GB0123178D0 - Joining method - Google Patents
Joining methodInfo
- Publication number
- GB0123178D0 GB0123178D0 GB0123178A GB0123178A GB0123178D0 GB 0123178 D0 GB0123178 D0 GB 0123178D0 GB 0123178 A GB0123178 A GB 0123178A GB 0123178 A GB0123178 A GB 0123178A GB 0123178 D0 GB0123178 D0 GB 0123178D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- joining method
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0123178A GB2376201A (en) | 2001-09-26 | 2001-09-26 | Joining method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0123178A GB2376201A (en) | 2001-09-26 | 2001-09-26 | Joining method |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0123178D0 true GB0123178D0 (en) | 2001-11-21 |
GB2376201A GB2376201A (en) | 2002-12-11 |
Family
ID=9922754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0123178A Withdrawn GB2376201A (en) | 2001-09-26 | 2001-09-26 | Joining method |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2376201A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6644536B2 (en) * | 2001-12-28 | 2003-11-11 | Intel Corporation | Solder reflow with microwave energy |
DE10316513B4 (en) * | 2003-04-09 | 2015-07-09 | Endress + Hauser Gmbh + Co. Kg | Continuous soldering oven and method for heating printed circuit boards in a continuous soldering oven |
DE102004017772A1 (en) * | 2004-04-13 | 2005-11-03 | Seho Systemtechnik Gmbh | Method for reflow soldering |
KR102409913B1 (en) * | 2017-12-06 | 2022-06-16 | 삼성전자주식회사 | Solder reflow apparatus and method of manufacturing an electronic device |
WO2021095723A1 (en) * | 2019-11-15 | 2021-05-20 | 国立研究開発法人産業技術総合研究所 | Mounting wiring board, electronic component mounted board, method of mounting electronic component, microwave heating method, and microwave heating device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132334A (en) * | 1981-02-06 | 1982-08-16 | Mitsubishi Electric Corp | Soldering method |
JPS59110462A (en) * | 1982-12-14 | 1984-06-26 | Matsushita Electric Ind Co Ltd | Soldering method |
US4845335A (en) * | 1988-01-28 | 1989-07-04 | Microelectronics And Computer Technology Corporation | Laser Bonding apparatus and method |
JPH02144990A (en) * | 1988-11-28 | 1990-06-04 | Nec Corp | Vapor soldering method |
US4978835A (en) * | 1989-08-21 | 1990-12-18 | Microelectronics And Computer Technology Corporation | Method of clamping electrical contacts for laser bonding |
JPH0685448A (en) * | 1992-08-24 | 1994-03-25 | Hitachi Ltd | Laser soldering method and device thereof |
US5484979A (en) * | 1993-10-22 | 1996-01-16 | Ford Motor Company | Laser soldering process employing an energy absorptive coating |
JP2001047222A (en) * | 1999-08-16 | 2001-02-20 | Nippon Avionics Co Ltd | Reflow soldering method for coated thin wire by laser beam |
DE10022840A1 (en) * | 2000-05-10 | 2001-11-15 | Solvay Fluor & Derivate | Laser beam soldering components made of aluminum alloys comprises coating the joining sites with an agent absorbing laser energy |
-
2001
- 2001-09-26 GB GB0123178A patent/GB2376201A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2376201A (en) | 2002-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |