HK1007319A1 - Polyether-ester amide and permanently antistatic resin composition - Google Patents

Polyether-ester amide and permanently antistatic resin composition Download PDF

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Publication number
HK1007319A1
HK1007319A1 HK98106553A HK98106553A HK1007319A1 HK 1007319 A1 HK1007319 A1 HK 1007319A1 HK 98106553 A HK98106553 A HK 98106553A HK 98106553 A HK98106553 A HK 98106553A HK 1007319 A1 HK1007319 A1 HK 1007319A1
Authority
HK
Hong Kong
Prior art keywords
weight
polyether
acid
ester
set forth
Prior art date
Application number
HK98106553A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1007319B (en
Inventor
Fukumoto Tadao
Yano Kazuhisa
Iwamoto Masatoshi
Original Assignee
Toray Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries, Inc. filed Critical Toray Industries, Inc.
Publication of HK1007319B publication Critical patent/HK1007319B/en
Publication of HK1007319A1 publication Critical patent/HK1007319A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/04Antistatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Epoxy Resins (AREA)
HK98106553A 1987-08-13 1998-06-25 Polyether-ester amide and permanently antistatic resin composition HK1007319A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP20212287 1987-08-13
JP202122/87 1987-08-13
JP202123/87 1987-08-13
JP20212387 1987-08-13

Publications (2)

Publication Number Publication Date
HK1007319B HK1007319B (en) 1999-04-09
HK1007319A1 true HK1007319A1 (en) 1999-04-09

Family

ID=26513196

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98106553A HK1007319A1 (en) 1987-08-13 1998-06-25 Polyether-ester amide and permanently antistatic resin composition

Country Status (8)

Country Link
US (1) US5096995A (en:Method)
EP (1) EP0303489B1 (en:Method)
JP (1) JPH01144417A (en:Method)
KR (2) KR970004933B1 (en:Method)
CA (1) CA1302623C (en:Method)
DE (1) DE3853180T2 (en:Method)
ES (1) ES2070853T3 (en:Method)
HK (1) HK1007319A1 (en:Method)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5574104A (en) * 1990-01-05 1996-11-12 The B. F. Goodrich Company Chain extended low molecular weight polyoxiranes and electrostatic dissipating blend compositions based thereon
JP3164218B2 (ja) * 1990-01-05 2001-05-08 ザ ビー.エフ.グッドリッチ カンパニー 静電気に用いるための連鎖延長された低分子量ポリオキシラン
ATE156172T1 (de) * 1990-06-01 1997-08-15 Atochem Elf Sa Zusammensetzungen thermoplastischer elastomere auf der basis von polyamiden und modifizierten polyolefinen, geformte oder extrudierte körper, filme und verbundmaterialien hergestellt aus diesen
US5272206A (en) * 1990-06-18 1993-12-21 General Electric Company Vulcanized blends of thermoplastic elastomers and EPDM rubber and method for making
US5489667A (en) * 1991-03-20 1996-02-06 Atochem Deutschland Gmbh Polyetheresteramides and process for making and using the same
US5298558A (en) * 1991-06-25 1994-03-29 The Geon Company Electrostatic dissipative blends of PVC, polyetheramides and an impact modifier
US5652326A (en) * 1993-03-03 1997-07-29 Sanyo Chemical Industries, Ltd. Polyetheresteramide and antistatic resin composition
US6284839B1 (en) 1995-12-29 2001-09-04 The B.F. Goodrich Company Blends of thermoplastic polymers, electrostatic dissipative polymers and electrostatic dissipative enhancers
JP3283743B2 (ja) * 1996-01-11 2002-05-20 帝人株式会社 シリコンウェーハーキャリア
JP3051344B2 (ja) * 1996-09-11 2000-06-12 本田技研工業株式会社 静電塗装性付与兼塗膜の耐水密着性改良剤及び樹脂成形品
JP3546614B2 (ja) * 1996-10-07 2004-07-28 ソニー株式会社 ディスクカートリッジ
WO1999064512A1 (fr) * 1997-01-31 1999-12-16 Nippon A & L Inc. Composition de resine pour enduction electrostatique
US6268030B1 (en) * 1997-04-04 2001-07-31 Teijin Limited Silicon wafer carrier
EP1881034A1 (en) 1997-04-04 2008-01-23 Teijin Limited Silicon wafer carrier
WO1999033659A1 (fr) * 1997-12-24 1999-07-08 Elf Atochem S.A. Structure multicouches comprenant un materiau recouvert par un copolymere a blocs polyamides et blocs hydrophiles
JPH11199773A (ja) * 1997-12-24 1999-07-27 E I Du Pont De Nemours & Co 帯電防止ポリマー組成物およびその成形品
JPH11240995A (ja) * 1998-02-24 1999-09-07 Techno Polymer Kk 熱可塑性樹脂組成物
EP0985704B1 (en) * 1998-09-11 2003-11-05 Mitsui Chemicals, Inc. Nitrile resin composition
JP4054151B2 (ja) * 1999-01-18 2008-02-27 日本ポリペンコ株式会社 帯電防止性ポリエステルアミド樹脂成形体
US6673873B1 (en) 1999-08-25 2004-01-06 Cyro Industries Electrostatic-dissipative multipolymer compositions
US6525134B1 (en) * 1999-09-09 2003-02-25 Atofina Antistatic acrylic polymer compositions
SA01220282B1 (ar) 2000-08-29 2006-12-05 سيبا سبشيالتي كيميكالز هولدينج انك طرية لتقليل ترسب الاتربة على اشرطة films بولي اوليفين polyolefin
EP1184416A1 (en) * 2000-08-29 2002-03-06 Ciba SC Holding AG Method for reducing dust deposition on polyolefin films
CN1912045B (zh) * 2000-10-04 2010-12-15 三菱树脂株式会社 抗静电片材
BR0115962B1 (pt) 2000-12-06 2010-06-01 fibra ou filamento tingìvel, fibra bicomponente, textura tecida ou não-tecida, método para conceder tingibilidade permanente a fibras ou filamentos de poliolefina ou texturas tecidas ou não-tecidas produzidas a partir dos mesmos e artigo de fabricação.
CA2512664C (en) * 2003-01-24 2012-02-07 Ciba Speciality Chemicals Holding Inc. Antistatic composition
JP2005097598A (ja) * 2003-08-29 2005-04-14 Sanyo Chem Ind Ltd 帯電防止性樹脂組成物
CN1611533B (zh) * 2003-08-29 2010-05-05 三洋化成工业株式会社 抗静电性树脂组成物
US20080248227A1 (en) * 2004-03-31 2008-10-09 Norifumi Sumimoto Thermoplastic Resin Composition and Resin Molding
WO2007023865A1 (ja) * 2005-08-25 2007-03-01 Techno Polymer Co., Ltd. ゴム強化樹脂、制電性樹脂組成物、成形体及び積層体
ATE552288T1 (de) 2007-07-25 2012-04-15 Ems Patent Ag Transparente polyamid-elastomere
WO2011036109A1 (en) 2009-09-23 2011-03-31 Basf Se Synergistic antistatic compositions
US20110152808A1 (en) 2009-12-21 2011-06-23 Jackson David M Resilient absorbent coform nonwoven web
US9260808B2 (en) 2009-12-21 2016-02-16 Kimberly-Clark Worldwide, Inc. Flexible coform nonwoven web
JP5742076B2 (ja) * 2010-01-07 2015-07-01 テクノポリマー株式会社 透明熱可塑性樹脂組成物および樹脂成形品
EP2909267B1 (en) 2012-10-16 2023-07-19 Trinseo Europe GmbH Impact resistant transparent thermoplastic compositions
CN104479127B (zh) * 2014-12-12 2016-10-19 东华大学 一种己内酰胺水解聚合物及其水解聚合方法
WO2017040388A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Multilayer bottles with reduced permanent static effect for cosmetic packaging
US11052549B2 (en) 2015-12-10 2021-07-06 Milwaukee Electric Tool Corporation Knife

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4182842A (en) * 1977-08-08 1980-01-08 Eastman Kodak Company Poly(ester-amides)prepared from an aromatic dicarboxylic acid, ethylene glycol and a p-acylaminobenzoic acid
JPS6023435A (ja) * 1983-07-19 1985-02-06 Toray Ind Inc 制電性樹脂組成物
JPS6110411A (ja) * 1984-06-19 1986-01-17 Daicel Chem Ind Ltd 樹脂組成物
DE3542855A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyesteramide, deren herstellung und verwendung
FR2591607B1 (fr) * 1985-12-16 1988-03-18 Atochem Compositions thermoplastiques a base de polyetheramides et de copolymeres styrene-diene et leur procede de fabrication.

Also Published As

Publication number Publication date
CA1302623C (en) 1992-06-02
KR890003837A (ko) 1989-04-18
JPH0585571B2 (en:Method) 1993-12-08
DE3853180T2 (de) 1995-08-17
KR970004933B1 (ko) 1997-04-10
EP0303489A2 (en) 1989-02-15
ES2070853T3 (es) 1995-06-16
US5096995A (en) 1992-03-17
DE3853180D1 (de) 1995-04-06
JPH01144417A (ja) 1989-06-06
EP0303489A3 (en) 1990-10-31
KR970009429B1 (en) 1997-06-13
EP0303489B1 (en) 1995-03-01

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)