SG111229A1 - Pb-free solder alloy, and solder material and solder joint using same - Google Patents

Pb-free solder alloy, and solder material and solder joint using same

Info

Publication number
SG111229A1
SG111229A1 SG200405932A SG200405932A SG111229A1 SG 111229 A1 SG111229 A1 SG 111229A1 SG 200405932 A SG200405932 A SG 200405932A SG 200405932 A SG200405932 A SG 200405932A SG 111229 A1 SG111229 A1 SG 111229A1
Authority
SG
Singapore
Prior art keywords
solder
same
alloy
free
joint
Prior art date
Application number
SG200405932A
Inventor
Ochi Shinya
Tawara Fumitoshi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG111229A1 publication Critical patent/SG111229A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG200405932A 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same SG111229A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003352015 2003-10-10
JP2004223189A JP4453473B2 (en) 2003-10-10 2004-07-30 Lead-free solder alloys, solder materials and solder joints using them

Publications (1)

Publication Number Publication Date
SG111229A1 true SG111229A1 (en) 2005-05-30

Family

ID=34425378

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405932A SG111229A1 (en) 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same

Country Status (6)

Country Link
US (1) US20050079092A1 (en)
JP (1) JP4453473B2 (en)
KR (1) KR100678803B1 (en)
CN (1) CN1311950C (en)
SG (1) SG111229A1 (en)
TW (1) TWI301854B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1749616A1 (en) * 2005-08-05 2007-02-07 Grillo-Werke AG Process for arc or beam soldering or welding of workpieces from same or different metal or metallic aloys using a Sn-Basis alloy filler; Wire of Tin-basis alloy
US20080225490A1 (en) * 2007-03-15 2008-09-18 Daewoong Suh Thermal interface materials
CN101804527A (en) * 2010-04-06 2010-08-18 山东大学 Sn-Zn based unleaded brazing material with low Zn
MX2014011514A (en) 2012-03-28 2015-01-16 Nippon Steel & Sumitomo Metal Corp Tailored blank for hot stamping, hot-stamped member, and processes for producing same.
US9808890B2 (en) 2012-04-18 2017-11-07 Senju Metal Industry Co., Ltd. Solder alloy
KR20190017073A (en) 2012-08-31 2019-02-19 센주긴조쿠고교 가부시키가이샤 Film, bonding method of electronic components, forming and seperating method of film, and electroconductive bonding material
CN103212919A (en) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 Improved lead-free solder wire and flux thereof
CN106238951A (en) * 2016-08-26 2016-12-21 王泽陆 A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof
CN109926750B (en) * 2019-05-17 2021-03-30 云南锡业集团（控股）有限责任公司研发中心 Low-temperature lead-free solder alloy and vacuum casting method thereof
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0168964B1 (en) * 1995-06-30 1999-01-15 이형도 Pb free solder
DE69632866T2 (en) * 1995-09-29 2005-07-14 Matsushita Electric Industrial Co., Ltd., Kadoma LEAD-FREE LOT
JPH10193171A (en) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd Soldering article
JPH10249578A (en) * 1997-03-11 1998-09-22 Hitachi Cable Ltd Copper and copper alloy brazing sheet
JPH10328880A (en) * 1997-06-04 1998-12-15 Mitsui Mining & Smelting Co Ltd Tin-silver based lead-free solder
JP2001321983A (en) * 2000-05-16 2001-11-20 Canon Inc Solder paste and method for soldering electronic parts using the same
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy

Also Published As

Publication number Publication date
JP4453473B2 (en) 2010-04-21
CN1311950C (en) 2007-04-25
JP2005131705A (en) 2005-05-26
TW200519216A (en) 2005-06-16
TWI301854B (en) 2008-10-11
CN1605427A (en) 2005-04-13
KR100678803B1 (en) 2007-02-06
US20050079092A1 (en) 2005-04-14
KR20050035083A (en) 2005-04-15

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