JPH106075A - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- JPH106075A JPH106075A JP17421096A JP17421096A JPH106075A JP H106075 A JPH106075 A JP H106075A JP 17421096 A JP17421096 A JP 17421096A JP 17421096 A JP17421096 A JP 17421096A JP H106075 A JPH106075 A JP H106075A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- lead
- free solder
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は無鉛ハンダ合金に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead-free solder alloy.
【０００２】[0002]
【従来の技術】ハンダ付けは接合技術として長い歴史を
持ち、ハンダ合金としてはその化学組成がＳｎが６３重
量％、Ｐｂが３７重量％のものがいわゆる共晶ハンダと
して広く用いられている。2. Description of the Related Art Soldering has a long history as a joining technique, and a solder alloy having a chemical composition of 63% by weight of Sn and 37% by weight of Pb is widely used as a so-called eutectic solder.
【０００３】しかし、最近の世界的な環境に対する関心
の高まりを背景に、ハンダの含有する鉛の毒性が問題と
なってきた。とくにアメリカではこの問題を深刻にとら
えており、法的側面から鉛の使用を規制する動きがあ
る。ヨーロッパにおいても状況は同様であり、無鉛ハン
ダ合金への転換は世界的趨勢であるといえる。[0003] However, with the recent growing interest in the global environment, the toxicity of lead contained in solder has become a problem. The United States, in particular, takes this issue seriously and there is a move to regulate the use of lead from a legal perspective. The situation is similar in Europe, and the switch to lead-free solder alloys is a global trend.
【０００４】このような社会状況の変化に対応して無鉛
ハンダに関する多くの研究がなされ、現在いくつかの無
鉛ハンダ合金が市場に供給されている。現在市場で入手
可能な無鉛ハンダ合金は、おおよそＳｎ−Ａｇ系、Ｓｎ
−Ｂｉ系、Ｓｎ−Ｚｎ系、Ｓｎ−Ｉｎ系に分類され、ど
れも主要構成部分としてＳｎを採用しており、従来より
使用されているＰｂの代替元素としてＢｉやＩｎなどを
使用しているものである。これらの無鉛ハンダ合金は、
従来のＳｎ−Ｐｂ系ハンダ合金と比較して劣る特性を改
善するために各種の元素を微量に添加するなどして改善
がはかられているが、Ｓｎ−Ｐｂ系ハンダ合金の代替ハ
ンダ合金としての導入は進んでいないのが現状である。Many studies on lead-free solder have been made in response to such changes in social conditions, and some lead-free solder alloys are currently being supplied to the market. Lead-free solder alloys currently available on the market are roughly Sn-Ag based, Sn
-Bi-, Sn-Zn-, and Sn-In-based, all of which employ Sn as a main component and use Bi, In, or the like as an alternative element to Pb conventionally used. Things. These lead-free solder alloys
In order to improve the inferior properties as compared with the conventional Sn-Pb-based solder alloys, various elements have been added in trace amounts to improve the properties. However, as an alternative solder alloy to the Sn-Pb-based solder alloy, At present, the introduction of is not progressing.
【０００５】なお、先行技術文献としては、特開平７−
４００７９号公報，特開平７−３２１８８号公報等があ
る。As a prior art document, Japanese Patent Application Laid-Open No.
No. 40079 and Japanese Patent Application Laid-Open No. 7-32188.
【０００６】[0006]
【発明が解決しようとする課題】現在供給されている無
鉛ハンダ合金に対しては、以下のような課題が指摘され
ている。 （１） 溶融温度が高く、リフロー温度も高くなるた
め、従来の生産設備を変更したり、あるいは搭載される
電子部品の耐熱設計を変更する必要がある。 （２） Ｂｉを多く含む場合、溶融温度域が非常に広く
なり、その結果、ハンダ合金の固化過程においてハンダ
付け部の凝固時間差からスルーホール部品あるいはリー
ド付部品の接合部が剥がれるリフトオフ（ｌｉｆｔ−ｏ
ｆｆ）現象が生じる。 （３） 可塑性が低く、鋳造後の圧延等の成形加工がで
きない。 （４） ぬれ性が悪く、ハンダ付け性とハンダ付け強度
において劣る。The following problems have been pointed out with respect to currently supplied lead-free solder alloys. (1) Since the melting temperature is high and the reflow temperature is high, it is necessary to change the conventional production equipment or the heat-resistant design of the electronic components to be mounted. (2) When a large amount of Bi is contained, the melting temperature range becomes very wide, and as a result, in the solidification process of the solder alloy, the lift-off (lift- o
ff) The phenomenon occurs. (3) Plasticity is low, and molding such as rolling after casting cannot be performed. (4) Poor wettability and poor solderability and soldering strength.
【０００７】本発明の目的は、リフトオフ現象の発生を
抑止するとともに、可塑性が高くかつぬれ性の良い無鉛
ハンダ合金を提供することにある。An object of the present invention is to provide a lead-free solder alloy having high plasticity and good wettability while suppressing the occurrence of a lift-off phenomenon.
【０００８】[0008]
【課題を解決するための手段】本発明の無鉛ハンダ合金
は、Ａｇが１．０〜６．０重量％、Ｃｕが０．０５〜
３．０重量％、Ｇｅが０．０３〜２．０重量％、残部分
がＳｎよりなることを特徴とする。さらに、Ｂｉを０．
５〜４．０重量％添加したことを特徴とする。According to the lead-free solder alloy of the present invention, the content of Ag is 1.0 to 6.0% by weight and the content of Cu is 0.05 to 6.0%.
It is characterized in that 3.0% by weight, 0.03 to 2.0% by weight of Ge, and the rest are Sn. Further, Bi is set to 0.
It is characterized in that it is added in an amount of 5 to 4.0% by weight.
【０００９】[0009]
【発明の実施の形態】本発明の一実施の形態に係る無鉛
ハンダ合金は、Ｓｎ９６．５重量％Ａｇ３．５重量％合
金、あるいはＳｎ９８．０重量％Ａｇ２．０重量％合金
を基材として、Ｃｕ６０重量％Ｇｅ４０重量％合金を添
加して組成したＳｎ−Ａｇ−Ｃｕ−Ｇｅ４元合金からな
る。Ｓｎ９６．５重量％Ａｇ３．５重量％合金は、従来
より使用されている無鉛高温ハンダであり、ＳｎとＡｇ
の共晶合金である。また、Ｓｎ９８．０重量％Ａｇ２．
０重量％合金は、低価格化のために特性を余り変動させ
ない範囲でＡｇの含有量を若干減じたものである。これ
らとＣｕとＧｅの共晶合金であるＣｕ６０重量％Ｇｅ４
０重量％合金を１０００：１〜１００：５の割合で配合
し合金を組成した。BEST MODE FOR CARRYING OUT THE INVENTION A lead-free solder alloy according to an embodiment of the present invention comprises a base material of Sn 96.5 wt% Ag 3.5 wt% alloy or Sn 98.0 wt% Ag 2.0 wt% alloy. It is composed of a Sn-Ag-Cu-Ge quaternary alloy composed by adding a Cu 60 wt% Ge 40 wt% alloy. The Sn 96.5 wt% Ag 3.5 wt% alloy is a lead-free high-temperature solder conventionally used, and is composed of Sn and Ag.
Eutectic alloy. In addition, Sn 98.0% by weight of Ag2.
The 0% by weight alloy has a slightly reduced Ag content within a range that does not significantly change its properties for cost reduction. Cu and 60% by weight of Ge4, which is a eutectic alloy of Cu and Ge
A 0 wt% alloy was blended at a ratio of 1000: 1 to 100: 5 to form an alloy.
【００１０】さらに、Ｓｎ９６．５重量％Ａｇ３．５重
量％合金、あるいはＳｎ９８．０重量％Ａｇ２．０重量
％合金とＣｕ６０重量％Ｇｅ４０重量％合金を１００：
１の割合で配合した合金に対して、Ｂｉを０．５〜４．
０重量％の配分で添加した。Further, an alloy of 96.5% by weight of Sn, 3.5% by weight of Ag, or an alloy of 98.0% by weight of Ag, 2.0% by weight of Ag and an alloy of 60% by weight of Cu and 40% by weight of Ge are mixed with 100
Bi was added to the alloy blended at a ratio of 1 to 0.5 to 4.0.
0% by weight was added.
【００１１】Ｓｎ９６．５重量％Ａｇ３．５重量％合
金、あるいはＳｎ９８．０重量％Ａｇ２．０重量％合金
は、従来より使用されている無鉛高温ハンダ合金であ
り、Ｓｎ−Ｐｂ系ハンダ合金の代替無鉛ハンダ合金の有
力候補のひとつとして考えられているが、融点が２２１
度Ｃ程度と高いことおよびぬれ性と鋳造後の機械加工性
に難点があることから、そのままではなく種々の元素を
添加し、Ｓｎ−Ａｇ系無鉛ハンダ合金を構成している。The Sn 96.5 wt% Ag 3.5 wt% alloy or the Sn 98.0 wt% Ag 2.0 wt% alloy is a conventionally used lead-free high-temperature solder alloy and is an alternative to the Sn-Pb based solder alloy. Although it is considered as one of the promising candidates for lead-free solder alloy, its melting point is 221.
The Sn-Ag lead-free solder alloy is formed by adding various elements instead of as it is because of the high degree C and the difficulty in wettability and machinability after casting.
【００１２】本実施の形態においても、Ｓｎ９６．５重
量％Ａｇ３．５重量％合金、あるいはＳｎ９８．０重量
％Ａｇ２．０重量％合金を基材として複数の元素を添加
し、無鉛ハンダ合金を組成した。Also in this embodiment, a lead-free solder alloy is prepared by adding a plurality of elements based on a Sn 96.5 wt% Ag 3.5 wt% alloy or a Sn 98.0 wt% Ag 2.0 wt% alloy as a base material. did.
【００１３】Ｇｅは、Ｓｎ、Ａｇと３元共晶型合金を組
成することから、その添加により溶融温度を低下させる
ことができる。Since Ge is composed of Sn and Ag and a ternary eutectic alloy, the melting temperature can be lowered by adding Ge.
【００１４】Ｃｕは、それを添加することによって合金
の結晶粒を微細化する性質があり、このことにより合金
の可塑性が増し、鋳造後の機械加工性を向上させること
ができる。また、その添加による溶融温度の上昇に対す
る影響を最小限にするために、Ｇｅと共晶型合金を組成
するようにＣｕとＧｅの構成比を６０：４０とした。[0014] Cu has the property of making the crystal grains of the alloy finer by adding it, whereby the plasticity of the alloy is increased and the machinability after casting can be improved. In addition, in order to minimize the influence of the addition on the rise in melting temperature, the composition ratio of Cu and Ge was set to 60:40 so as to form a eutectic alloy with Ge.
【００１５】したがって、Ｓｎ−Ａｇ−Ｃｕ−Ｇｅ４元
合金の製造法は、Ｓｎ９６．５重量％Ａｇ３．５重量％
合金、あるいはＳｎ９８．０重量％Ａｇ２．０重量％合
金にＣｕ６０重量％Ｇｅ４０重量％合金を添加配合する
という方法を採用した。Therefore, the method for producing the Sn—Ag—Cu—Ge quaternary alloy is as follows: Sn 96.5% by weight Ag 3.5% by weight
A method was employed in which 60% by weight of Cu and 40% by weight of Ge were added to an alloy or an alloy of 98.0% by weight of Sn and 2.0% by weight of Ag.
【００１６】この方法により製造するＳｎ−Ａｇ−Ｃｕ
−Ｇｅ４元合金のＳｎ９６．５重量％Ａｇ３．５重量％
合金、あるいはＳｎ９８．０重量％Ａｇ２．０重量％合
金とＣｕ６０重量％Ｇｅ４０重量％合金の配合比は１０
０：５程度（Ｇｅの構成比２．０重量％）までで、それ
以上Ｃｕ６０重量％Ｇｅ４０重量％合金を添加しても溶
融温度は低下しない。[0016] Sn-Ag-Cu produced by this method
-Sn 96.5% by weight of Ge quaternary alloy 3.5% by weight of Ag
Alloy or 98.0% by weight of Sn, 2.0% by weight of Ag and 60% by weight of Cu, 40% by weight of Ge,
The melting temperature does not decrease even if an alloy containing 60% by weight of Cu and 40% by weight of Ge is added more than about 0: 5 (the composition ratio of Ge is 2.0% by weight).
【００１７】Ｂｉは、その添加により溶融温度を低下さ
せることができる。さらに、Ｂｉには、表面張力を低下
させる効果があるため、ぬれ性、広がり性を改善するこ
ともできる。ただし、Ｂｉは脆い性質があり、添加し過
ぎると合金自体も脆くなり可塑性を低下させるため、ま
た前述のように、Ｂｉを多く含む場合、固相線温度がＳ
ｎ−Ｂｉ共晶点温度である１３９度Ｃ付近に現われ溶融
温度域が非常に広くなり、その結果ハンダ合金の固化過
程においてハンダ付け部の凝固時間差からスルーホール
部品あるいはリード付部品の接合部が剥がれるリフトオ
フ現象が生じる可能性があるため、その添加量は４．０
重量％を限界とした。Bi can reduce the melting temperature by its addition. Further, Bi has an effect of lowering the surface tension, so that the wettability and the spreadability can be improved. However, Bi has a brittle property, and if added too much, the alloy itself becomes brittle and lowers plasticity. As described above, when Bi is contained in a large amount, the solidus temperature becomes S.
Appearing around 139 ° C., which is the n-Bi eutectic point temperature, the melting temperature range becomes very wide. As a result, during the solidification process of the solder alloy, the joint of the through-hole component or the leaded component is formed due to the solidification time difference of the soldering part. Since the peeling-off lift-off phenomenon may occur, the amount of addition is 4.0.
% By weight.
【００１８】なお、本発明の無鉛ハンダ合金の基材とす
るＳｎ−Ａｇ合金は、ＳｎとＡｇの構成比が９９．０：
１．０ないし９４．０：６．０の範囲にあれば、本実施
の形態において使用したＳｎ９６．５重量％Ａｇ３．５
重量％合金、あるいはＳｎ９８．０重量％Ａｇ２．０重
量％合金と同様に使用可能である。The Sn—Ag alloy used as the base material of the lead-free solder alloy of the present invention has a composition ratio of Sn and Ag of 99.0:
If it is in the range of 1.0 to 94.0: 6.0, Sn 96.5 wt% Ag 3.5 used in the present embodiment is used.
% Alloy or Sn 98.0% Ag Ag 2.0% alloy by weight.
【００１９】[0019]
【実施例】表１に示す合金組成の試料それぞれについて
示差熱分析により液相線温度、固相線温度を測定し、そ
の結果を同じく表１に示す。EXAMPLES The liquidus temperature and the solidus temperature of the samples having the alloy compositions shown in Table 1 were measured by differential thermal analysis, and the results are also shown in Table 1.
【００２０】[0020]
【表１】 [Table 1]
【００２１】表１からわかるように、Ｓｎ９６．５重量
％Ａｇ３．５重量％合金にＣｕ６０重量％Ｇｅ４０重量
％合金を添加することにより、液相線温度は５度Ｃ程度
低下し、さらにＢｉを添加することにより、液相線温度
は２１０度Ｃ程度まで下げることが可能である。この温
度は、英国のＩｎｔｅｒｎａｔｉｏｎａｌ ＴｉｎＲｅ
ｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅが提案した無鉛ハン
ダ合金ＡＬＬＯＹ・Ｈ（Ｓｎ９０Ｂｉ７．５Ａｇ２Ｃｕ
０．５）などと同水準であり、既知の無鉛ハンダ合金の
なかでは十分実用可能な部類に属する。As can be seen from Table 1, the addition of 60 wt% Cu and 40 wt% Ge to the 96.5 wt% Ag 3.5 wt% alloy reduces the liquidus temperature by about 5 ° C. and further reduces Bi. By adding, the liquidus temperature can be lowered to about 210 ° C. This temperature is based on the International TinRe
The lead-free solder alloy ALLOY.H (Sn90Bi7.5Ag2Cu) proposed by search Institute
0.5), etc., and belongs to a class that is sufficiently practicable among known lead-free solder alloys.
【００２２】また、固相線温度は２００度Ｃ以上であ
り、溶融温度域が広いことから発生するリフトオフ現象
が生じる懸念はない。The solidus temperature is 200 ° C. or higher, and there is no concern that a lift-off phenomenon occurs due to a wide melting temperature range.
【００２３】鋳造後の機械加工性を比較するために圧延
試験を行い、表２に示す合金組成の試料を圧延加工した
ときの耳ワレ異常の発生を同じく表２に示す。試験は試
料をそれぞれ溶解温度４５０度Ｃで直径８０ｍｍの円筒
状に鋳込み、これを油圧押出機により厚さ３．０ｍｍ、
幅３２ｍｍのテープ状にし、それを圧延機を用いて厚み
を３．０ｍｍから段階的に０．０５ｍｍまで薄くした。A rolling test was performed to compare the machinability after casting, and the occurrence of cracks in the ears when the samples having the alloy compositions shown in Table 2 were rolled is also shown in Table 2. In the test, each sample was cast into a cylinder having a melting temperature of 450 ° C. and a diameter of 80 mm, and this was cast to a thickness of 3.0 mm with a hydraulic extruder.
The tape was formed into a tape having a width of 32 mm, and the thickness was gradually reduced from 3.0 mm to 0.05 mm using a rolling mill.
【００２４】[0024]
【表２】 [Table 2]
【００２５】試験結果から本発明による無鉛ハンダ合金
は可塑性が高く、鋳造後の機械加工性に優れることが判
明した。ＡＬＬＯＹ・Ｈは、１．０ｍｍまで圧延した段
階で耳ワレが激しく、それ以上の圧延が不可能であった
のに対して、本発明による無鉛ハンダ合金は０．０５ｍ
ｍまでの圧延で耳ワレは全く発生しなかった。また、Ｂ
ｉを添加した場合もその構成比が３．０重量％以内であ
れば、０．０５ｍｍまでの圧延であれば全く問題はな
い。Ｂｉの構成比が４．０重量％になると０．１ｍｍま
で圧延した段階で耳ワレが発生し、５．０重量％になる
と０．３４ｍｍで耳ワレが発生していることから、Ｂｉ
の添加は４．０重量％が実用上の限界といえる。From the test results, it was found that the lead-free solder alloy according to the present invention has high plasticity and excellent machinability after casting. ALLOY H had severe cracks at the stage of rolling to 1.0 mm, and further rolling was impossible, whereas the lead-free solder alloy according to the present invention had a thickness of 0.05 m.
No cracking occurred at the time of rolling to m. Also, B
Even when i is added, if the composition ratio is within 3.0% by weight, there is no problem if the rolling is performed up to 0.05 mm. When the composition ratio of Bi becomes 4.0% by weight, cracks occur at the stage of rolling to 0.1 mm, and when the composition ratio of Bi becomes 5.0% by weight, cracks occur at 0.34mm.
Can be said to be 4.0% by weight as a practical limit.
【００２６】表３に広がり試験の結果を示す。広がり試
験は、ＲＡタイプのフラックスを塗布した銅板に試料約
３０ｍｇを載せ、液相線温度＋５０度Ｃの温度で３０秒
間加熱し、銅板上に広がらせた。冷却後、ハンダの高さ
をマイクロメーターにより測定し、ＪＩＳ−Ｚ３１９７
に準じて広がり率を計算した。結果より、本発明による
無鉛ハンダ合金は、Ｓｎ９６．５重量％Ａｇ３．５重量
％合金に比べて広がり率が約１ポイント向上しているこ
とがわかる。Table 3 shows the results of the spread test. In the spread test, about 30 mg of a sample was placed on a copper plate coated with an RA type flux, heated at a temperature of liquidus temperature + 50 ° C. for 30 seconds, and spread on the copper plate. After cooling, the height of the solder was measured with a micrometer, and was measured according to JIS-Z3197.
The spread rate was calculated according to. From the results, it can be seen that the lead-free solder alloy according to the present invention has an expansion rate improved by about one point as compared with the Sn 96.5 wt% Ag 3.5 wt% alloy.
【００２７】[0027]
【表３】 [Table 3]
【００２８】なお、上記実施例においては、Ｓｎ９８．
０重量％Ａｇ２．０重量％合金にＣｕ６０重量％Ｇｅ４
０重量％合金を添加した場合、およびさらにＢｉを添加
した場合については詳しい実験値を示さなかったが、Ｓ
ｎ９６．５重量％Ａｇ３．５重量％合金にＣｕ６０重量
％Ｇｅ４０重量％合金を添加した場合、およびさらにＢ
ｉを添加した場合とほぼ同様になることは明らかであ
る。また、ＳｎとＡｇの構成比が９９．０：１．０ない
し９４．０：６．０の範囲のＳｎ−Ａｇ合金を基材とし
て使用した場合も、Ｓｎ９６．５重量％Ａｇ３．５重量
％合金を基材として使用した場合とほぼ同様の実験結果
が得られることは容易に類推される。In the embodiment described above, Sn98.
0 wt% Ag 2.0 wt% alloy 60 wt% Ge4
Detailed experimental values were not shown for the case where the 0 wt% alloy was added and the case where Bi was further added.
n6.5% by weight Ag3.5% by weight alloy added with 60% by weight Cu 40% by weight alloy, and further B
Obviously, the result is almost the same as when i is added. Also, when a Sn—Ag alloy having a composition ratio of Sn and Ag in the range of 99.0: 1.0 to 94.0: 6.0 is used as a base material, Sn 96.5 wt% Ag 3.5 wt% It is easily presumed that almost the same experimental results can be obtained as when the alloy is used as the base material.
【００２９】[0029]
【発明の効果】以上説明したように、本発明の無鉛ハン
ダ合金によれば、Ｓｎ−Ａｇ−Ｃｕ−Ｇｅ４元合金を組
成したので、溶融温度域が狭く、スルーホール部品ある
いはリード付部品の接合部が剥がれるリフトオフ現象が
生じるのを未然に防止することができるという効果があ
る。As described above, according to the lead-free solder alloy of the present invention, since the Sn-Ag-Cu-Ge quaternary alloy is composed, the melting temperature range is narrow, and the joining of through-hole parts or leaded parts is performed. There is an effect that it is possible to prevent a lift-off phenomenon in which a portion is peeled off from occurring.
【００３０】また、Ｃｕを含むことにより、可塑性が高
くなり、鋳造後の圧延等の成形加工容易になるという効
果がある。The inclusion of Cu has the effect of increasing the plasticity and facilitating forming such as rolling after casting.
【００３１】さらに、Ｂｉを添加することにより、溶融
時の表面張力が降下してぬれ性が良くなり、ハンダ付け
性とハンダ付け強度が向上するという効果がある。Further, by adding Bi, there is an effect that the surface tension at the time of melting is lowered, the wettability is improved, and the solderability and the soldering strength are improved.
Claims (3)
０．０５〜３．０重量％、Ｇｅが０．０３〜２．０重量
％、残部分がＳｎよりなることを特徴とする無鉛ハンダ
合金。1. Ag is 1.0 to 6.0% by weight, Cu is 0.05 to 3.0% by weight, Ge is 0.03 to 2.0% by weight, and the balance is Sn. Lead-free solder alloy.
ないし９４．０：６．０、ＣｕとＧｅの構成比が６０：
４０である請求項１記載の無鉛ハンダ合金。2. The composition ratio of Sn and Ag is 99.0: 1.0.
To 94.0: 6.0, and the composition ratio of Cu and Ge is 60:
The lead-free solder alloy according to claim 1, wherein the number is 40.
求項１または２記載の無鉛ハンダ合金。3. The lead-free solder alloy according to claim 1, wherein Bi is added in an amount of 0.5 to 4.0% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17421096A JPH106075A (en) | 1996-06-13 | 1996-06-13 | Lead-free solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17421096A JPH106075A (en) | 1996-06-13 | 1996-06-13 | Lead-free solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH106075A true JPH106075A (en) | 1998-01-13 |
Family
ID=15974656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17421096A Pending JPH106075A (en) | 1996-06-13 | 1996-06-13 | Lead-free solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH106075A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1177367A (en) * | 1997-09-05 | 1999-03-23 | Murata Mfg Co Ltd | Solder composition |
| EP0985486A1 (en) * | 1998-03-26 | 2000-03-15 | Nihon Superior Sha Co., Ltd | Leadless solder |
| DE10003665C2 (en) * | 1999-01-29 | 2003-06-26 | Fuji Electric Co Ltd | Solder Legierug |
| US6649127B2 (en) | 1996-12-17 | 2003-11-18 | Sony Chemicals Corp | Lead-free solder material having good wettability |
| KR100424662B1 (en) * | 2001-04-30 | 2004-03-24 | 주식회사 듀텍 | Alloying compositions of Lead-Free Solder |
| JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
| CN1295054C (en) * | 2003-08-20 | 2007-01-17 | 中国科学院金属研究所 | Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
| EP1785498A2 (en) | 2005-11-15 | 2007-05-16 | Hitachi Metals, Ltd. | Solder alloy, solder ball, and solder joint using the same |
-
1996
- 1996-06-13 JP JP17421096A patent/JPH106075A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6649127B2 (en) | 1996-12-17 | 2003-11-18 | Sony Chemicals Corp | Lead-free solder material having good wettability |
| JPH1177367A (en) * | 1997-09-05 | 1999-03-23 | Murata Mfg Co Ltd | Solder composition |
| EP0985486A1 (en) * | 1998-03-26 | 2000-03-15 | Nihon Superior Sha Co., Ltd | Leadless solder |
| EP0985486A4 (en) * | 1998-03-26 | 2003-01-02 | Nihon Superior Sha Co Ltd | Leadless solder |
| DE10003665C2 (en) * | 1999-01-29 | 2003-06-26 | Fuji Electric Co Ltd | Solder Legierug |
| KR100424662B1 (en) * | 2001-04-30 | 2004-03-24 | 주식회사 듀텍 | Alloying compositions of Lead-Free Solder |
| JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
| CN1295054C (en) * | 2003-08-20 | 2007-01-17 | 中国科学院金属研究所 | Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
| EP1785498A2 (en) | 2005-11-15 | 2007-05-16 | Hitachi Metals, Ltd. | Solder alloy, solder ball, and solder joint using the same |
| EP1785498A3 (en) * | 2005-11-15 | 2007-11-28 | Hitachi Metals, Ltd. | Solder alloy, solder ball, and solder joint using the same |
| KR100813574B1 (en) | 2005-11-15 | 2008-03-17 | 히타치 긴조쿠 가부시키가이샤 | Solder alloy, solder ball and solder joint using the same |
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