK 05102215A HK 1069792 A1 HK1069792 A1 HK 1069792A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electronic parts
- solder alloy
- nonleaded
- nonleaded solder
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2001/007488 WO2003020468A1 (fr) | 2001-08-30 | 2001-08-30 | Alliage de brasage sans plomb et parties electroniques utilisant ledit alliage |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1069792A1 true HK1069792A1 (en) | 2005-06-03 |
Family
ID=11737677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05102215A HK1069792A1 (en) | 2001-08-30 | 2005-03-14 | Nonleaded solder alloy and electronic parts using it |
Country Status (9)
Country | Link |
---|---|
US (1) | US7005106B2 (de) |
EP (1) | EP1439024B1 (de) |
JP (1) | JP4673552B2 (de) |
KR (1) | KR100621387B1 (de) |
CN (1) | CN1295053C (de) |
DE (1) | DE60109827T2 (de) |
HK (1) | HK1069792A1 (de) |
TW (1) | TW508281B (de) |
WO (1) | WO2003020468A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014084242A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社日本スペリア社 | 低融点ろう材 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006002755A (ja) * | 2004-05-20 | 2006-01-05 | Matsushita Electric Ind Co Ltd | インバータ装置一体型電動圧縮機およびこれを適用した車両用空調装置 |
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
JP5376553B2 (ja) * | 2006-06-26 | 2013-12-25 | 日立金属株式会社 | 配線用導体及び端末接続部 |
JP2014509944A (ja) * | 2011-02-04 | 2014-04-24 | アンタヤ・テクノロジーズ・コープ | 無鉛はんだ組成物 |
US9042079B2 (en) * | 2012-08-24 | 2015-05-26 | Tdk Corporation | Ceramic electronic component |
CN103464358B (zh) * | 2012-12-18 | 2015-03-11 | 广州大华仁盛铝合金管业有限公司 | 一种热交换器用铜合金高频焊管表面软钎焊料在线涂敷工艺 |
JP5842973B1 (ja) * | 2014-09-04 | 2016-01-13 | 千住金属工業株式会社 | 端子予備メッキ用鉛フリーはんだ合金及び電子部品 |
CN107427968B (zh) * | 2015-09-17 | 2020-11-24 | 富士电机株式会社 | 半导体装置用软钎焊材料 |
JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Agc株式会社 | 接合用組成物 |
US11344976B2 (en) | 2017-11-24 | 2022-05-31 | Senju Metal Industry Co., Ltd. | Solder material, solder paste, and solder joint |
JP6573019B1 (ja) | 2018-10-25 | 2019-09-11 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP6638179B1 (ja) * | 2018-12-03 | 2020-01-29 | 千住金属工業株式会社 | フラックス、はんだ合金、接合体、及び接合体の製造方法 |
JP6638180B1 (ja) * | 2018-12-03 | 2020-01-29 | 千住金属工業株式会社 | フラックス、はんだ合金、接合体、及び接合体の製造方法 |
WO2020116372A1 (ja) * | 2018-12-03 | 2020-06-11 | 千住金属工業株式会社 | フラックス、はんだ合金、接合体、及び接合体の製造方法 |
MY189490A (en) | 2019-05-27 | 2022-02-16 | Senju Metal Industry Co | Solder alloy, solder paste, solder ball, solder preform, and solder joint |
CN111020442B (zh) * | 2019-12-13 | 2021-10-22 | 中机智能装备创新研究院(宁波)有限公司 | 一种锡基巴氏合金丝及其制备方法和用途 |
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
JP7007623B1 (ja) | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62287658A (ja) * | 1986-06-06 | 1987-12-14 | Hitachi Ltd | セラミックス多層回路板 |
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
DE3905276C1 (de) * | 1989-02-21 | 1990-05-03 | Demetron Gesellschaft Fuer Elektronik-Werkstoffe Mbh, 6450 Hanau, De | |
JP2786073B2 (ja) * | 1993-03-26 | 1998-08-13 | 太陽誘電株式会社 | 面実装型コイル部品 |
JP4142118B2 (ja) * | 1994-12-27 | 2008-08-27 | 古河電気工業株式会社 | 電子部品の製造方法及び絶縁電線の皮膜剥離処理方法 |
JPH08195268A (ja) * | 1995-01-17 | 1996-07-30 | Furukawa Electric Co Ltd:The | 半田付け方法及びその装置 |
JPH08236363A (ja) * | 1995-02-27 | 1996-09-13 | Taiyo Yuden Co Ltd | 電気回路部品の端子板 |
JP3353662B2 (ja) * | 1997-08-07 | 2002-12-03 | 富士電機株式会社 | はんだ合金 |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
WO1998057340A1 (en) * | 1997-06-13 | 1998-12-17 | Taiyo Yuden Co., Ltd. | Coil to be mounted on substrate and structure mounting the same on substrate |
JP3296289B2 (ja) * | 1997-07-16 | 2002-06-24 | 富士電機株式会社 | はんだ合金 |
JP3760586B2 (ja) * | 1997-09-05 | 2006-03-29 | 株式会社村田製作所 | 半田組成物 |
ES2224609T3 (es) | 1998-03-26 | 2005-03-01 | Nihon Superior Sha Co., Ltd | Aleacion de soldadura exenta de plomo. |
JP2000197988A (ja) * | 1998-03-26 | 2000-07-18 | Nihon Superior Co Ltd | 無鉛はんだ合金 |
JP3829475B2 (ja) * | 1998-05-13 | 2006-10-04 | 株式会社村田製作所 | Cu系母材接合用のはんだ組成物 |
JP3363393B2 (ja) * | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP3036636B1 (ja) * | 1999-02-08 | 2000-04-24 | 日本アルミット株式会社 | 無鉛半田合金 |
JP2000343273A (ja) | 1999-06-01 | 2000-12-12 | Fuji Electric Co Ltd | はんだ合金 |
WO2000076717A1 (fr) * | 1999-06-11 | 2000-12-21 | Nippon Sheet Glass Co., Ltd. | Soudure sans plomb |
JP3544904B2 (ja) * | 1999-09-29 | 2004-07-21 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
JP3501700B2 (ja) * | 1999-10-25 | 2004-03-02 | 石川金属株式会社 | 銅くわれ防止無鉛はんだ |
HUP0104903A3 (en) * | 2000-03-17 | 2002-05-28 | Tokyo First Trading Company | Lead-free solder alloy |
JP3775172B2 (ja) | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
JP2002222708A (ja) * | 2001-01-24 | 2002-08-09 | Toko Inc | 鉛フリー半田を用いた小型コイル |
JP2002307186A (ja) * | 2001-04-13 | 2002-10-22 | Taiyo Yuden Co Ltd | コイル部品 |
-
2001
- 2001-08-30 EP EP01961214A patent/EP1439024B1/de not_active Expired - Lifetime
- 2001-08-30 US US10/433,461 patent/US7005106B2/en not_active Expired - Lifetime
- 2001-08-30 JP JP2003524764A patent/JP4673552B2/ja not_active Expired - Lifetime
- 2001-08-30 CN CNB018216277A patent/CN1295053C/zh not_active Expired - Lifetime
- 2001-08-30 KR KR1020037007881A patent/KR100621387B1/ko active IP Right Grant
- 2001-08-30 WO PCT/JP2001/007488 patent/WO2003020468A1/ja active IP Right Grant
- 2001-08-30 DE DE60109827T patent/DE60109827T2/de not_active Expired - Lifetime
- 2001-10-02 TW TW090124289A patent/TW508281B/zh not_active IP Right Cessation
-
2005
- 2005-03-14 HK HK05102215A patent/HK1069792A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014084242A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社日本スペリア社 | 低融点ろう材 |
Also Published As
Publication number | Publication date |
---|---|
US20040126270A1 (en) | 2004-07-01 |
EP1439024A1 (de) | 2004-07-21 |
JPWO2003020468A1 (ja) | 2004-12-16 |
CN1547518A (zh) | 2004-11-17 |
DE60109827D1 (de) | 2005-05-04 |
US7005106B2 (en) | 2006-02-28 |
TW508281B (en) | 2002-11-01 |
KR100621387B1 (ko) | 2006-09-13 |
EP1439024A4 (de) | 2004-07-21 |
WO2003020468A1 (fr) | 2003-03-13 |
EP1439024B1 (de) | 2005-03-30 |
CN1295053C (zh) | 2007-01-17 |
KR20040028695A (ko) | 2004-04-03 |
JP4673552B2 (ja) | 2011-04-20 |
DE60109827T2 (de) | 2006-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |
Effective date: 20210829 |