HK1099469A1 - Soldering method and solder joint member - Google Patents
Soldering method and solder joint memberInfo
- Publication number
- HK1099469A1 HK1099469A1 HK07106370.0A HK07106370A HK1099469A1 HK 1099469 A1 HK1099469 A1 HK 1099469A1 HK 07106370 A HK07106370 A HK 07106370A HK 1099469 A1 HK1099469 A1 HK 1099469A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- joint member
- solder joint
- soldering method
- soldering
- solder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002004185 | 2002-01-11 | ||
JP2002067870 | 2002-03-13 | ||
JP2002282704A JP2003338682A (en) | 2002-01-11 | 2002-09-27 | Soldering method and soldered body |
HK03109301A HK1057147A1 (en) | 2002-01-11 | 2003-12-22 | Soldering method and solder joint member |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1099469A1 true HK1099469A1 (en) | 2007-08-10 |
Family
ID=27792027
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03109301A HK1057147A1 (en) | 2002-01-11 | 2003-12-22 | Soldering method and solder joint member |
HK07106370.0A HK1099469A1 (en) | 2002-01-11 | 2003-12-22 | Soldering method and solder joint member |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03109301A HK1057147A1 (en) | 2002-01-11 | 2003-12-22 | Soldering method and solder joint member |
Country Status (6)
Country | Link |
---|---|
US (3) | US6902102B2 (en) |
JP (1) | JP2003338682A (en) |
KR (3) | KR20030061674A (en) |
CN (1) | CN1305357C (en) |
HK (2) | HK1057147A1 (en) |
TW (1) | TWI227657B (en) |
Families Citing this family (40)
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US20040000574A1 (en) * | 2002-03-08 | 2004-01-01 | Haruo Watanabe | Solder applying method and solder applying apparatus |
JP4143478B2 (en) * | 2002-10-02 | 2008-09-03 | アルプス電気株式会社 | Solder connection structure and solder connection method for electronic parts |
JP3918779B2 (en) * | 2003-06-13 | 2007-05-23 | 松下電器産業株式会社 | Soldering method for non-heat resistant parts |
JP2005026456A (en) * | 2003-07-02 | 2005-01-27 | Toshiba Corp | Printed wiring board, method for packaging electronic component, and electronic apparatus |
US7167375B2 (en) * | 2004-01-16 | 2007-01-23 | Motorola, Inc. | Populated printed wiring board and method of manufacture |
US7070088B2 (en) * | 2004-03-09 | 2006-07-04 | Texas Instruments Incorporated | Method of semiconductor device assembly including fatigue-resistant ternary solder alloy |
JP2005259739A (en) * | 2004-03-09 | 2005-09-22 | Orion Denki Kk | Substrate |
US20060022327A1 (en) * | 2004-07-30 | 2006-02-02 | Texas Instruments Incorporated | Enhanced PGA interconnection |
JP4200325B2 (en) * | 2004-11-04 | 2008-12-24 | パナソニック株式会社 | Solder bonding paste and solder bonding method |
JP2006179817A (en) * | 2004-12-24 | 2006-07-06 | Tekuto:Kk | Method and equipment for manufacturing electronic component |
GB0507887D0 (en) * | 2005-04-20 | 2005-05-25 | Rohm & Haas Elect Mat | Immersion method |
JPWO2006134891A1 (en) * | 2005-06-16 | 2009-01-08 | 千住金属工業株式会社 | Module board soldering method |
JP4609764B2 (en) * | 2005-10-20 | 2011-01-12 | 荒川化学工業株式会社 | Solder flux base resin, rosin solder flux, and solder paste |
JP4687430B2 (en) * | 2005-12-06 | 2011-05-25 | 株式会社デンソー | Electronic device and manufacturing method thereof |
JP4721352B2 (en) * | 2006-06-09 | 2011-07-13 | 株式会社タムラ製作所 | Reflow furnace |
JP4853721B2 (en) * | 2006-10-30 | 2012-01-11 | 株式会社デンソー | Wiring board |
TWI369774B (en) * | 2007-05-15 | 2012-08-01 | Siliconware Precision Industries Co Ltd | Multi-chip semiconductor device having leads and method for fabricating the same |
JP5019057B2 (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工業株式会社 | Solder flux and cream solder |
US20110139855A1 (en) * | 2009-12-16 | 2011-06-16 | Ristolainen Tero | Residual oxygen measurement and control in wave soldering process |
KR101131424B1 (en) * | 2010-04-28 | 2012-05-11 | 보성홀딩스 주식회사 | Pcb mounting method |
CN102049580B (en) * | 2010-09-26 | 2013-04-24 | 广州金升阳科技有限公司 | Welding method of lead frame |
US8393526B2 (en) | 2010-10-21 | 2013-03-12 | Raytheon Company | System and method for packaging electronic devices |
KR101944280B1 (en) * | 2011-05-18 | 2019-01-31 | 엘지이노텍 주식회사 | Camera Module |
KR101702171B1 (en) * | 2012-04-14 | 2017-02-02 | 가부시키가이샤 다니구로구미 | Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method |
US8864536B2 (en) * | 2012-05-03 | 2014-10-21 | International Business Machines Corporation | Implementing hybrid molded solder-embedded pin contacts and connectors |
KR101991355B1 (en) * | 2012-05-18 | 2019-06-20 | 아라까와 가가꾸 고교 가부시끼가이샤 | Base resin for soldering flux, soldering flux and solder paste |
BR102012032031A2 (en) * | 2012-12-14 | 2014-09-09 | Air Liquide Brasil Ltda | PORTABLE EQUIPMENT FOR MONITORING AND CONTROL OF OXYGEN LEVEL IN REFUSION OVEN ATMOSPHERE |
DE102014110720A1 (en) * | 2014-07-29 | 2016-02-04 | Illinois Tool Works Inc. | soldering module |
JP6705450B2 (en) * | 2015-06-12 | 2020-06-03 | 荒川化学工業株式会社 | Flux for lead-free solder and lead-free solder paste |
CN105357899B (en) * | 2015-12-01 | 2018-01-26 | 南京洛普科技有限公司 | A kind of two-sided welding method that anti-large chip comes off |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US10785871B1 (en) | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
US11470727B2 (en) * | 2016-10-24 | 2022-10-11 | Jaguar Land Rover Limited | Apparatus and method relating to electrochemical migration |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
US20240047412A1 (en) * | 2020-12-11 | 2024-02-08 | Mrsi Systems Llc | Inert gas chamber |
CN112820652B (en) * | 2021-01-19 | 2023-08-22 | 国营芜湖机械厂 | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device |
EP4351285A1 (en) * | 2022-10-04 | 2024-04-10 | ZKW Group GmbH | Method for producing a motor vehicle headlight circuit carrier provided with a number of components |
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GB9425030D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
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JPH10233577A (en) | 1997-02-20 | 1998-09-02 | Taiho Kogyo Co Ltd | Solder paste |
JP3688429B2 (en) * | 1997-04-25 | 2005-08-31 | 株式会社東芝 | Electronic component mounting substrate and electronic component mounting substrate |
US6159304A (en) * | 1997-07-03 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
JP4231157B2 (en) | 1998-07-02 | 2009-02-25 | パナソニック株式会社 | Solder powder, manufacturing method thereof, and solder paste |
JP2000068636A (en) | 1998-08-26 | 2000-03-03 | Toyota Motor Corp | Soldering |
JP2001168513A (en) | 1999-12-09 | 2001-06-22 | Toshiba Corp | Method of manufacturing substrate coated with lead- free soldering material |
JP3684134B2 (en) | 2000-03-29 | 2005-08-17 | 株式会社東芝 | Electrical or electronic components and electrical or electronic assemblies |
JP2001293559A (en) | 2000-04-14 | 2001-10-23 | Nihon Dennetsu Keiki Co Ltd | Soldering method |
JP3919420B2 (en) * | 2000-04-14 | 2007-05-23 | 日本電熱計器株式会社 | Soldering method |
GB2363233B (en) * | 2000-05-11 | 2004-03-31 | Ibm | Tamper resistant card enclosure with improved intrusion detection circuit |
JP2001358456A (en) | 2000-06-12 | 2001-12-26 | Hitachi Ltd | Electronic equipment connected by lead-free solder |
GB2380964B (en) * | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
TW500836B (en) * | 2001-11-13 | 2002-09-01 | Jung-Huei Chen | Low-lead-content plating process |
JP4143478B2 (en) * | 2002-10-02 | 2008-09-03 | アルプス電気株式会社 | Solder connection structure and solder connection method for electronic parts |
-
2002
- 2002-09-27 JP JP2002282704A patent/JP2003338682A/en active Pending
-
2003
- 2003-01-10 US US10/339,643 patent/US6902102B2/en not_active Expired - Fee Related
- 2003-01-11 CN CNB031200516A patent/CN1305357C/en not_active Expired - Fee Related
- 2003-01-11 KR KR10-2003-0001833A patent/KR20030061674A/en not_active Application Discontinuation
- 2003-01-13 TW TW092100657A patent/TWI227657B/en not_active IP Right Cessation
- 2003-12-22 HK HK03109301A patent/HK1057147A1/en not_active IP Right Cessation
- 2003-12-22 HK HK07106370.0A patent/HK1099469A1/en not_active IP Right Cessation
-
2004
- 2004-11-19 US US10/991,401 patent/US7176388B2/en not_active Expired - Fee Related
-
2006
- 2006-12-05 US US11/633,517 patent/US7490403B2/en not_active Expired - Fee Related
-
2009
- 2009-04-16 KR KR1020090032984A patent/KR20090051725A/en not_active Application Discontinuation
- 2009-04-16 KR KR1020090032983A patent/KR100952271B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7490403B2 (en) | 2009-02-17 |
US7176388B2 (en) | 2007-02-13 |
US20050067189A1 (en) | 2005-03-31 |
KR100952271B1 (en) | 2010-04-12 |
HK1057147A1 (en) | 2004-03-12 |
TW200401596A (en) | 2004-01-16 |
KR20090051725A (en) | 2009-05-22 |
KR20090051724A (en) | 2009-05-22 |
US20030168499A1 (en) | 2003-09-11 |
US20070107214A1 (en) | 2007-05-17 |
US6902102B2 (en) | 2005-06-07 |
JP2003338682A (en) | 2003-11-28 |
CN1447638A (en) | 2003-10-08 |
CN1305357C (en) | 2007-03-14 |
KR20030061674A (en) | 2003-07-22 |
TWI227657B (en) | 2005-02-01 |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150111 |