HK1069792A1 - Nonleaded solder alloy and electronic parts using it - Google Patents

Nonleaded solder alloy and electronic parts using it

Info

Publication number
HK1069792A1
HK1069792A1 HK05102215A HK05102215A HK1069792A1 HK 1069792 A1 HK1069792 A1 HK 1069792A1 HK 05102215 A HK05102215 A HK 05102215A HK 05102215 A HK05102215 A HK 05102215A HK 1069792 A1 HK1069792 A1 HK 1069792A1
Authority
HK
Hong Kong
Prior art keywords
electronic parts
solder alloy
nonleaded
nonleaded solder
alloy
Prior art date
Application number
HK05102215A
Other languages
English (en)
Inventor
Koichi Izumida
Yuki Takano
Hitoshi Abe
Toshiyuki Moribayashi
Koichi Hagio
Junichi Takenaka
Original Assignee
Sumida Corp
Nippon Genma Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corp, Nippon Genma Kk filed Critical Sumida Corp
Publication of HK1069792A1 publication Critical patent/HK1069792A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK05102215A 2001-08-30 2005-03-14 Nonleaded solder alloy and electronic parts using it HK1069792A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/007488 WO2003020468A1 (fr) 2001-08-30 2001-08-30 Alliage de brasage sans plomb et parties electroniques utilisant ledit alliage

Publications (1)

Publication Number Publication Date
HK1069792A1 true HK1069792A1 (en) 2005-06-03

Family

ID=11737677

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05102215A HK1069792A1 (en) 2001-08-30 2005-03-14 Nonleaded solder alloy and electronic parts using it

Country Status (9)

Country Link
US (1) US7005106B2 (xx)
EP (1) EP1439024B1 (xx)
JP (1) JP4673552B2 (xx)
KR (1) KR100621387B1 (xx)
CN (1) CN1295053C (xx)
DE (1) DE60109827T2 (xx)
HK (1) HK1069792A1 (xx)
TW (1) TW508281B (xx)
WO (1) WO2003020468A1 (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材

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JP2006002755A (ja) * 2004-05-20 2006-01-05 Matsushita Electric Ind Co Ltd インバータ装置一体型電動圧縮機およびこれを適用した車両用空調装置
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
WO2012106434A1 (en) * 2011-02-04 2012-08-09 Antaya Technologies Corporation Lead-free solder composition
US9042079B2 (en) * 2012-08-24 2015-05-26 Tdk Corporation Ceramic electronic component
CN103464358B (zh) * 2012-12-18 2015-03-11 广州大华仁盛铝合金管业有限公司 一种热交换器用铜合金高频焊管表面软钎焊料在线涂敷工艺
JP5842973B1 (ja) * 2014-09-04 2016-01-13 千住金属工業株式会社 端子予備メッキ用鉛フリーはんだ合金及び電子部品
DE112016000614T5 (de) * 2015-09-17 2017-10-19 Fuji Electric Co., Ltd. Lotmaterial für Halbleiterelemente
JP6788337B2 (ja) * 2015-10-16 2020-11-25 Ａｇｃ株式会社 接合用組成物
WO2019103025A1 (ja) 2017-11-24 2019-05-31 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP6573019B1 (ja) 2018-10-25 2019-09-11 千住金属工業株式会社 フラックス及びソルダペースト
JP6638180B1 (ja) * 2018-12-03 2020-01-29 千住金属工業株式会社 フラックス、はんだ合金、接合体、及び接合体の製造方法
CN113056348A (zh) * 2018-12-03 2021-06-29 千住金属工业株式会社 助焊剂、软钎料合金、接合体和接合体的制造方法
JP6638179B1 (ja) * 2018-12-03 2020-01-29 千住金属工業株式会社 フラックス、はんだ合金、接合体、及び接合体の製造方法
MY189490A (en) 2019-05-27 2022-02-16 Senju Metal Industry Co Solder alloy, solder paste, solder ball, solder preform, and solder joint
CN111020442B (zh) * 2019-12-13 2021-10-22 中机智能装备创新研究院(宁波)有限公司 一种锡基巴氏合金丝及其制备方法和用途
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手

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JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
JP3363393B2 (ja) * 1998-12-21 2003-01-08 千住金属工業株式会社 鉛フリーはんだ合金
JP3036636B1 (ja) * 1999-02-08 2000-04-24 日本アルミット株式会社 無鉛半田合金
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KR20010072364A (ko) * 1999-06-11 2001-07-31 이즈하라 요조 무연 땜납
JP3544904B2 (ja) * 1999-09-29 2004-07-21 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP3501700B2 (ja) * 1999-10-25 2004-03-02 石川金属株式会社 銅くわれ防止無鉛はんだ
EP1225001A1 (en) * 2000-03-17 2002-07-24 Tokyo First Trading Company Lead-free solder alloy
JP3775172B2 (ja) 2000-05-22 2006-05-17 株式会社村田製作所 はんだ組成物およびはんだ付け物品
JP2002222708A (ja) * 2001-01-24 2002-08-09 Toko Inc 鉛フリー半田を用いた小型コイル
JP2002307186A (ja) * 2001-04-13 2002-10-22 Taiyo Yuden Co Ltd コイル部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材

Also Published As

Publication number Publication date
JPWO2003020468A1 (ja) 2004-12-16
JP4673552B2 (ja) 2011-04-20
KR100621387B1 (ko) 2006-09-13
EP1439024B1 (en) 2005-03-30
CN1547518A (zh) 2004-11-17
US20040126270A1 (en) 2004-07-01
DE60109827T2 (de) 2006-04-20
DE60109827D1 (de) 2005-05-04
TW508281B (en) 2002-11-01
EP1439024A1 (en) 2004-07-21
EP1439024A4 (en) 2004-07-21
WO2003020468A1 (fr) 2003-03-13
CN1295053C (zh) 2007-01-17
US7005106B2 (en) 2006-02-28
KR20040028695A (ko) 2004-04-03

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20210829