JPH02187295A - High-strength solder alloy - Google Patents
High-strength solder alloyInfo
- Publication number
- JPH02187295A JPH02187295A JP591389A JP591389A JPH02187295A JP H02187295 A JPH02187295 A JP H02187295A JP 591389 A JP591389 A JP 591389A JP 591389 A JP591389 A JP 591389A JP H02187295 A JPH02187295 A JP H02187295A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- solder alloy
- solder
- balance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 27
- 239000000956 alloy Substances 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 23
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 5
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 5
- 229910052797 bismuth Inorganic materials 0.000 claims abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はきびしい条件下で用いられる諸機械や諸装置に
おける接合用としてのはんだ合金に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder alloy for joining in various machines and devices used under severe conditions.
（従来の技術］
δ種機械や諸装置は、種々複雑な環境条件下で使用され
るため、たとえば、そのテスト条件の１つとしてプラス
１５０℃、マイナス５０℃というような高温と低温の湯
度区間を操り返すというようなきびしい温度変化に耐え
ることが要求されている。このように温度変化の激しい
ところで、接合用として従来の５ｎ−Ｐｂはんだ合金を
用いると、はんだ合金自体と被接合部との間における熱
膨張係数の相違などにより、はんだ自体にクラックが入
ってくる。というのは一般にはんだ自体の強度が被接合
材のそれより低いからである。(Prior art) Since δ class machines and various devices are used under various complex environmental conditions, one of the test conditions is, for example, high and low hot water temperatures such as +150°C and -50°C. It is required to withstand severe temperature changes such as when reversing a section.When conventional 5n-Pb solder alloy is used for joining in places where temperature changes are severe like this, the solder alloy itself and the parts to be joined are Cracks occur in the solder itself due to differences in thermal expansion coefficients between the materials.This is because the strength of the solder itself is generally lower than that of the materials to be joined.
あるいは、はんだ接合部にクラックが入ってくることも
ある。Alternatively, cracks may appear in the solder joints.
［発明が解決しようとする課題］
」−述のような事情があるため、今後のはんだ合金とし
ては、苛酷条件に耐える機械的強度の高いものが要求さ
れている。このため、引張り強さの高いものが要求され
るのは、もちろんのことであるが、これと同時に靭（じ
ん）性の高いことも大切である。[Problems to be Solved by the Invention] - Due to the above-mentioned circumstances, future solder alloys are required to have high mechanical strength and withstand harsh conditions. For this reason, it goes without saying that a material with high tensile strength is required, but it is also important to have high toughness.
なお、はんだづけのためには低融点が要求されるので、
そのベース金１．・１としては５ｎ−Ｐｂ共共合合金集
品温度１８２℃）を用いた。Furthermore, since a low melting point is required for soldering,
The base money 1.・For 1, a 5n-Pb conjugate alloy assembly temperature of 182° C.) was used.
［課題を解決するための手段］
はんだ合金のベースとして従来の５ｎ−Ｐｂ共共合合金
採用し、これらにＧｅ５Ｂｉ％Ｓｂなどを０〜３．５％
の範囲内で添７１０し、これらの合金について弓張り強
さ（ｋｇ／＋ｎｍ’ｆ）と伸び（％）を求めた。[Means for solving the problem] A conventional 5n-Pb conjugate alloy is used as the base of the solder alloy, and 0 to 3.5% of Ge5Bi%Sb etc. are added to these.
The bowing strength (kg/+nm'f) and elongation (%) were determined for these alloys.
このため、５ｎ−Ｇｅ−ＰｂＳＳｒｒ−Ｇｅ−３ｂ−Ｐ
ｂ、５ｎ−Ｇｅ−Ｂｉ−Ｐｂ、５ｎ−Ｇｅ−Ｉ３ｉ−３
ｂ−Ｐｂに至る３元ないし５元系合金に亘るものについ
て上述の試験を行った。Therefore, 5n-Ge-PbSSrr-Ge-3b-P
b, 5n-Ge-Bi-Pb, 5n-Ge-I3i-3
The above tests were conducted on ternary to quinary alloys ranging from b-Pb.
［実験結果］
はんだ合金のような軟質材料であると、その強度は引張
速度によって７４なる。第１図は６０％５ｎ−４０％Ｐ
ｂ合金について引張り速度による引張り強さの変化を見
たもので、引張り速１ｆｆｉが大きくなるにつれて強度
は大きくなるが、１００Ｍ／ｍｉｂでほぼ一定となる。[Experimental Results] When a soft material such as a solder alloy is used, its strength varies by 74 depending on the tensile speed. Figure 1 shows 60%5n-40%P
This figure shows the change in tensile strength of Alloy B depending on the tensile speed. As the tensile speed 1ffi increases, the strength increases, but becomes almost constant at 100 M/mib.
このため、以後の引張り速度は１００ｍ＋ｎ／ｍｉｎの
一定とした。Therefore, the subsequent pulling speed was kept constant at 100 m+n/min.
とくに本発明では、低温と高温におけるはんだ合金の強
度を問題にしているので、従来考えられているはんだ合
金にＧＯとして０．３％と０．８％を添加したときの温
度による変化をみた。この結果は第１表にみるものであ
る。In particular, in the present invention, the strength of the solder alloy at low and high temperatures is an issue, so we looked at the changes with temperature when 0.3% and 0.8% of GO were added to the conventionally considered solder alloy. The results are shown in Table 1.
なお、この表は、（１）Ｓｎ６０−Ｐｂ４０％はんだ、
（２） Ｓ ｂｌ、 ０％、残部Ｓ ｎ６Ｏ−Ｐｂ４０
％はんだ合金、（３）Ｓｂ＋、ｏ％、Ｂｉｉ、０％、残
部どしては５ｎ６０−Ｐｂ４０％組成に０．３％と０．
８％のＧｅを添加したときの機械的強度の変化を示し、
ている、２［実施例］
第１表の結果によると、Ｓｂｉ、０％、Ｂｉｌ、［１％
、Ｇｅ０．８％、残部組成とｌ−、、、−＋：５ｎ６０
−Ｐｂ４０％合金を含むものが一４０〜１３０℃におい
て最高強度を持つでいるので、このはんだ合金について
はんだづけ性をチエツクしてみた結県、従来のはんだと
同様な作業条件でも十分な好成績を得た。In addition, this table shows (1) Sn60-Pb40% solder,
(2) Sbl, 0%, remainder Sn6O-Pb40
% solder alloy, (3) Sb+, o%, Bii, 0%, and the balance is 0.3% and 0.0% in the 5n60-Pb40% composition.
Showing the change in mechanical strength when 8% Ge is added,
2 [Example] According to the results in Table 1, Sbi, 0%, Bil, [1%
, Ge0.8%, balance composition and l-,,,-+:5n60
- Since the alloy containing 40% Pb has the highest strength at 140 to 130°C, we checked the solderability of this solder alloy and obtained good results even under the same working conditions as conventional solder. Ta.
第１吹Ｉははんだ合＆ （６ＱＳｎ−４０Ｐｌ＞）の引
張り強さに及ばず引張り速度の影響、第２図は５ｎ−Ｐ
ｉ−８ｂ−Ｇｅ−Ｐｂ ＠金の一４０’−１３０”Ｃに
おＩＪる弓張り強さを示している。
Ｊ、た、第２図は試験ｄ！度−４０″′〜Ｉ００°Ｃに
おけるＳｂ１．（１、Ｂｉｌ、０． Ｇｅ１．０゜残部
組成Ｓ ｎ６０−Ｐ ｂ４Ｑ％合金と５ｎ６０−Ｐｂ４
０％合金の強度変化を、バし′Ｃいる。
この両者合金の機械的強度の平目迎は、いちちるしい。
また、引張り強さと同時に伸び仏につい′Ｃも測定を行
ったが、Ｇｅとして３０％を越すといちぢるしくこの値
が低下して実用化に不適当であるので、Ｇｅ含有ｍの上
限は３％以下とした。The first blow I was less than the tensile strength of solder joint &(6QSn-40Pl>), and the effect of tensile speed was 5n-P.
i-8b-Ge-Pb @Kinichi 40'-130"C shows the IJ bow strength. Sb1. (1, Bil, 0. Ge1.0゜Remainder composition Sn60-P b4Q% alloy and 5n60-Pb4
The change in strength of the 0% alloy is shown below. The mechanical strength of these two alloys is remarkable. In addition, we also measured the tensile strength and C of the elongated steel, but if the Ge content exceeds 30%, this value decreases significantly and is inappropriate for practical use, so the upper limit of the Ge content m is It was set to 3% or less.
Claims (1)
マニウム、０〜２．５％アンチモン、０〜２．５％ビス
マス、残部鉛よりなる高強度はんだ合金。A high-strength solder alloy consisting of 30 to 70% tin, 0.1 to 3.0% germanium, 0 to 2.5% antimony, 0 to 2.5% bismuth, and the balance lead by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP591389A JPH02187295A (en) | 1989-01-17 | 1989-01-17 | High-strength solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP591389A JPH02187295A (en) | 1989-01-17 | 1989-01-17 | High-strength solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02187295A true JPH02187295A (en) | 1990-07-23 |
Family
ID=11624137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP591389A Pending JPH02187295A (en) | 1989-01-17 | 1989-01-17 | High-strength solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02187295A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020257A1 (en) * | 1993-03-03 | 1994-09-15 | Nihon Almit Co., Ltd. | High-strength soldering alloy |
| JP2014018859A (en) * | 2012-07-24 | 2014-02-03 | Nippon Genma:Kk | Solder |
| CN104070299A (en) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | Tin solder of anti-ageing photovoltaic solder strip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61273296A (en) * | 1985-05-29 | 1986-12-03 | Taruchin Kk | Corrosion resistant solder alloy |
| JPS62230493A (en) * | 1986-03-31 | 1987-10-09 | Taruchin Kk | Solder alloy |
-
1989
- 1989-01-17 JP JP591389A patent/JPH02187295A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61273296A (en) * | 1985-05-29 | 1986-12-03 | Taruchin Kk | Corrosion resistant solder alloy |
| JPS62230493A (en) * | 1986-03-31 | 1987-10-09 | Taruchin Kk | Solder alloy |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994020257A1 (en) * | 1993-03-03 | 1994-09-15 | Nihon Almit Co., Ltd. | High-strength soldering alloy |
| JP2014018859A (en) * | 2012-07-24 | 2014-02-03 | Nippon Genma:Kk | Solder |
| CN104070299A (en) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | Tin solder of anti-ageing photovoltaic solder strip |
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