CN103212919A - Improved lead-free solder wire and flux thereof - Google Patents
Improved lead-free solder wire and flux thereof Download PDFInfo
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- CN103212919A CN103212919A CN2013101150196A CN201310115019A CN103212919A CN 103212919 A CN103212919 A CN 103212919A CN 2013101150196 A CN2013101150196 A CN 2013101150196A CN 201310115019 A CN201310115019 A CN 201310115019A CN 103212919 A CN103212919 A CN 103212919A
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- scaling powder
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Abstract
The invention discloses an improved lead-free solder wire and a flux thereof. The improved lead-free solder wire comprises the following components of Zn: 3 to 12, Ag: 0 to 2.5, Bi: 0.5 to 2.5, In: 0 to 5.0, P: 0.005 to 0.02, Ni: 0.01 to 0 .05, CU: 0.5 to 0.6, Ga: 0.004 to 0.01, and the balance of Sn. The lead-free solder wire material provided by the invention is resistant to 900 degrees, and a mixed solution of rosin and organic acid is added into the flux, so that the spattering defect of the flux can be effectively improved, the solder wire does not need to be cleaned, has good wettability, electrical conductivity and thermal conductivity and is easily coated with tin, the rosin percentage content is customized according to customer requirements, no spattering exists in welding, the flux is uniformly distributed, no broken flux phenomenon in a solder core exists, the winding is uniform and is not tied, the spreading speed is fast, and the residue is minimal.
Description
Technical field
The present invention relates to a kind of improved lead-free soldering wire and scaling powder thereof.
Background technology
Lead-free soldering wire now extensively is used in the welding, but its non-refractory of existing lead-free soldering wire causes scolding tin to come off easily, significantly reduces service life.And scaling powder is the effect that plays auxiliary welding in the welding process, therefore directly influences the service life and the welding quality of whole scolding tin.
Summary of the invention
Technical problem to be solved by this invention provides a kind ofly can effectively improve the defective that scaling powder splashes, the improved lead-free soldering wire and the scaling powder thereof that need not to clean.
The present invention is achieved through the following technical solutions: a kind of improved lead-free soldering wire comprises Zn:3～12, Ag:0～2.5, Bi:0.5～2.5, In:0～5.0, P:0.005～0.02, Ni:0.01-0.05, CU:0.5～0.6, Ga:0.004～0.01, surplus is Sn.
As optimized technical scheme, be the P of 0.002-0.15 to adding weight in the above-mentioned lead-free soldering wire, also can add Ge or Ga or their composition about 0.02.
As optimized technical scheme, also comprise the tungsten and the 70%-75% silver that add 20%-25% in the described lead-free soldering wire,
As optimized technical scheme, described scaling powder mass percent is 2～3%.
As optimized technical scheme, described scaling powder comprises organic acid activator, halides activating agent, high-boiling point alcohol kind solvent, heat-resistant resin, cosolvent, organic amine hydrohalide.
As optimized technical scheme, described organic acid activator is at least 6 carbon atoms above monobasic or binary organic acid.
As optimized technical scheme, described halides activating agent is the mixture of bromo-derivative and chloro thing.
The invention has the beneficial effects as follows: the present invention can be anti-the above Pb-free solder material of 900 degree, and in scaling powder, add rosin and organic acid mixed solution, and can effectively improve the defective that scaling powder splashes, need not to clean, it has good wetability, conductance, thermal conductivity, Yi Shangxi, by the required customized rosin content % of client, welding is not splashed, scaling powder is evenly distributed, do not have disconnected scaling powder phenomenon in the tin core, coiling is not evenly tied a knot, and last tin speed is fast, residue is few.
The specific embodiment
Embodiment 1
Comprise Zn:3～12, Ag:0～2.5, Bi:0.5～2.5, In:0～5.0, P:0.005～0.02, Ni:0.01-0.05, CU:0.5～0.6, Ga:0.004～0.01, surplus is Sn.
Wherein, be the P of 0.002-0.15 to adding weight in the above-mentioned lead-free soldering wire, also can add Ge or Ga or their composition about 0.02.
The scolder that makes through above-mentioned percentage can anti-800 degree when welding high temperature, have the anti-effect of splashing and exempting to clean.
Embodiment 2
Comprise Zn:4～13, Ag:1～2.6, Bi:0.7～2.8, In:0～6.0, P:0.004～0.03, Ni:0.02-0.06, CU:0.6～0.7, Ga:0.005～0.02, surplus is Sn.
Wherein, be the P of 0.002-0.25 to adding weight in the above-mentioned lead-free soldering wire, also can add Ge or Ga or their composition about 0.03.
The scolder that makes through above-mentioned percentage can anti-880 degree when welding high temperature, have more the anti-effect of splashing and exempting to clean.
Wherein, also comprise the tungsten and the 70%-75% silver that add 20%-25% in the described lead-free soldering wire,
Described scaling powder mass percent is 2～3%.
Described scaling powder comprises organic acid activator, halides activating agent, high-boiling point alcohol kind solvent, heat-resistant resin, cosolvent, organic amine hydrohalide.
Described organic acid activator is at least 6 carbon atoms above monobasic or binary organic acid.
Described halides activating agent is the mixture of bromo-derivative and chloro thing.
The present invention can be anti-the above Pb-free solder material of 800 degree, and in scaling powder, add rosin and organic acid mixed solution, and can effectively improve the defective that scaling powder splashes, need not to clean, it has good wetability, conductance, thermal conductivity, Yi Shangxi, by the required customized rosin content % of client, welding is not splashed, scaling powder is evenly distributed, do not have disconnected scaling powder phenomenon in the tin core, coiling is not evenly tied a knot, and last tin speed is fast, residue is few.
The above only is the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any variation or replacement of expecting without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (7)
1. improved lead-free soldering wire is characterized in that: comprise Zn:3～12, and Ag:0～2.5, Bi:0.5～2.5, In:0～5.0, P:0.005～0.02, Ni:0.01-0.05, CU:0.5～0.6, Ga:0.004～0.01, surplus is Sn.
2. improved lead-free soldering wire according to claim 1 is characterized in that: to adding weight in the above-mentioned lead-free soldering wire is the P of 0.002-0.15, also can add Ge or Ga or their composition about 0.02.
3. improved lead-free soldering wire according to claim 1 is characterized in that: also comprise the tungsten and the 70%-75% silver that add 20%-25% in the described lead-free soldering wire.
4. one kind is used for the scaling powder used as claims, it is characterized in that: described scaling powder mass percent is 2～3%.
5. scaling powder according to claim 4 is characterized in that: described scaling powder comprises organic acid activator, halides activating agent, high-boiling point alcohol kind solvent, heat-resistant resin, cosolvent, organic amine hydrohalide.
6. scaling powder according to claim 5 is characterized in that: described organic acid activator is at least 6 carbon atoms above monobasic or binary organic acid.
7. scaling powder according to claim 5 is characterized in that: described halides activating agent is the mixture of bromo-derivative and chloro thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013101150196A CN103212919A (en) | 2013-03-22 | 2013-03-22 | Improved lead-free solder wire and flux thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013101150196A CN103212919A (en) | 2013-03-22 | 2013-03-22 | Improved lead-free solder wire and flux thereof |
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| CN103212919A true CN103212919A (en) | 2013-07-24 |
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| CN2013101150196A Pending CN103212919A (en) | 2013-03-22 | 2013-03-22 | Improved lead-free solder wire and flux thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227271A (en) * | 2014-07-23 | 2014-12-24 | 深圳市威勒达科技开发有限公司 | Solder and preparation method thereof |
| CN108213766A (en) * | 2018-01-16 | 2018-06-29 | 中山翰华锡业有限公司 | A kind of aluminium welds special solder(ing) paste and preparation method thereof and application method |
| CN108213767A (en) * | 2018-02-28 | 2018-06-29 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi-Ga brazing filler metal alloys |
| CN108326464A (en) * | 2018-03-13 | 2018-07-27 | 苏州塞澳电气有限公司 | A kind of dedicated Pb-free solder of vehicle glass |
| CN108406158A (en) * | 2015-12-30 | 2018-08-17 | 弘硕科技（宁波）有限公司 | High temperature resistance timeliness high intensity Pb-free solder |
| CN108655607A (en) * | 2018-08-16 | 2018-10-16 | 苏州仁尔必思电子科技有限公司 | A kind of solder stick and preparation method thereof for circuit board |
| CN110788522A (en) * | 2019-10-31 | 2020-02-14 | 苏州万山锡业有限公司 | Manufacturing method of low-splashing active solder wire |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227271A (en) * | 2014-07-23 | 2014-12-24 | 深圳市威勒达科技开发有限公司 | Solder and preparation method thereof |
| CN104227271B (en) * | 2014-07-23 | 2016-01-20 | 深圳市威勒达科技开发有限公司 | A kind of solder flux and preparation method thereof |
| CN108406158A (en) * | 2015-12-30 | 2018-08-17 | 弘硕科技（宁波）有限公司 | High temperature resistance timeliness high intensity Pb-free solder |
| CN108213766A (en) * | 2018-01-16 | 2018-06-29 | 中山翰华锡业有限公司 | A kind of aluminium welds special solder(ing) paste and preparation method thereof and application method |
| CN108213767A (en) * | 2018-02-28 | 2018-06-29 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi-Ga brazing filler metal alloys |
| CN108326464A (en) * | 2018-03-13 | 2018-07-27 | 苏州塞澳电气有限公司 | A kind of dedicated Pb-free solder of vehicle glass |
| CN108655607A (en) * | 2018-08-16 | 2018-10-16 | 苏州仁尔必思电子科技有限公司 | A kind of solder stick and preparation method thereof for circuit board |
| CN110788522A (en) * | 2019-10-31 | 2020-02-14 | 苏州万山锡业有限公司 | Manufacturing method of low-splashing active solder wire |
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Application publication date: 20130724 |