TWI751814B - 支撐片狀物的中央支撐裝置及存放片狀物的儲存設備 - Google Patents

支撐片狀物的中央支撐裝置及存放片狀物的儲存設備 Download PDF

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TWI751814B
TWI751814B TW109142017A TW109142017A TWI751814B TW I751814 B TWI751814 B TW I751814B TW 109142017 A TW109142017 A TW 109142017A TW 109142017 A TW109142017 A TW 109142017A TW I751814 B TWI751814 B TW I751814B
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supporting
support
central
height direction
sheets
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TW202212221A (zh
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邱銘乾
沈恩年
潘詠晉
林志銘
鍾承恩
李柏廷
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家登精密工業股份有限公司
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Abstract

一種支撐片狀物的中央支撐裝置及存放片狀物的儲存設備，支撐片狀物的中央支撐裝置包含：一殼體、複數支撐件及複數高度調整件，殼體沿高度方向設有複數分隔部，分隔部夾設形成複數支撐件容置槽，分隔部各自具有凹部，凹部的底面在高度方向上呈漸進變化，支撐件的一端分別連接於支撐件容置槽的底部，高度調整件分別設置於凹部中，高度調整件沿高度方向上的頂端支撐支撐件。存放片狀物的儲存設備包含前述的中央支撐裝置。本發明的支撐片狀物的中央支撐裝置及存放片狀物的儲存設備可調節支撐件的高度，使支撐件的前端維持在規定的範圍內。

Description

支撐片狀物的中央支撐裝置及存放片狀物的儲存設備
本發明係關於一種片狀物的支撐裝置及儲存設備，更特別的是關於一種支撐片狀物的中央支撐裝置及具有前述中央支撐裝置的存放片狀物的儲存設備。
傳統的存放片狀物的儲存設備中，例如晶圓盒，藉由在晶圓盒相對二側面設置支撐架，以支撐複數晶圓。然而像晶圓或電路板等極薄的片狀物，中間部分可能會翹曲，因此需要加設中央支撐裝置以支撐這樣的片狀物。中央支撐裝置通常一端連接儲存設備的後側面，一端向前延伸。由於延伸距離過長，中央支撐裝置的前端可能下垂。當下垂超過預定範圍，便會使工作的機械手臂（用於取放片狀物）與中央支撐裝置的前端產生碰撞，因而損壞設備及片狀物。
因此，為解決習知片狀物的支撐的種種問題，本發明提出一種支撐片狀物的中央支撐裝置。
為達上述目的及其他目的，本發明提出一種支撐片狀物的中央支撐裝置，其包含：一殼體，沿一高度方向延伸，該殼體沿該高度方向設有複數分隔部，該等分隔部夾設形成複數支撐件容置槽，該等分隔部各自具有一凹部，該凹部的底面在該高度方向上呈漸進變化，各該凹部的上方連通於對應的該支撐件容置槽；複數支撐件，可呈長條狀或其他構形，該等支撐件的一端分別連接於該等支撐件容置槽的底部；以及複數高度調整件，分別設置於該等凹部中，該等高度調整件沿該高度方向上的頂端支撐位於對應的該支撐件容置槽的該支撐件。
於本發明之一實施例中，更包括複數第一調節單元，該等第一調節單元的一端分別連接於對應的該高度調整件。
於本發明之一實施例中，該等分隔部分別設有一第一貫穿孔，該等第一調節單元的另一端分別設置於該等第一貫穿孔中。
於本發明之一實施例中，更包括複數第一防潮蓋，分別設置於該等第一貫穿孔。
於本發明之一實施例中，更包括複數緊度調整件，分別設置於該等支撐件容置槽中且分別位於對應的該支撐件在該高度方向上的上方，該等支撐件的頂面在該高度方向上呈漸進變化。
於本發明之一實施例中，該等緊度調整件的截面為圓形。
於本發明之一實施例中，更包括複數第二調節單元，該等第二調節單元的一端分別連接於對應的該緊度調整件。
於本發明之一實施例中，該等分隔部分別設有一第二貫穿孔，該等第二調節單元的另一端分別設置於該等第二貫穿孔中。
於本發明之一實施例中，更包括複數第二防潮蓋，分別設置於該等第二貫穿孔。
本發明又提出一種存放片狀物的儲存設備，其包括：一盒體，該盒體的相對二側面各自設有複數側翼支撐架；以及如前所述之支撐片狀物的中央支撐裝置，該殼體連接於該盒體的後側面。
藉此，本發明的支撐片狀物的中央支撐裝置及存放片狀物的儲存設備，可調節支撐件在高度方向上的高度，使支撐件的前端維持在規定的範圍內。
為充分瞭解本發明，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是，本發明可透過其他不同的具體實施例加以施行或應用，本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的申請專利範圍。說明如後：
如圖1所示，本發明實施例之存放片狀物的儲存設備200，其包含：一盒體1及一支撐片狀物的中央支撐裝置100。
盒體1具有一容置空間S，可供儲存複數片狀物，例如晶圓、電路板、玻璃片等。盒體1的相對二側面各自設有複數側翼支撐架11。
如圖2所示，支撐片狀物的中央支撐裝置100包含：一殼體2、複數支撐件3及複數高度調整件4。
殼體2連接於盒體1的後側面12，並沿一高度方向d延伸。殼體2沿高度方向d設有複數分隔部21，分隔部21夾設形成支撐件容置槽22。
複數支撐件3的一端分別連接於支撐件容置槽22的底部。支撐件3和側翼支撐架11可共同用於支撐複數片狀物，支撐件3用於支撐片狀物的中間部位。在本實施例中，支撐件3呈長條狀，然而本發明不限於此，支撐件3可為其他構造或形狀。支撐件3可採用如鋁合金或是碳纖維複合材料等高強度但質量相對其他高強度材料卻較輕的材料製成，因此可在提高支撐件3的剛性的同時又不致增加太多的重量。
如圖3所示，分隔部21各自具有一凹部211，凹部211的底面211a在高度方向d上呈漸進變化，各凹部211的上方連通於對應的支撐件容置槽22。
高度調整件4分別設置於這些凹部211中。高度調整件4沿高度方向d上的頂端41支撐位於對應的支撐件容置槽22的支撐件3。
由於凹部211的底面211a在高度方向d上呈漸進變化，因此只要移動高度調整件4在凹部211中的位置（如圖3雙箭頭所示），高度調整件4的頂端41的高度亦隨之變化，因而可調節支撐件3在高度方向d上的高度，使支撐件3的前端32維持在規定的範圍內。
在本實施例中，凹部211的底面211a在高度方向d上的漸進變化係為沿支撐件3的延伸方向（X方向）而變化，亦即凹部211的底面211a在X方向上呈現緩坡狀。然而本發明不限於此，凹部211的底面211a在高度方向d上的漸進變化亦可為沿Y方向或其他方向。
進一步地，在本實施例中，如圖3所示，支撐片狀物的中央支撐裝置100更包括複數第一調節單元5，這些第一調節單元5的一端分別連接於對應的高度調整件4。第一調節單元5可視為高度調整件4的延伸，以方便人員手動調整高度調整件4的位置。在本實施例中，第一調節單元5為鎖附螺絲，利用鎖附的方式調節調整高度調整件4的位置。然而本發明不限於此。
進一步地，在本實施例中，分隔部21分別設有一第一貫穿孔212，這些第一調節單元5的另一端分別設置於第一貫穿孔212中。換句話說，第一調節單元5埋設於分隔部21中，以縮減元件占據的體積。在本實施例中，第一貫穿孔212為沿X方向貫穿分隔部21，第一調節單元5為沿X方向連接高度調整件4，然而本發明不限於此，第一調節單元5也可以從其他方向連接於高度調整件4，例如沿Y方向貫穿分隔部21而連接於高度調整件4，或直接暴露於分隔部21而連接於高度調整件4。
進一步地，在本實施例中，更包括複數第一防潮蓋81，分別設置於這些第一貫穿孔212，避免水氣進入。當需要調節支撐件3的高度時，才取下第一防潮蓋81，利用螺絲起子等工具伸入第一貫穿孔212中以旋轉第一調節單元5，進而調節高度調整件4的位置。
進一步地，在本實施例中，如圖4所示，支撐片狀物的中央支撐裝置100更包括複數緊度調整件6，分別設置於支撐件容置槽22中且分別位於對應的支撐件3在高度方向d上的上方。各支撐件3的頂面31在高度方向d上呈漸進變化，緊度調整件6則抵於下方的支撐件3的頂面31和上方的分隔部21之間。因此只要移動緊度調整件6在支撐件容置槽22中的位置（如圖箭頭所示），緊度調整件6便會迫緊支撐件3，因而可調節支撐件3與殼體2卡合的鬆緊度。
在本實施例中，各支撐件3的頂面31在高度方向d上的漸進變化係為垂直支撐件3的延伸方向（Y方向）而變化，亦即支撐件3的頂面31在Y方向上呈現緩坡狀。然而本發明不限於此，支撐件3的頂面31在高度方向d上的漸進變化亦可為沿X方向或其他方向。
進一步地，在本實施例中，如圖4所示，支撐片狀物的中央支撐裝置100更包括複數第二調節單元7，這些第二調節單元7的一端分別連接於對應的緊度調整件6。第二調節單元7可視為緊度調整件6的延伸，以方便人員手動調整緊度調整件6的位置。在本實施例中，第二調節單元7為鎖附螺絲，利用鎖附的方式調節調整緊度調整件6的位置。然而本發明不限於此。
進一步地，如圖4所示，在本實施例中，分隔部21分別設有一第二貫穿孔213，這些第二調節單元7的另一端分別設置於第二貫穿孔213中。換句話說，第二調節單元7埋設於分隔部21中，以縮減元件占據的體積。在本實施例中，第二貫穿孔213為沿Y方向貫穿分隔部21，第二調節單元7為沿Y方向連接緊度調整件6，然而本發明不限於此，第二調節單元7也可以從其他方向連接於緊度調整件6，例如沿X方向貫穿分隔部21而連接於緊度調整件6，或直接暴露於分隔部21而連接於緊度調整件6。
進一步地，在本實施例中，更包括複數第二防潮蓋82，分別設置於這些第二貫穿孔213，避免水氣進入。當需要調節支撐件3的緊度時，才取下第二防潮蓋82，利用螺絲起子等工具伸入第二貫穿孔213中以旋轉第二調節單元7，進而調節緊度調整件6的位置。
在本實施例中，緊度調整件6的截面為圓形，緊度調整件6為一圓棒。然而本發明不限於此，如圖5所示，緊度調整件6a的截面亦可以為楔形或梯形，具有與支撐件3的頂面31相抵的底面61。
本發明在上文中已以實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。
100:支撐片狀物的中央支撐裝置 200:存放片狀物的儲存設備 1:盒體 11:側翼支撐架 12:後側面 2:殼體 21:分隔部 211:凹部 211a:底面 212:第一貫穿孔 213:第二貫穿孔 22:支撐件容置槽 3:支撐件 31:頂面 32:前端 4:高度調整件 41:頂端 5:第一調節單元 6:緊度調整件 61:底面 6a:緊度調整件 7:第二調節單元 81:第一防潮蓋 82:第二防潮蓋 d:高度方向 S:容置空間
圖1係為根據本發明實施例之存放片狀物的儲存設備之立體示意圖。 圖2係為根據本發明實施例之支撐片狀物的中央支撐裝置之立體示意圖。 圖3係為根據本發明實施例之支撐片狀物的中央支撐裝置之側視示意圖。 圖4係為根據本發明實施例之支撐片狀物的中央支撐裝置之另一視角之立體示意圖。 圖5係為圖4之緊度調整件的另一態樣之立體示意圖。
100:支撐片狀物的中央支撐裝置
12:後側面
2:殼體
21:分隔部
211:凹部
22:支撐件容置槽
3:支撐件
32:前端
4:高度調整件
6:緊度調整件
d:高度方向

Claims (10)

  1. 一種支撐片狀物的中央支撐裝置，其包含： 一殼體，沿一高度方向延伸，該殼體沿該高度方向設有複數分隔部，該等分隔部夾設形成複數支撐件容置槽，該等分隔部各自具有一凹部，該凹部的底面在該高度方向上呈漸進變化，各該凹部的上方連通於對應的該支撐件容置槽； 複數支撐件，該等支撐件的一端分別連接於該等支撐件容置槽的底部；以及 複數高度調整件，分別設置於該等凹部中，該等高度調整件沿該高度方向上的頂端支撐位於對應的該支撐件容置槽的該支撐件。
  2. 如請求項1所述之支撐片狀物的中央支撐裝置，更包括複數第一調節單元，該等第一調節單元的一端分別連接於對應的該高度調整件。
  3. 如請求項2所述之支撐片狀物的中央支撐裝置，其中該等分隔部分別設有一第一貫穿孔，該等第一調節單元的另一端分別設置於該等第一貫穿孔中。
  4. 如請求項3所述之支撐片狀物的中央支撐裝置，更包括複數第一防潮蓋，分別設置於該等第一貫穿孔。
  5. 如請求項1所述之支撐片狀物的中央支撐裝置，更包括複數緊度調整件，分別設置於該等支撐件容置槽中且分別位於對應的該支撐件在該高度方向上的上方，該等支撐件的頂面在該高度方向上呈漸進變化。
  6. 如請求項5所述之支撐片狀物的中央支撐裝置，其中該等緊度調整件的截面為圓形。
  7. 如請求項5所述之支撐片狀物的中央支撐裝置，更包括複數第二調節單元，該等第二調節單元的一端分別連接於對應的該緊度調整件。
  8. 如請求項7所述之支撐片狀物的中央支撐裝置，該等分隔部分別設有一第二貫穿孔，該等第二調節單元的另一端分別設置於該等第二貫穿孔中。
  9. 如請求項8所述之支撐片狀物的中央支撐裝置，更包括複數第二防潮蓋，分別設置於該等第二貫穿孔。
  10. 一種存放片狀物的儲存設備，其包括： 一盒體，該盒體的相對二側面各自設有複數側翼支撐架；以及 如請求項1至9任一項所述之支撐片狀物的中央支撐裝置，該殼體連接於該盒體的後側面。
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815581B (zh) 2022-08-01 2023-09-11 中勤實業股份有限公司 基板容器
TWI836995B (zh) * 2022-08-01 2024-03-21 中勤實業股份有限公司 基板容器
TWI828272B (zh) 2022-08-11 2024-01-01 家登精密工業股份有限公司 具強化結構之載板傳送盒
TWI817828B (zh) 2022-08-11 2023-10-01 家登精密工業股份有限公司 內建負壓氣室之基板容器
WO2024145403A1 (en) * 2022-12-30 2024-07-04 Entegris, Inc. Substrate container with purge gas diffuser
CN116646286B (zh) * 2023-05-04 2024-01-30 北京鑫跃微半导体技术有限公司 晶圆盒闩锁机构及晶圆盒

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6655879B2 (en) * 2001-11-27 2003-12-02 Sandvik Ab Tool for chip removing machining having a wedge-actuated insert adjustment mechanism
TW201112230A (en) * 2009-09-24 2011-04-01 Quanta Storage Inc Device for adjusting height of guiding bar in slot-in optical disk drive
US10220454B2 (en) * 2014-05-15 2019-03-05 Tungaloy Corporation Insert attachment mechanism, rotary cutting tool, tool body, wedge member and adjustment member
CN111622503A (zh) * 2020-07-02 2020-09-04 中交路桥华南工程有限公司 可调节高度的垫块

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259523A (en) * 1992-09-15 1993-11-09 Scherb David A Modular art work carrier
US5387067A (en) * 1993-01-14 1995-02-07 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
JPH10112493A (ja) * 1996-08-13 1998-04-28 Sony Corp 表面矯正薄板保持装置、面調整手段及び向き調整手段
JPH10203584A (ja) * 1997-01-22 1998-08-04 Nec Corp 基板用カセット
NL1010321C2 (nl) * 1997-10-20 1999-09-08 Fluoroware Inc Wafeldrager.
JPH11176921A (ja) * 1997-12-08 1999-07-02 Starlite Co Ltd 大型基板用カセット
JP4357013B2 (ja) * 1998-07-23 2009-11-04 信越ポリマー株式会社 収納容器の蓋開閉ラッチ機構
KR100331157B1 (ko) * 1998-07-24 2002-04-03 다니구찌 이찌로오, 기타오카 다카시 웨이퍼 홀딩 핸드
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
ATE281361T1 (de) * 2001-06-06 2004-11-15 Modularbox Oy Palettenbehälter
JP2003068841A (ja) * 2001-08-27 2003-03-07 Shin Etsu Handotai Co Ltd ウェーハカセット
KR100443771B1 (ko) * 2002-01-28 2004-08-09 삼성전자주식회사 작업물 수납 용기 및 작업물 수납 용기의 개폐 장치
TW553195U (en) * 2002-10-09 2003-09-11 Foxsemicon Integrated Tech Inc Substrate supporting slot plate and substrate cassette using the same
JP2004235516A (ja) * 2003-01-31 2004-08-19 Trecenti Technologies Inc ウエハ収納治具のパージ方法、ロードポートおよび半導体装置の製造方法
US20050205502A1 (en) * 2004-03-18 2005-09-22 Brown Steven A Rails for semiconductor wafer carriers
JP2005340480A (ja) * 2004-05-26 2005-12-08 Nippon Oil Corp 基板カセット用サポートバー
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US7736436B2 (en) * 2005-07-08 2010-06-15 Integrated Materials, Incorporated Detachable edge ring for thermal processing support towers
US8365919B2 (en) * 2005-12-29 2013-02-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
JP2007258562A (ja) 2006-03-24 2007-10-04 Shin Etsu Polymer Co Ltd 処理治具用収納ケース
EP2306504B1 (en) * 2008-06-23 2018-09-12 Shin-Etsu Polymer Co. Ltd. Support body and substrate storage container
US7909166B2 (en) * 2008-08-14 2011-03-22 Gudeng Precision Industrial Co, Ltd Front opening unified pod with latch structure
TWI409198B (zh) * 2010-12-27 2013-09-21 Gudeng Prec Industral Co Ltd 配置有可充氣支撐件模組之前開式晶圓盒
CN201309690Y (zh) * 2008-09-24 2009-09-16 中勤实业股份有限公司 基板卡匣调整结构
JP2011077166A (ja) * 2009-09-29 2011-04-14 Shin Etsu Polymer Co Ltd 基板収納容器
KR101199954B1 (ko) * 2010-05-31 2012-11-09 주식회사 테라세미콘 기판 처리용 보트
JP5459787B2 (ja) * 2010-06-17 2014-04-02 信越ポリマー株式会社 基板収納容器
JP2012195562A (ja) * 2011-02-28 2012-10-11 Hitachi Kokusai Electric Inc 異径基板用アタッチメントおよび基板処理装置ならびに基板若しくは半導体デバイスの製造方法
KR20130027159A (ko) * 2011-09-07 2013-03-15 효창산업 주식회사 엘씨디 글라스용 카세트의 서포트바 및 그 서포트바 조립 지그
TWI431712B (zh) * 2011-09-20 2014-03-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒
JP5781909B2 (ja) * 2011-12-08 2015-09-24 信越ポリマー株式会社 薄板収納容器
CN103419032B (zh) * 2012-05-21 2016-06-29 昆山华辰重机有限公司 多功能通用支撑机构
JP5912960B2 (ja) 2012-07-24 2016-04-27 信越ポリマー株式会社 基板収納容器
DE102012219912A1 (de) 2012-10-31 2014-04-30 Siemens Aktiengesellschaft Verfahren und Vorrichtung zur automatisierten Handhabung von Stapeln flacher Sendungen
WO2014084115A1 (ja) * 2012-11-28 2014-06-05 信越ポリマー株式会社 基板収納容器
TWM467168U (zh) * 2013-04-09 2013-12-01 Gudeng Prec Ind Co Ltd 防靜電之基板收納容器
JP6622702B2 (ja) * 2013-12-13 2019-12-18 ブルックス シーシーエス ゲーエムベーハーＢｒｏｏｋｓ ＣＣＳ ＧｍｂＨ 再循環型基板コンテナパージングシステム及び方法
US20150259097A1 (en) * 2014-03-14 2015-09-17 Doreen O'Hare Modular storage system
JP6351317B2 (ja) * 2014-03-14 2018-07-04 ミライアル株式会社 基板収納容器
TWM489155U (en) * 2014-06-09 2014-11-01 Gudeng Precision Industrial Co Ltd Gas diffusion device of wafer pod
JP6271354B2 (ja) 2014-06-30 2018-01-31 信越ポリマー株式会社 基板収納容器及びその製造方法
JP2016119327A (ja) * 2014-12-18 2016-06-30 ミライアル株式会社 基板収納容器
KR102304976B1 (ko) * 2015-01-13 2021-09-27 삼성디스플레이 주식회사 기판 카세트
CN108028216B (zh) * 2015-08-25 2022-08-02 恩特格里斯公司 互锁模块化衬底支撑柱
TWI567856B (zh) * 2015-09-08 2017-01-21 古震維 具有吹淨功能的晶圓傳送裝置
JP6724622B2 (ja) * 2015-10-08 2020-07-15 東京エレクトロン株式会社 水平設置装置及び被設置物の水平設置方法
US10388554B2 (en) * 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
CN206055096U (zh) * 2016-08-24 2017-03-29 咸阳蓝博机械有限公司 一种直线模组可调支撑装置
US10923373B2 (en) 2016-09-06 2021-02-16 Shin-Etsu Polymer Co., Ltd. Substrate storage container and gas replacement unit
DE202016106088U1 (de) * 2016-10-28 2017-02-06 Georg Utz Holding Ag Klapp-Behälter
KR20180099264A (ko) * 2017-02-28 2018-09-05 (주)상아프론테크 서포트 바 및 이를 구비한 기판 적재용 카세트
WO2018203384A1 (ja) * 2017-05-02 2018-11-08 ミライアル株式会社 基板収納容器
WO2018226800A1 (en) * 2017-06-09 2018-12-13 Entegris, Inc. Substrate container with particle mitigation feature
TWM563421U (zh) * 2018-03-06 2018-07-11 中勤實業股份有限公司 晶圓容器
JP6801640B2 (ja) * 2017-12-21 2020-12-16 株式会社ダイフク 収納棚及び物品収納設備
KR102066175B1 (ko) * 2017-12-28 2020-01-14 우범제 웨이퍼 수납용기
US11008159B2 (en) * 2018-01-03 2021-05-18 Buckhorn, Inc. Extension collar for a flowable material dispensing box
KR20200100200A (ko) * 2018-01-12 2020-08-25 신에츠 폴리머 가부시키가이샤 패널 수납 용기
JP6977215B2 (ja) 2018-01-22 2021-12-08 信越ポリマー株式会社 パネル収納容器
CN208007736U (zh) * 2018-03-06 2018-10-26 中勤实业股份有限公司 晶圆容器
TWI672762B (zh) * 2018-06-14 2019-09-21 旺矽科技股份有限公司 晶圓取放方法
CN112640079A (zh) * 2018-08-28 2021-04-09 恩特格里斯公司 衬底容器的膜扩散器
TWM588108U (zh) * 2019-08-21 2019-12-21 中勤實業股份有限公司 易碎片狀物的儲運裝置
JP7351681B2 (ja) * 2019-09-05 2023-09-27 信越ポリマー株式会社 基板収納容器
CN210556833U (zh) 2019-09-06 2020-05-19 中勤实业股份有限公司 易碎片状物的储运装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6655879B2 (en) * 2001-11-27 2003-12-02 Sandvik Ab Tool for chip removing machining having a wedge-actuated insert adjustment mechanism
TW201112230A (en) * 2009-09-24 2011-04-01 Quanta Storage Inc Device for adjusting height of guiding bar in slot-in optical disk drive
US10220454B2 (en) * 2014-05-15 2019-03-05 Tungaloy Corporation Insert attachment mechanism, rotary cutting tool, tool body, wedge member and adjustment member
CN111622503A (zh) * 2020-07-02 2020-09-04 中交路桥华南工程有限公司 可调节高度的垫块

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