JPH0825050B2 - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- JPH0825050B2 JPH0825050B2 JP5164270A JP16427093A JPH0825050B2 JP H0825050 B2 JPH0825050 B2 JP H0825050B2 JP 5164270 A JP5164270 A JP 5164270A JP 16427093 A JP16427093 A JP 16427093A JP H0825050 B2 JPH0825050 B2 JP H0825050B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder alloy
- solder
- alloy
- free solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、鉛を含まない半田付け
用の無含鉛半田合金に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead-free solder alloy containing no lead for soldering.
【０００２】[0002]
【従来の技術】従来、長い間、半田付け用の半田合金と
してはＳｎ−Ｐｂ２元系共晶合金（Ｓｎ６４重量％、Ｐ
ｂ３６重量％）が主流であり、最近のエレクトロニクス
技術の進展につれて、このＳｎ−Ｐｂ２元系合金にＢ
ｉ，Ｉｎ，Ｓｂ，Ａｇ，Ｇｅ等を合金させたいわゆる
『強力半田合金』が多数特許出願され、その一部はすで
に実用化されている。この他、表面実装技術（ＳＭＴ）
に欠くことのできない半田ペーストに用いられている半
田粉末も、Ｓｎ−Ｐｂ系２元系共晶合金をベースにした
ものがほとんどであり、特に、Ａｇのマイグレーション
を防ぐための添加合金（例えば、Ｓｎが６２重量％、Ｐ
ｂが３６重量％、Ａｇが２重量％）にしても鉛を３０％
以上含んでいる。2. Description of the Related Art Conventionally, as a solder alloy for soldering for a long time, a Sn-Pb binary eutectic alloy (Sn 64% by weight, P
b36% by weight) is the mainstream, and with the recent progress of electronic technology, B has been added to this Sn-Pb binary alloy.
A number of so-called "strong solder alloys", which are alloys of i, In, Sb, Ag, Ge, etc., have been applied for patents, and some of them have already been put to practical use. In addition, surface mount technology (SMT)
Most of the solder powder used in the solder paste, which is indispensable for the above, is based on a Sn-Pb binary eutectic alloy, and in particular, an additive alloy for preventing migration of Ag (for example, 62 wt% Sn, P
b is 36% by weight and Ag is 2% by weight)
The above is included.
【０００３】最近では、半田付け作業による部品の損傷
を防ぐため、低融点半田が特に音響器機用として利用さ
れ始めているが、これはＰｂが４３重量％、Ｓｎが４３
重量％、Ｂｉが１４重量％から成り、溶融点１６３℃
で、３０重量％以上の鉛成分は半田組成の上で欠くこと
ができなかった。以上のことからみて、半田付けのため
のＳｎ−Ｐｂ系共晶合金が歴史的にも長い間、半田合金
としての主流を占めてきたといえる。しかし、現在、環
境問題が世界的にうるさくなり、鉛公害ということが取
り上げられるようになってきている。 ことのほか、ア
メリカとヨーロッパではこの問題が深刻で、無含鉛半田
合金への転換運動が進められつつあり、かつ、ヨーロッ
パではＥＣ委員会が、特に、活躍している。 特に、ア
メリカで緊急問題になっているのは、例えば廃電球の回
収で、電球の口金取り付けに半田（Ｓｎ−Ｐｂ系）を用
いているということで、鉛を含む古電球の回収について
のトラブルが頻発している現状であるという。このよう
な社会状況の変化に対応するために、無含鉛半田合金の
研究は急がれていたが、現在のところこの無含鉛半田合
金として提唱されているものは、後掲する表１に示され
る。Recently, low-melting-point solder has begun to be used especially for acoustic instruments in order to prevent damage to parts due to soldering work. This is because Pb is 43% by weight and Sn is 43.
Wt%, Bi 14 wt%, melting point 163 ℃
Then, the lead component of 30% by weight or more was indispensable in the solder composition. From the above, it can be said that the Sn-Pb-based eutectic alloy for soldering has dominated as a solder alloy for a long time historically. However, nowadays, environmental problems have become annoying worldwide and lead pollution has come to be taken up. In addition, this problem is serious in the United States and Europe, and the movement to convert to lead-free solder alloys is being promoted, and the EC committee is particularly active in Europe. One of the most urgent problems in the United States is the collection of used light bulbs, for example, because solder (Sn-Pb type) is used to attach the base of the light bulb. It is said that the current situation is frequent. In order to respond to such changes in social conditions, research on lead-free solder alloys has been urgently performed. However, what is currently proposed as this lead-free solder alloy is Table 1 below. Shown in.
【０００４】[0004]
【発明が解決しようとする課題】この表１の従来例３に
示されるアメリカで広く売られている市販品の無含鉛半
田合金は、Ａｇ，Ｂｉ，Ｃｕの何れも５重量％以下、総
計（Ａｇ＋Ｂｉ＋Ｃｕ）１０重量％以下である。 何れ
にしろ表１に示される従来の無含鉛半田合金はＳｎまた
はＩｎベースのものであり、これにＡｇ，Ｂｉ，Ｓｂを
を添加した２元または３元系合金が主である。 しか
し、これらは何れもＰｂを含まないだけに半田付け性、
つまり、半田付けの容易性および半田付け強度において
劣っているという問題点があった。そこで、本発明は、
半田付け性および半田付け強度に優れた無含鉛半田合金
を提供することを目的とする。The commercially available lead-free solder alloy, which is widely sold in the United States and is shown in Conventional Example 3 in Table 1 below, contains Ag, Bi and Cu in an amount of 5% by weight or less in total. (Ag + Bi + Cu) 10% by weight or less. In any case, the conventional lead-free solder alloy shown in Table 1 is based on Sn or In, and is mainly a binary or ternary alloy in which Ag, Bi and Sb are added. However, since these do not contain Pb, solderability,
That is, there is a problem that the ease of soldering and the soldering strength are poor. Therefore, the present invention is
An object is to provide a lead-free solder alloy having excellent solderability and soldering strength.
【０００５】[0005]
【課題を解決するための手段】本発明は、Ｃｏが、０．
０５〜５．０重量％、Ｂｉ，Ａｇの内の１種類以上を合
計して０．５〜２．０重量％、Ｓｂ，Ｉｎ，Ｇａの内の
１種類以上を合計して１．５〜５．５重量％、残部が、
Ｓｎより成ることを特徴とする無含鉛半田合金である。According to the present invention, Co is 0.
05-5.0 wt%, one or more of Bi and Ag are combined.
0.5 to 2.0% by weight in total of Sb, In, Ga
1.5 to 5.5% by weight in total of one or more kinds, the balance is
It is a lead-free solder alloy characterized by comprising Sn.
【０００６】[0006]
【作用】Ｓｎに各種元素を添加してこの半田付け特性を
チェックする実験を行った結果、コバルトを添加する
と、半田付け性、つまり、半田付けの容易性を良好とす
ると同時に、半田付け強度を高めることを知った。 特
に、電球と口金との接合に用いる半田材料としてガラス
部分を下にし、口金を上にかぶせる製造工程において、
昇温しても半田が下にたれることのないようにするため
にはＳｎ−Ｃｏ半田合金の利用が効果的であることを知
った。 この時、顕微鏡組織を見てみると、Ｓｎマトリ
ックスの中にＳｎ−Ｃｏ金属間化合物、例えば、ＣｏＳ
ｎ，ＣｏＳｎ２が微細に分散していることがわかった。
化合物分散が半田合金の組成を強化しているのであ
る。この時の溶融温度は２５０℃程度であったが、この
無含鉛半田合金を従来のＳｎ−Ｐｂ系共晶合金（溶融温
度は１９０℃〜２００℃）の代わりに用いるためには、
その溶融温度を１９０℃〜２００℃程度にしなければな
らない。 このため、Ｓｎ−Ｃｏ合金（例えばＣｏ１．
５重量％、残りＳｎ）に、Ｂｉ，Ａｇの内の１種類以上
を合計して０．５〜２．０重量％、Ｓｂ，Ｉｎ，Ｇａの
内の１種類以上を合計して１．５〜５．５重量％にし、
これら元素の添加量を適宜調整合金することによって、
その融点を１９０℃〜２６０℃の範囲内に変化させるこ
とができる。 もちろん、Ｓｂ、Ｂｉ、Ｉｎ、Ａｇ、Ｇ
ａの添加は、半田融点調整を可能にするが、これらの添
加は半田合金としての特性、すなわち、無含鉛というこ
との他、半田付け性、および、半田強度を高めるという
大きな特徴を有する。As a result of conducting an experiment to check the soldering characteristics by adding various elements to Sn, when cobalt is added, the solderability, that is, the ease of soldering is improved, and at the same time, the soldering strength is improved. I learned to raise it. In particular, in the manufacturing process where the glass part is down as the solder material used for joining the light bulb and the base, and the base is covered on the top,
It has been found that the use of Sn-Co solder alloy is effective for preventing the solder from dripping down even if the temperature is raised. At this time, looking at the microscopic structure, an Sn-Co intermetallic compound such as CoS is present in the Sn matrix.
It was found that n and CoSn 2 were finely dispersed.
The compound dispersion enhances the composition of the solder alloy. The melting temperature at this time was about 250 ° C., but in order to use this lead-free solder alloy instead of the conventional Sn—Pb-based eutectic alloy (melting temperature 190 ° C. to 200 ° C.),
The melting temperature must be about 190 ° C to 200 ° C. Therefore, a Sn—Co alloy (for example, Co1.
5% by weight, the rest Sn), one or more of Bi and Ag
0.5 to 2.0 wt% of Sb, In, Ga
Add one or more of them to 1.5 to 5.5% by weight ,
By appropriately adjusting the alloying amount of these elements,
Its melting point can be varied within the range of 190 ° C to 260 ° C. Of course, Sb, Bi, In, Ag, G
Addition of “a” enables adjustment of the melting point of the solder, but these additions have the major characteristic of improving solderability and solder strength in addition to the characteristics as a solder alloy, that is, lead-free.
【０００７】[0007]
【実施例】以下、本発明をその実施例に基づいて説明す
る。The present invention will be described below based on its embodiments.
【０００８】表１に示されるように、実施例１として
は、Ｃｏが０．８重量％、Ｓｂが１．０重量％，Ｂｉが
０．５重量％、Ｇａが０．５重量％、残部がＳｎから成
る半田合金の溶融温度（液相線）は２００℃で、従来の
Ｓｎ−Ｐｂ系共晶合金と比較して、半田付け強度、すな
わち、引張り強度も６．５ｋｇｆ／ｍｍ２であり、従来
例の半田合金の４ｋｇｆ／ｍｍ２よりも優れていること
が判明した。その他の実施例２〜４も表１に示される。
もともと、半田合金はその使用条件によっていろいろの
要求が出されるのが普通であるが、多元系合金である
と、その成分選択によってその要求に応じられるという
利点ある。As shown in Table 1, in Example 1 , 0.8 wt% of Co, 1.0 wt% of Sb, 0.5 wt% of Bi, 0.5 wt% of Ga, and the balance Has a melting temperature (liquidus) of 200 ° C., and has a soldering strength, that is, a tensile strength of 6.5 kgf / mm 2 as compared with a conventional Sn—Pb eutectic alloy. It was found that it is superior to the conventional solder alloy of 4 kgf / mm 2 . Other Examples 2 to 4 are also shown in Table 1.
Originally, solder alloys are usually required to meet various requirements depending on the use conditions, but multi-component alloys have the advantage of meeting the requirements by selecting their components.
【０００９】[0009]
【発明の効果】本発明は、以上説明したように、無含鉛
で、半田付け性、および、半田付け強度が高いという効
果を奏する。As described above, the present invention has the effect of being lead-free and having high solderability and soldering strength.
【表１】 [Table 1]
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−179385（ＪＰ，Ａ) 特開 平２−70033（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-179385 (JP, A) JP-A-2-70033 (JP, A)
Claims (1)
Ａｇの内の１種類以上を合計して０．５〜２．０重量
％、Ｓｂ，Ｉｎ，Ｇａの内の１種類以上を合計して１．
５〜５．５重量％、残部が、Ｓｎより成ることを特徴と
する無含鉛半田合金。1. Co is 0.05 to 5.0% by weight, Bi,
0.5 to 2.0 weight by summing one or more types of Ag
%, One or more of Sb, In, and Ga are totaled to be 1.
A lead-free solder alloy characterized by comprising 5 to 5.5 wt% and the balance being Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5164270A JPH0825050B2 (en) | 1993-06-08 | 1993-06-08 | Lead-free solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5164270A JPH0825050B2 (en) | 1993-06-08 | 1993-06-08 | Lead-free solder alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06344180A JPH06344180A (en) | 1994-12-20 |
| JPH0825050B2 true JPH0825050B2 (en) | 1996-03-13 |
Family
ID=15789903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5164270A Expired - Fee Related JPH0825050B2 (en) | 1993-06-08 | 1993-06-08 | Lead-free solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0825050B2 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2805595B2 (en) * | 1994-11-02 | 1998-09-30 | 三井金属鉱業株式会社 | Lead-free solder alloy |
| DE4443459C2 (en) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Lead-free soft solder and its use |
| KR0168964B1 (en) * | 1995-06-30 | 1999-01-15 | 이형도 | Pb free solder |
| JPH0970687A (en) * | 1995-07-04 | 1997-03-18 | Toyota Central Res & Dev Lab Inc | Leadless solder alloy |
| DE69632866T2 (en) | 1995-09-29 | 2005-07-14 | Matsushita Electric Industrial Co., Ltd., Kadoma | LEAD-FREE LOT |
| US6224690B1 (en) * | 1995-12-22 | 2001-05-01 | International Business Machines Corporation | Flip-Chip interconnections using lead-free solders |
| JP3220635B2 (en) | 1996-02-09 | 2001-10-22 | 松下電器産業株式会社 | Solder alloy and cream solder |
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| GB9701819D0 (en) * | 1997-01-29 | 1997-03-19 | Alpha Fry Ltd | Lead-free tin alloy |
| GB9823349D0 (en) * | 1998-10-27 | 1998-12-23 | Glacier Vandervell Ltd | Bearing material |
| US6503338B1 (en) | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
| US6660226B1 (en) | 2000-08-07 | 2003-12-09 | Murata Manufacturing Co., Ltd. | Lead free solder and soldered article |
| TWI279281B (en) * | 2004-05-20 | 2007-04-21 | Theresa Inst Co Ltd | Lead-free solder alloy and preparation thereof |
| DE102009054068A1 (en) | 2009-11-20 | 2011-05-26 | Epcos Ag | Solder material for fixing an outer electrode in a piezoelectric component and piezoelectric component with a solder material |
| CA2892420C (en) * | 2014-06-24 | 2016-08-09 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| WO2015198497A1 (en) | 2014-06-24 | 2015-12-30 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
| ES2764394T3 (en) * | 2014-12-15 | 2020-06-03 | Senju Metal Industry Co | Solder alloy for galvanization and electronic components |
| CN110125571A (en) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | A kind of high intensity low-temperature lead-free solder and its solder(ing) paste |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8807730D0 (en) * | 1988-03-31 | 1988-05-05 | Cookson Group Plc | Low toxicity soldering compositions |
| JP2667689B2 (en) * | 1988-12-29 | 1997-10-27 | 株式会社徳力本店 | Low melting point Ag solder |
-
1993
- 1993-06-08 JP JP5164270A patent/JPH0825050B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06344180A (en) | 1994-12-20 |
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