EP1509358A4 - Solder paste flux system - Google Patents

Solder paste flux system

Info

Publication number
EP1509358A4
EP1509358A4 EP03756279A EP03756279A EP1509358A4 EP 1509358 A4 EP1509358 A4 EP 1509358A4 EP 03756279 A EP03756279 A EP 03756279A EP 03756279 A EP03756279 A EP 03756279A EP 1509358 A4 EP1509358 A4 EP 1509358A4
Authority
EP
European Patent Office
Prior art keywords
solder paste
flux system
paste flux
solder
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03756279A
Other languages
German (de)
French (fr)
Other versions
EP1509358A1 (en
Inventor
Bensol Arzadon
Andrew David Price
Leela Josephine Sequeira
Leszek Hozer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Publication of EP1509358A1 publication Critical patent/EP1509358A1/en
Publication of EP1509358A4 publication Critical patent/EP1509358A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP03756279A 2002-05-30 2003-05-30 Solder paste flux system Withdrawn EP1509358A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US158251 1993-11-29
US10/158,251 US20030221748A1 (en) 2002-05-30 2002-05-30 Solder paste flux system
PCT/US2003/017018 WO2003101661A1 (en) 2002-05-30 2003-05-30 Solder paste flux system

Publications (2)

Publication Number Publication Date
EP1509358A1 EP1509358A1 (en) 2005-03-02
EP1509358A4 true EP1509358A4 (en) 2006-03-01

Family

ID=29582626

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03756279A Withdrawn EP1509358A4 (en) 2002-05-30 2003-05-30 Solder paste flux system

Country Status (6)

Country Link
US (1) US20030221748A1 (en)
EP (1) EP1509358A4 (en)
JP (1) JP4461009B2 (en)
CN (1) CN100421862C (en)
AU (1) AU2003232444A1 (en)
WO (1) WO2003101661A1 (en)

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JP3797990B2 (en) * 2003-08-08 2006-07-19 株式会社東芝 Thermosetting flux and solder paste
JP4576270B2 (en) * 2005-03-29 2010-11-04 昭和電工株式会社 Method for manufacturing solder circuit board
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
DE102005053553A1 (en) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Solder pastes with resin-free flux
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN100443245C (en) * 2006-07-04 2008-12-17 广州有色金属研究院 Nickel soldering paste for automatic brazing
JP2008062253A (en) * 2006-09-05 2008-03-21 Denso Corp Flux for soldering and solder paste composition
CN101557903B (en) * 2006-12-12 2013-06-19 千住金属工业株式会社 Flux for lead-free solder and method of soldering
US20100171412A1 (en) * 2007-05-30 2010-07-08 Hiroyuki Tanaka Composition containing inorganic particle, method for formation of inorganic layer, and plasma display panel
EP2243592B1 (en) * 2008-02-22 2020-04-01 Harima Chemicals, Inc. Solder bonding structure and solder paste
WO2010087316A1 (en) * 2009-01-27 2010-08-05 荒川化学工業株式会社 Flux composition for lead-free solder, lead-free solder composition, and resin flux cored solder
KR100977163B1 (en) * 2009-03-23 2010-08-20 덕산하이메탈(주) Solder adhesive and the manufacturing method thereof and the electric device comprising thereof
JP4920058B2 (en) * 2009-06-03 2012-04-18 株式会社タムラ製作所 Solder bonding composition
KR101061048B1 (en) * 2010-02-17 2011-09-01 (주)덕산테코피아 Solder Ink and Electronic Device Package Using the Same
CN101890595B (en) * 2010-07-02 2012-07-04 厦门大学 Low-rosin washing-free soldering flux for lead-free flux-cored wires and preparation method thereof
WO2012118074A1 (en) * 2011-03-02 2012-09-07 千住金属工業株式会社 Flux
CN103000609A (en) * 2011-09-15 2013-03-27 复旦大学 Salient point preparing material and salient point preparing method
HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and method for connecting electronic components with a substrate
JP5520973B2 (en) * 2012-01-17 2014-06-11 株式会社デンソー Flux for flux cored solder and flux solder
EP2835213B1 (en) * 2012-04-05 2017-07-26 Senju Metal Industry Co., Ltd. Solder paste
US20150158128A1 (en) * 2012-06-11 2015-06-11 Senju Metal Industry Co., Ltd. Flux composition, liquid flux, resin flux cored solder, and solder paste
MY194842A (en) * 2013-12-31 2022-12-19 Alpha Metals Rosin-free thermosetting flux formulations
CN104646863A (en) * 2014-06-14 2015-05-27 柳州市奥凯工程机械有限公司 Scaling powder
JP6383587B2 (en) * 2014-06-30 2018-08-29 株式会社タムラ製作所 Flux composition, solder composition, and method for manufacturing electronic substrate
JP6130418B2 (en) * 2015-03-10 2017-05-17 株式会社タムラ製作所 Electronic component joining method, and solder composition and pretreatment agent used in the method
JP5972489B1 (en) 2016-02-10 2016-08-17 古河電気工業株式会社 Conductive adhesive film and dicing die bonding film using the same
JP6005312B1 (en) 2016-02-10 2016-10-12 古河電気工業株式会社 Conductive adhesive film and dicing die bonding film using the same
JP5972490B1 (en) 2016-02-10 2016-08-17 古河電気工業株式会社 Conductive adhesive composition, and conductive adhesive film and dicing / die bonding film using the same
JP5989928B1 (en) 2016-02-10 2016-09-07 古河電気工業株式会社 Conductive adhesive film and dicing die bonding film using the same
JP6005313B1 (en) * 2016-02-10 2016-10-12 古河電気工業株式会社 Conductive adhesive film and dicing die bonding film using the same
JP7150232B2 (en) * 2017-07-03 2022-10-11 株式会社弘輝 Flux, flux cored solder and solder paste
JP6635986B2 (en) * 2017-07-12 2020-01-29 株式会社タムラ製作所 Solder composition and electronic substrate
JP7063630B2 (en) * 2018-01-16 2022-05-09 千住金属工業株式会社 Flux and solder paste
EP4063061B1 (en) * 2018-01-16 2024-04-24 Senju Metal Industry Co., Ltd. Flux and solder paste
JP6617793B2 (en) * 2018-06-01 2019-12-11 千住金属工業株式会社 Solder paste flux and solder paste
CN109014656A (en) * 2018-08-24 2018-12-18 云南科威液态金属谷研发有限公司 A kind of halogen-free scaling powder and its preparation method and application
JP2020116611A (en) * 2019-01-24 2020-08-06 株式会社弘輝 Flux and solder paste
JP6845450B1 (en) * 2020-02-18 2021-03-17 千住金属工業株式会社 Flux and solder paste
US20240238915A1 (en) * 2021-05-06 2024-07-18 Nihon Superior Co., Ltd. Lead-free solder paste

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US5334260A (en) * 1993-02-05 1994-08-02 Litton Systems, Inc. No-clean, low-residue, volatile organic compound free soldering flux and method of use
WO1994017950A1 (en) * 1993-02-05 1994-08-18 Krystyna Stefanowski No-clean, low-residue, volatile organic compound free soldering flux and method of use
EP0619162A2 (en) * 1993-04-05 1994-10-12 Takeda Chemical Industries, Ltd. Soldering flux
EP0620293A1 (en) * 1993-04-05 1994-10-19 MEC CO., Ltd. Composition for treating copper or copper alloys

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US5334260A (en) * 1993-02-05 1994-08-02 Litton Systems, Inc. No-clean, low-residue, volatile organic compound free soldering flux and method of use
WO1994017950A1 (en) * 1993-02-05 1994-08-18 Krystyna Stefanowski No-clean, low-residue, volatile organic compound free soldering flux and method of use
US5334260B1 (en) * 1993-02-05 1995-10-24 Litton Systems Inc No-clean, low-residue, volatile organic conpound free soldering flux and method of use
EP0619162A2 (en) * 1993-04-05 1994-10-12 Takeda Chemical Industries, Ltd. Soldering flux
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Title
See also references of WO03101661A1 *

Also Published As

Publication number Publication date
WO2003101661A1 (en) 2003-12-11
JP2005528224A (en) 2005-09-22
CN1671506A (en) 2005-09-21
JP4461009B2 (en) 2010-05-12
AU2003232444A1 (en) 2003-12-19
EP1509358A1 (en) 2005-03-02
US20030221748A1 (en) 2003-12-04
CN100421862C (en) 2008-10-01

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Inventor name: HOZER, LESZEK

Inventor name: SEQUEIRA, LEELA, JOSEPHINE

Inventor name: PRICE, ANDREW, DAVID

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