FR2725960B1 - Support de plaquettes, notamment de silicium semi-conducteur - Google Patents

Support de plaquettes, notamment de silicium semi-conducteur

Info

Publication number
FR2725960B1
FR2725960B1 FR9511276A FR9511276A FR2725960B1 FR 2725960 B1 FR2725960 B1 FR 2725960B1 FR 9511276 A FR9511276 A FR 9511276A FR 9511276 A FR9511276 A FR 9511276A FR 2725960 B1 FR2725960 B1 FR 2725960B1
Authority
FR
France
Prior art keywords
wafer support
semiconductor silicon
especially semiconductor
silicon
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9511276A
Other languages
English (en)
Other versions
FR2725960A1 (fr
Inventor
Shinichi Ohori
Tatsuaki Hirohata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of FR2725960A1 publication Critical patent/FR2725960A1/fr
Application granted granted Critical
Publication of FR2725960B1 publication Critical patent/FR2725960B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
FR9511276A 1994-10-06 1995-09-26 Support de plaquettes, notamment de silicium semi-conducteur Expired - Fee Related FR2725960B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24258194A JP2796502B2 (ja) 1994-10-06 1994-10-06 ウェーハ収納容器のウェーハ抑え

Publications (2)

Publication Number Publication Date
FR2725960A1 FR2725960A1 (fr) 1996-04-26
FR2725960B1 true FR2725960B1 (fr) 1998-04-03

Family

ID=17091198

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9511276A Expired - Fee Related FR2725960B1 (fr) 1994-10-06 1995-09-26 Support de plaquettes, notamment de silicium semi-conducteur

Country Status (5)

Country Link
JP (1) JP2796502B2 (fr)
KR (1) KR960015841A (fr)
DE (1) DE19537193A1 (fr)
FR (1) FR2725960B1 (fr)
GB (1) GB2293816B (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5711427A (en) * 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US6193090B1 (en) 1999-04-06 2001-02-27 3M Innovative Properties Company Reusable container
KR20010053787A (ko) * 1999-12-01 2001-07-02 마이클 디. 오브라이언 웨이퍼 핸들링장치
DE10151320B4 (de) * 2001-10-17 2006-02-09 Infineon Technologies Ag Scheibenträger
JP4903893B2 (ja) * 2003-12-02 2012-03-28 ミライアル株式会社 薄板支持容器用蓋体
KR100832702B1 (ko) * 2003-12-24 2008-05-28 동부일렉트로닉스 주식회사 반도체 웨이퍼 세정장치
US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
JP4606294B2 (ja) * 2005-09-27 2011-01-05 Ｏｋｉセミコンダクタ株式会社 ウエハキャリアとこれを用いた半導体装置の製造方法
WO2008056549A1 (fr) * 2006-11-07 2008-05-15 Shin-Etsu Polymer Co., Ltd. Récipient pour substrat
SG151129A1 (en) * 2007-09-26 2009-04-30 E Sun Prec Ind Co Ltd Container for reticle
DE102010005202B4 (de) * 2010-01-21 2020-04-09 Q-Cells Se Magazin für einen photovoltaischen Wafer- und/oder Zellstapel mit einem Magazineinsatz zur Aufnahme desselben
CN102582670A (zh) * 2011-10-17 2012-07-18 上海华力微电子有限公司 一种掩模板安全搬运推车
JP2016149492A (ja) * 2015-02-13 2016-08-18 ミライアル株式会社 基板収納容器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
IT1181778B (it) * 1985-05-07 1987-09-30 Dynamit Nobel Silicon Spa Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio
US5207324A (en) * 1991-03-08 1993-05-04 Fluoroware, Inc. Wafer cushion for shippers
JP2586364Y2 (ja) * 1992-12-28 1998-12-02 住友シチックス株式会社 輸送用ウェーハケース
JPH0679152U (ja) * 1993-04-22 1994-11-04 株式会社大八化成 半導体ウエーハ運搬用容器の構造
JP2908985B2 (ja) * 1994-07-19 1999-06-23 信越ポリマー株式会社 ウェーハ収納容器のウェーハ抑え

Also Published As

Publication number Publication date
DE19537193A1 (de) 1996-04-11
JP2796502B2 (ja) 1998-09-10
GB2293816A (en) 1996-04-10
GB9519637D0 (en) 1995-11-29
FR2725960A1 (fr) 1996-04-26
GB2293816B (en) 1998-06-10
KR960015841A (ko) 1996-05-22
JPH08107141A (ja) 1996-04-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080531