FR2770498B1 - Dispositif de transport de tranches de silicium pour semi-conducteurs - Google Patents

Dispositif de transport de tranches de silicium pour semi-conducteurs

Info

Publication number
FR2770498B1
FR2770498B1 FR9813123A FR9813123A FR2770498B1 FR 2770498 B1 FR2770498 B1 FR 2770498B1 FR 9813123 A FR9813123 A FR 9813123A FR 9813123 A FR9813123 A FR 9813123A FR 2770498 B1 FR2770498 B1 FR 2770498B1
Authority
FR
France
Prior art keywords
semiconductors
silicon wafers
transporting silicon
transporting
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9813123A
Other languages
English (en)
Other versions
FR2770498A1 (fr
Inventor
David L Nyseth
Sanjiv M Bhatt
Shawn Eggum
Brian S Wiseman
Michael S Adams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluoroware Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of FR2770498A1 publication Critical patent/FR2770498A1/fr
Application granted granted Critical
Publication of FR2770498B1 publication Critical patent/FR2770498B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Cable Accessories (AREA)
FR9813123A 1997-10-20 1998-10-20 Dispositif de transport de tranches de silicium pour semi-conducteurs Expired - Fee Related FR2770498B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95464097A 1997-10-20 1997-10-20

Publications (2)

Publication Number Publication Date
FR2770498A1 FR2770498A1 (fr) 1999-05-07
FR2770498B1 true FR2770498B1 (fr) 2000-06-16

Family

ID=25495730

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9813123A Expired - Fee Related FR2770498B1 (fr) 1997-10-20 1998-10-20 Dispositif de transport de tranches de silicium pour semi-conducteurs

Country Status (9)

Country Link
JP (1) JPH11204629A (fr)
KR (1) KR100830654B1 (fr)
CN (1) CN1165963C (fr)
DE (1) DE19848147A1 (fr)
FR (1) FR2770498B1 (fr)
HK (1) HK1023228A1 (fr)
IT (1) IT1303138B1 (fr)
NL (1) NL1010321C2 (fr)
SG (1) SG81942A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10151320B4 (de) * 2001-10-17 2006-02-09 Infineon Technologies Ag Scheibenträger
CN100374358C (zh) * 2001-11-27 2008-03-12 诚实公司 通过门形成接地线路的前开口式晶片容器
JP4146718B2 (ja) 2002-12-27 2008-09-10 ミライアル株式会社 薄板支持容器
JP4681221B2 (ja) * 2003-12-02 2011-05-11 ミライアル株式会社 薄板支持容器
JP4842879B2 (ja) * 2007-04-16 2011-12-21 信越ポリマー株式会社 基板収納容器及びそのハンドル
JP2009259951A (ja) * 2008-04-15 2009-11-05 Shin Etsu Polymer Co Ltd 基板収納容器
JP5078042B2 (ja) * 2009-06-08 2012-11-21 ゴールド工業株式会社 精密基板収納容器およびその製造方法
JP5120668B2 (ja) * 2009-06-08 2013-01-16 ゴールド工業株式会社 精密基板収納容器およびその製造方法
JP5449974B2 (ja) * 2009-10-16 2014-03-19 ゴールド工業株式会社 精密基板収納容器
JP2011249372A (ja) * 2010-05-24 2011-12-08 Shin Etsu Polymer Co Ltd 基板収納容器
JP5700434B2 (ja) * 2011-05-18 2015-04-15 信越ポリマー株式会社 ウェーハ収納容器
JP5921371B2 (ja) * 2012-07-13 2016-05-24 信越ポリマー株式会社 基板収納容器
KR102162366B1 (ko) 2014-01-21 2020-10-06 우범제 퓸 제거 장치
KR102281583B1 (ko) * 2014-01-21 2021-07-27 우범제 퓸 제거 장치
KR102223033B1 (ko) * 2014-04-29 2021-03-04 삼성전자주식회사 웨이퍼 수납장치
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
CN107706144A (zh) * 2017-09-14 2018-02-16 德淮半导体有限公司 晶圆清洗固定装置及清洗设备
KR102020294B1 (ko) * 2017-09-15 2019-09-11 (주)상아프론테크 슬롯 구조체 및 이를 포함하는 웨이퍼 보관 용기
TWI689030B (zh) * 2018-06-14 2020-03-21 家登精密工業股份有限公司 基板載具
CN109003928B (zh) * 2018-07-21 2021-03-09 江苏德尔科测控技术有限公司 一种硅片承载装置
KR200493303Y1 (ko) * 2018-12-27 2021-03-10 위아코퍼레이션 주식회사 웨이퍼 캐리어의 슬롯바
TWI727713B (zh) * 2020-03-23 2021-05-11 家登精密工業股份有限公司 光罩盒及其耐磨件
TWI751814B (zh) * 2020-09-22 2022-01-01 家登精密工業股份有限公司 支撐片狀物的中央支撐裝置及存放片狀物的儲存設備
KR102349499B1 (ko) * 2020-09-24 2022-01-07 우범제 사이드 스토리지

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492229A (en) * 1992-11-27 1996-02-20 Toshiba Ceramics Co., Ltd. Vertical boat and a method for making the same
JP3145252B2 (ja) * 1994-07-29 2001-03-12 淀川化成株式会社 基板支承用側板およびそれを用いたカセット
JPH0864669A (ja) * 1994-08-25 1996-03-08 Hitachi Cable Ltd ウエハボックス
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
US5534074A (en) * 1995-05-17 1996-07-09 Heraeus Amersil, Inc. Vertical boat for holding semiconductor wafers
JP3328763B2 (ja) * 1995-10-30 2002-09-30 エヌティティエレクトロニクス株式会社 縦型ウエハボートのウエハ支持構造
JPH1098096A (ja) * 1996-09-25 1998-04-14 Nippon Valqua Ind Ltd 半導体ウェハ用カセット

Also Published As

Publication number Publication date
SG81942A1 (en) 2001-07-24
KR100830654B1 (ko) 2008-11-11
DE19848147A1 (de) 1999-04-22
HK1023228A1 (en) 2000-09-01
NL1010321C2 (nl) 1999-09-08
ITTO980879A1 (it) 2000-04-16
IT1303138B1 (it) 2000-10-30
KR19990037214A (ko) 1999-05-25
FR2770498A1 (fr) 1999-05-07
CN1165963C (zh) 2004-09-08
NL1010321A1 (nl) 1999-04-21
CN1232289A (zh) 1999-10-20
JPH11204629A (ja) 1999-07-30

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Legal Events

Date Code Title Description
TP Transmission of property
PLFP Fee payment

Year of fee payment: 19

ST Notification of lapse

Effective date: 20180629