CN104070299A - Tin solder of anti-ageing photovoltaic solder strip - Google Patents
Tin solder of anti-ageing photovoltaic solder strip Download PDFInfo
- Publication number
- CN104070299A CN104070299A CN201310098397.8A CN201310098397A CN104070299A CN 104070299 A CN104070299 A CN 104070299A CN 201310098397 A CN201310098397 A CN 201310098397A CN 104070299 A CN104070299 A CN 104070299A
- Authority
- CN
- China
- Prior art keywords
- tin
- solder
- ageing
- added
- tin solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention discloses a tin solder of an anti-ageing solder strip, which consists of Sn, Bi, Sb, Ge, In, Pb and (SnP+Ga), and belongs to the field of solar power generation science and technology. The tin solder comprises the following components in percentage by weight: 59-61% of Sn, 0.01-1.0% of Bi, 0.01-2.0% of Sb, 0.005-1.0% of Ge, 0.005-1.0% of In, and the balance of Pb. The tin solder has the following characteristics: the tin solder has excellent solder liquidity to improve the weldability on a welding silicon wafer; a trace of Ge element is added to enhance the anti-ageing capacity of solar power in the natural environment so as to prolong the service life of a solar power generation set; as the bismuth element is added, after tin is coated on a copper strip, the surface of the tin coating layer is bright, tidy and smooth without such defects as burrs; the antimony element is added to enhance the welding strength and the surface brightness of the tin coating layer; and as the anti-ageing tin alloy is added, slag ash in the liquid level of the tin solder is largely reduced, and the quality of the coating layer is improved.
Description
Technical field
Patent of the present invention relates to solar photovoltaic technology, especially a kind of scolding tin material of anti-aging photovoltaic welding belt.
Background technology
Utilizing solar energy source generating is in the world for the new forms of energy of color environmental protection, the critical piece that makes solar energy be converted into electric energy is photovoltaic battery panel, and cell panel key component is silicon wafer and photovoltaic welding belt, welding base-material is copper strips, must plate one deck tin solder, therefore the quality of tin solder quality is the important technical indicator of photovoltaic generation effect, current photovoltaic welding belt technique 100% is hot tinning technique, can adopt tin solder to be greater than 99% for the plumbous series solder of tin, use the lead-free solder of several products of outlet about electronic technology, in photovoltaic welding belt technique, be not also used, belong in embryo, therefore European Union's ROHS instruction is had no to association, electronic welding technique and photovoltaic welding belt tin plating technique, because of product performance different, tin solder quality photovoltaic is required higher than electronic welding technological requirement with tin solder.Photovoltaic tin solder has its special requirement: have good electric conductivity; The zinc-plated idol of photovoltaic welding belt will be welded on silicon wafer, and its solderability requires high, otherwise can cause rosin joint, dry joint phenomenon; Tin coating will stand Exposure to Sunlight rain at cell panel and play the test of severe large natural environment, require tin solder must not oxidation, variable color, aging, to reach the service life of 25 years.
Though foreign data has been added 2% silver element on sn-pb basis in recent years, the tin solder of composition sn63%, ag2%, pb36%, is that scolder has been listed Japanese JIS standard in, is relatively early but adopt above-mentioned scolder in Germany on photovoltaic welding belt tin plating technique.
Summary of the invention
The object of the invention is in order to solve the problems of the technologies described above, the technical scheme providing is: 1, a kind of scolding tin material of anti-aging photovoltaic welding belt, is characterized in that its metallic element is formed by Sn, Bi, Sb, Ge, In, Pb.
Further, the scolding tin material part percentage by weight of the anti-aging photovoltaic welding belt of described one is Sn 59-61%;
Part percentage by weight is Bi 0.01-1.0%;
Part percentage by weight is Sb 0.01-2.0%;
Part percentage by weight is Ge 0.005-1.0%;
Part percentage by weight is In 0.005-1.50%;
Part percentage by weight is that Pb is surplus.
beneficial effect:
(1) its characteristic has good solder fluidity.Improve solderability on welding silicon chip.
(2) add micro-Ge element and impelled solar energy ageing resistance in natural environment, can extend the service life of solar electrical energy generation unit.
(3) added bismuth element and made after copper strips is zinc-plated, tin coating surface-brightening is clean and tidy, smooth, without defects such as burrs.
(4) added antimony element, it has strengthened weld strength and tin coating surface brightness.
(5) add anti-oxidant ashbury metal, closed tin solder liquid level and reduce in a large number slag ash, improved quality of coating.
Detailed description of the invention
A kind of tin solder of anti-aging welding tin coating, its invention main points are to have its tin coating of use procedure that welding tin solder is converted into electric energy at solar energy on silicon chip battery plate to have aging-resistant functional characteristic.Can improve service life energetically.
(1) alloying element Sn, the Bi of tin solder, Sb, Ge, In, Pb, (SnP+Ga) composition.
(2) composition mass percent is
Sn59-61% Bi0.01-1.0% Sb0.01-2.0%
Ge0.005-1.0% In0.005-1.0% Pb is surplus
(3) this tin solder method of manufacturing technology takes following smelting process step to complete.
As the high-melting-point non-ferrous metal element in alloy composition must take intermediate alloy smelting process to implement, concrete technical measures are as follows:
(1) Sn, Sb intermediate alloy proportioning are Sn50% Sb50%, and the smelting furnace of Sn, Sb alloy is medium-frequency induction furnace.First rise to >700 DEG C by dissolving rear liquid temperature in the tin pot of the pure tin ingot input electric furnace of content >99.95%, then drop into through breaking dry #1 star antimony ingot into pieces.In high temperature tin liquor, and constantly stir with dry waddy, short with antimony slab fusing,, through stirring, scum all after fusing until antimony slab, ingot casting is through assay, and it could be for subsequent use after answering >49.5% containing Sb composition.
(2) proportioning of Sn Ge intermediate alloy is Sn 99% Ge1.0%, in view of the fusing point of Ge element is 960 DEG C and its physical property has the Determination of Rare-Expensive Elements of easy distillation, thus there is particular/special requirement at smelting process, could be by its chemical composition stability.
The smelting furnace of Sn Ge alloy is also induction middle frequency furnace.First the pure tin ingot of content >99.95% is dropped in the pincers pot of induction middle frequency furnace.After all melting, liquid temperature rises to 1100 DEG C.And drag for the scum silica frost of detin liquid, must drop into potassium oxide and be about 10m/m thickness in tin liquor as its amount of coverture.In the time that tin liquor temperature arrives 1100 DEG C, the pure germanium ingot of >99.99% content is clamped with instrument, invested in high molten tin liquor and melt, until all melted.Then stir Sn Ge with pure titanium rod and add up to, impel chemical composition stability even.And after calmness in >30 minute, remove potassium oxide coverture remnants on liquid level.After purification, stir 3 minutes, ingot casting is for subsequent use again.
(3) at the smelting synthesis technique that has prepared its overall tin solder after Sn Sb and Sn Ge intermediate alloy.Smelting furnace uses can be temperature automatically controlled, the electric furnace of automatic stirring function.Ashbury metal melt is 1000 kilograms, and process first drops into <99.95% lead pig.Throw in >99.95% tin slab above, can prevent that tin slab cooling from can reduce again energy resource consumption, plays preheat function.Temperature control is 320-350 DEG C.Make Sn Sb element in conjunction with stable through automatic stirring >15 minute, then except removing slag after ash drops into anti-oxidant ashbury metal again to enter after Sn Sb alloy melting---pure Bi must melt under liquid---after the fusing of Sn Ge intermediate alloy---pure In(indium grain) all after fusing, must after >15 minute, drag for removing dross ash and add (SnP+Ga) alloy by automatic stirring.After being incubated calm >30 minute, stir 5 minutes 320-350 DEG C of alloy liquid temperature, ingot casting completes tin solder product again.
Claims (1)
1. a scolding tin material for anti-aging photovoltaic welding belt, is characterized in that its metallic element is formed by Sn, Bi, Sb, Ge, In, Pb, and part percentage by weight is Sn 59-61%;
Part percentage by weight is Bi 0.01-1.0%;
Part percentage by weight is Sb 0.01-2.0%;
Part percentage by weight is Ge 0.005-1.0%;
Part percentage by weight is In 0.005-1.50%;
Part percentage by weight is that Pb is surplus;
Part percentage by weight is SnPGa(1.0 ‰-1.2 ‰) oxidation-resistant alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310098397.8A CN104070299A (en) | 2013-03-26 | 2013-03-26 | Tin solder of anti-ageing photovoltaic solder strip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310098397.8A CN104070299A (en) | 2013-03-26 | 2013-03-26 | Tin solder of anti-ageing photovoltaic solder strip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104070299A true CN104070299A (en) | 2014-10-01 |
Family
ID=51592122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310098397.8A Pending CN104070299A (en) | 2013-03-26 | 2013-03-26 | Tin solder of anti-ageing photovoltaic solder strip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104070299A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104801877A (en) * | 2015-04-28 | 2015-07-29 | 太仓巨仁光伏材料有限公司 | Soldering flux for confluence strap of solar cell module and preparation method of soldering flux |
CN104889592A (en) * | 2015-04-28 | 2015-09-09 | 太仓巨仁光伏材料有限公司 | Solder for solar cell module interconnector |
CN104979417A (en) * | 2015-06-29 | 2015-10-14 | 同享(苏州)电子材料科技有限公司 | Light reflecting welding strip and solar assembly |
WO2017101436A1 (en) * | 2015-12-18 | 2017-06-22 | 王能青 | Alloy solder, and preparation method therefor and use thereof |
CN107520553A (en) * | 2016-06-22 | 2017-12-29 | 江苏傅鑫泰光电科技有限公司 | A kind of photovoltaic welding belt processing technology |
CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
CN108274147A (en) * | 2017-12-22 | 2018-07-13 | 占卫君 | A kind of efficient cryogenic welding, preparation method and photovoltaic module |
CN108555472A (en) * | 2017-12-29 | 2018-09-21 | 西安泰力松新材料股份有限公司 | A kind of photovoltaic welding belt solder and preparation method thereof |
WO2022033323A1 (en) * | 2020-08-10 | 2022-02-17 | 苏州阿特斯阳光电力科技有限公司 | Welding strip, photovoltaic assembly having same, and method for processing welding strip |
CN114227056A (en) * | 2021-12-28 | 2022-03-25 | 昆山市天和焊锡制造有限公司 | High-temperature-resistant antioxidant soldering tin material |
CN114248037A (en) * | 2021-12-28 | 2022-03-29 | 昆山市天和焊锡制造有限公司 | High-oxidation-resistance lead-free soldering tin material |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2216834A (en) * | 1988-03-17 | 1989-10-18 | Toyota Motor Corp | Soldering material |
JPH02187295A (en) * | 1989-01-17 | 1990-07-23 | Nippon Arumitsuto Kk | High-strength solder alloy |
EP0639426A1 (en) * | 1993-03-03 | 1995-02-22 | Nihon Almit Kabushiki Kaisha | High-strength soldering alloy |
CN1110203A (en) * | 1993-11-09 | 1995-10-18 | 松下电器产业株式会社 | Solder |
GB2319039A (en) * | 1996-11-05 | 1998-05-13 | Samsung Electronics Co Ltd | Solder alloy |
CN101011782A (en) * | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
CN101120109A (en) * | 2004-10-15 | 2008-02-06 | 爱尔发加热有限公司 | Solder alloy |
WO2009051240A1 (en) * | 2007-10-17 | 2009-04-23 | Ishikawa Metal, Co., Ltd. | Lead-free soft solder |
-
2013
- 2013-03-26 CN CN201310098397.8A patent/CN104070299A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2216834A (en) * | 1988-03-17 | 1989-10-18 | Toyota Motor Corp | Soldering material |
JPH02187295A (en) * | 1989-01-17 | 1990-07-23 | Nippon Arumitsuto Kk | High-strength solder alloy |
EP0639426A1 (en) * | 1993-03-03 | 1995-02-22 | Nihon Almit Kabushiki Kaisha | High-strength soldering alloy |
CN1110203A (en) * | 1993-11-09 | 1995-10-18 | 松下电器产业株式会社 | Solder |
GB2319039A (en) * | 1996-11-05 | 1998-05-13 | Samsung Electronics Co Ltd | Solder alloy |
CN101120109A (en) * | 2004-10-15 | 2008-02-06 | 爱尔发加热有限公司 | Solder alloy |
CN101011782A (en) * | 2007-01-24 | 2007-08-08 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
WO2009051240A1 (en) * | 2007-10-17 | 2009-04-23 | Ishikawa Metal, Co., Ltd. | Lead-free soft solder |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104889592A (en) * | 2015-04-28 | 2015-09-09 | 太仓巨仁光伏材料有限公司 | Solder for solar cell module interconnector |
CN104801877A (en) * | 2015-04-28 | 2015-07-29 | 太仓巨仁光伏材料有限公司 | Soldering flux for confluence strap of solar cell module and preparation method of soldering flux |
CN104979417A (en) * | 2015-06-29 | 2015-10-14 | 同享(苏州)电子材料科技有限公司 | Light reflecting welding strip and solar assembly |
CN104979417B (en) * | 2015-06-29 | 2017-01-04 | 同享(苏州)电子材料科技有限公司 | Reflective solder strip and solar components |
WO2017101436A1 (en) * | 2015-12-18 | 2017-06-22 | 王能青 | Alloy solder, and preparation method therefor and use thereof |
CN107520553A (en) * | 2016-06-22 | 2017-12-29 | 江苏傅鑫泰光电科技有限公司 | A kind of photovoltaic welding belt processing technology |
CN108274147A (en) * | 2017-12-22 | 2018-07-13 | 占卫君 | A kind of efficient cryogenic welding, preparation method and photovoltaic module |
CN108161271A (en) * | 2017-12-27 | 2018-06-15 | 北京康普锡威科技有限公司 | A kind of SnPbBiSb systems low temperature enhancing solder and preparation method thereof |
CN108161271B (en) * | 2017-12-27 | 2021-06-01 | 北京康普锡威科技有限公司 | SnPbBiSb series low-temperature reinforced solder and preparation method thereof |
CN108555472A (en) * | 2017-12-29 | 2018-09-21 | 西安泰力松新材料股份有限公司 | A kind of photovoltaic welding belt solder and preparation method thereof |
WO2022033323A1 (en) * | 2020-08-10 | 2022-02-17 | 苏州阿特斯阳光电力科技有限公司 | Welding strip, photovoltaic assembly having same, and method for processing welding strip |
CN114227056A (en) * | 2021-12-28 | 2022-03-25 | 昆山市天和焊锡制造有限公司 | High-temperature-resistant antioxidant soldering tin material |
CN114248037A (en) * | 2021-12-28 | 2022-03-29 | 昆山市天和焊锡制造有限公司 | High-oxidation-resistance lead-free soldering tin material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104070299A (en) | Tin solder of anti-ageing photovoltaic solder strip | |
CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
CN101380700A (en) | Tin bismuth cuprum series leadless solder and preparation method thereof | |
CN101417375B (en) | Leadless welding alloy for welding electronic elements | |
CN105195915A (en) | Low-temperature lead-free solder alloy | |
CN104070300A (en) | Silver-contained tin solder for photovoltaic solder strips | |
CN1895838B (en) | Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation | |
CN101780607A (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
CN101831574A (en) | Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof | |
JP2012121053A (en) | Lead free soldering alloy containing zinc as principal component | |
CN103028863A (en) | High-anti-oxidation lead-free solder | |
CN102581507A (en) | Tin, zinc and bismuth multi-element eutectic lead-free solder and preparation method | |
CN102174676A (en) | Preparation method for stannum, indium and stibium series lead-free solder tinning copper strip used for solar battery | |
CN104070302A (en) | Leadless solder for photovoltaic solder strips | |
CN103706967A (en) | Solder and welding method | |
CN103243234A (en) | Serial low-silver and lead-free solder for electronic packaging soft soldering and preparation method thereof | |
CN102500946A (en) | Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same | |
CN101988165B (en) | High-temperature oxidation resistant lead-free tin-coated alloy | |
CN102152022A (en) | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance | |
CN101927410A (en) | Sn-Ag-Zn-Bi-Cr lead-free solder | |
CN105149809B (en) | It is a kind of suitable for antioxidant of SnAgCu or SnCu solders and preparation method thereof | |
WO2007082459A1 (en) | Lead-free solder and its preparation method | |
CN101690995A (en) | Low-temperature lead-free solder | |
CN102994795B (en) | The copper-removing method of Sn-Cu-Ni lead-free solder and PCB production method | |
CN103978319A (en) | Lead-free solder used for manufacturing piezoresistor and preparation method of lead-free solder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141001 |