TWI793571B - 模組化大型載具 - Google Patents

模組化大型載具 Download PDF

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TWI793571B
TWI793571B TW110113576A TW110113576A TWI793571B TW I793571 B TWI793571 B TW I793571B TW 110113576 A TW110113576 A TW 110113576A TW 110113576 A TW110113576 A TW 110113576A TW I793571 B TWI793571 B TW I793571B
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body module
scale
modularized
carrier
present
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TW110113576A
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TW202213591A (zh
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邱銘乾
沈恩年
潘詠晉
鍾承恩
李柏廷
劉維虔
黃姿維
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家登精密工業股份有限公司
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    • HELECTRICITY
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    • H01L21/6732Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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    • H01L21/67303Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • HELECTRICITY
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    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • B65D21/0201Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together side-by-side
    • B65D21/0204Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together side-by-side and joined together by interconnecting formations forming part of the container, e.g. dove-tail, snap connections, hook elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • B65D21/0209Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together one-upon-the-other in the upright or upside-down position
    • B65D21/0213Containers presenting a continuous stacking profile along the upper or lower edge of at least two opposite side walls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • B65D21/0209Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together one-upon-the-other in the upright or upside-down position
    • B65D21/0228Containers joined together by screw-, bayonet-, snap-fit or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/08Containers of variable capacity
    • B65D21/083Containers of variable capacity by means of additional elements, e.g. modular
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • B65D25/10Devices to locate articles in containers
    • B65D25/107Grooves, ribs, or the like, situated on opposed walls and between which the articles are located
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D47/00Closures with filling and discharging, or with discharging, devices
    • B65D47/04Closures with discharging devices other than pumps
    • B65D47/32Closures with discharging devices other than pumps with means for venting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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    • H01L21/67373Closed carriers characterised by locking systems
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67376Closed carriers characterised by sealing arrangements
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2205/00Venting means
    • B65D2205/02Venting holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0235Containers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0297Wafer cassette

Abstract

一種模組化大型載具,包含:至少二本體模組、至少一密封構件及一背板,各本體模組的周緣彼此連接且沿一深度方向排列,密封構件環繞設置於各本體模組的連接處,背板設置於最尾端的本體模組的後側。本發明的模組化大型載具克服既有的因射出成形機台而導致的載具尺寸限制,可在深度方向上繼續擴展而加大載體的氣密儲存空間。

Description

模組化大型載具
本發明係關於一種載具,更特別的是關於一種模組化大型載具。
市面上現有的大型載具(例如12吋晶圓承載盒)的材料為塑膠射出成形。然而射出成形機台有尺寸限制,無法射出一體式介於500-800mm的大型載具。換句話說,載具的尺寸受到製造層面的限制,無法更進一步加大容量。
另一方面,若載具的尺寸加大,其本身的重量加上載體重量往往動輒超過100kg,載具的底座容易因支撐性、強度不足,易造成底座平面變形彎曲,需要更換。這些原因亦導致了大型載具的尺寸受限。
因此,為解決習知大型載具的種種問題,本發明提出一種模組化大型載具。
為達上述目的及其他目的,本發明提出一種模組化大型載具,其包含:至少二本體模組,各該本體模組的周緣彼此連接且沿一深度方向排列;至少一密封構件,環繞設置於各該本體模組的連接處;以及一背板,設置於最尾端的該本體模組的後側。
於本發明之一實施例中,該背板與該本體模組一體式連結。
於本發明之一實施例中,該背板為具透光性、部分透光性或完全不透光性三者其中之一。
於本發明之一實施例中,該等本體模組為螺絲鎖扣或彼此卡合。
於本發明之一實施例中,該等本體模組的二外側分別具有沿該深度方向延伸的一運送槽道。
於本發明之一實施例中,該運送槽道上設有一定位凹口部。
於本發明之一實施例中,該等本體模組的二外側分別具一垂直扣槽,該垂直扣槽沿垂直於該深度方向的一高度方向延伸。
於本發明之一實施例中,更包括:一外底板,具有一朝外面及一朝內面,該朝內面朝向該等本體模組的底面;複數補強槽件,可拆卸地設置於該朝外面,該等補強槽件各自具有一滑槽;以及複數強化件,呈長條狀,該等強化件彼此相隔一定距離地排列於該外底板及該本體模組的底面之間,且該等強化件的底部及頂部分別頂抵於該外底板及該本體模組的底面。
於本發明之一實施例中,該強化件、該外底板及該本體模組的底面形成一H形結構。
於本發明之一實施例中,該補強槽件為金屬材料。
於本發明之一實施例中,該強化件為金屬材料或碳纖維複合材料。
綜上所述,本發明的模組化大型載具可克服既有的因射出成形機台而導致的載具尺寸限制,可在深度方向上繼續擴展而加大載體的氣密儲存空間。並且進一步加強模組化大型載具的底座的強度,避免因長時間承載而彎 曲、變形,節省零件更換時間、有效降低成本,並延長模組化大型載具整體壽命。
100:模組化大型載具
1:本體模組
11:第一本體模組
111:底面
12:第二本體模組
121:底面
2:密封構件
3:背板
31:透光區
4:外底板
41:朝外面
42:朝內面
5:補強槽件
51:滑槽
6:強化件
61:底部
62:頂部
7:運送槽道
71:凸肋
711:定位凹口部
8:垂直扣槽
81:凸肋
A-A:線段
B-B:線段
d:深度方向
h:高度方向
圖1為根據本發明實施例之模組化大型載具之組裝示意圖。
圖2為圖1沿A-A線段的縱剖面示意圖。
圖3為圖1沿B-B線段的橫剖面示意圖。
圖4係為根據本發明實施例之模組化大型載具之外觀示意圖。
圖5係為根據本發明實施例之模組化大型載具之外底板的朝內面之立體示意圖。
圖6係為根據本發明實施例之模組化大型載具之外底板的朝外面之立體示意圖。
圖7係為根據本發明實施例之模組化大型載具之外底板之剖面示意圖。
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明 本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後:如圖1至圖3所示,本發明實施例之模組化大型載具100,其包含:至少二本體模組1、至少一密封構件2及一背板3。
在本實施例中,至少二本體模組1包括第一本體模組11及第二本體模組12,第一本體模組11及第二本體模組12的周緣彼此固定地連接且沿一深度方向d排列。連接方式可以為螺絲鎖扣或透過設置卡合部而彼此卡合。在其他實施例中,模組化大型載具100可以具有更多的本體模組1,例如第三本體模組、第四本體模組而沿深度方向d繼續組合,以此方式創造大型載具的氣密儲存空間。
密封構件2環繞設置於各本體模組1(第一本體模組11及第二本體模組12)的連接處,以氣密密封第一本體模組11及第二本體模組12的結合處。當具有更多的本體模組1,例如第三本體模組、第四本體模組,密封構件2亦設置於各本體模組1的鄰接處。密封構件2例如為氣密膠條,然而本發明不限於此。
背板3設置於最尾端的本體模組1的後側。在本實施例中,最尾端的本體模組1為第二本體模組12,故背板3設置於第二本體模組12。在本實施例中,背板3與第二本體模組12為分離的兩個部件,故背板3與第二本體模組12之間亦設置密封構件2以氣密密封第二本體模組12及背板3的結合處。然而在其他實施例中,背板3也可以一體成形地形成於最尾端的本體模組1的後側,亦即,背板3與最尾端的本體模組1以射出成形的方式一體式地連結(例如第二本體模組12與背板3為同一射出件)。
本發明的模組化大型載具100還具有前門(圖未示),設置於第一本體模組11的前側(相對於背板3)。前門、各本體模組1及背板3可為射出式的塑膠件,然而本發明不限於此。
本發明的模組化大型載具100藉由複數個本體模組1及密封構件2之結合,可克服既有的因射出成形機台而導致的載具尺寸限制,可在深度方向上繼續擴展而加大載體的氣密儲存空間。
進一步地,在本實施例中,背板3為具透光性、部分透光性或完全不透光性三者其中之一。如圖1所示,背板3具有透光區31。透光區31可以為透明或半透明,且透明的定義是依據探測用的電磁波射線而定,換句話說,透光區31相對電磁波為可穿透或半穿透即為透明或半透明,也就是不以可見光的透明為限,可以為對紅外線或紫外線等電磁波射線為透明。背板3可以整體都是透光區31,由透明或半透明材料所製成,也可以是背板3在由其他非透光材料製造時預留一塊鏤空區,再鑲上透明或半透明材料形成透光區31。在其他實施例中,背板3為完全不透光,背板3與第二本體模組12為同一射出件。
進一步地,在本實施例中,這些本體模組1的二外側分別具有沿深度方向d延伸的一運送槽道7。圖4僅顯示了第一本體模組11及第二本體模組12的一側的運送槽道7,然而第一本體模組11及第二本體模組12為線性對稱,第一本體模組11及第二本體模組12的另一側也具有相同的運送槽道7,故不重複繪示。運送槽道7至少包括二平行的凸肋71,凸肋71具有一定位凹口部711。當機械搬運手臂(圖未示)直立地運送模組化大型載具100時,機械搬運手臂經由運送槽道7而平行地滑移,在定位凹口部711之處對接固定後執行搬運。此時,運送槽道7的凸肋71為整體的重量承受面。
在本實施例中,這些本體模組1的二外側還分別具一垂直扣槽8,垂直扣槽8沿垂直於深度方向d的一高度方向h延伸。垂直扣槽8至少包括二平行的凸肋81。當本發明的模組化大型載具旋轉90度時,運送槽道7的凸肋71不再能承載重量(其延伸方向與重力方向平行),此時機械搬運手臂改抓握垂直扣槽8,利用垂直扣槽8的凸肋81作為翻轉後的重量承受面。
進一步地,如圖5至圖7所示,在本實施例中,模組化大型載具100更包括:一外底板4、複數補強槽件5及複數強化件6。
外底板4具有一朝外面41及一朝內面42。朝外面41為模組化大型載具100接觸外界、機台的外表面;相對地,朝內面42朝向各本體模組1的底面。
如圖6所示,補強槽件5可拆卸地設置於朝外面41,這些補強槽件5各自具有一滑槽51。滑槽51用以做為模組化大型載具100與其他機台、裝置之間的定位滑軌機構。補強槽件5為可更換性的,可利用鎖附、卡扣等方式固定於外底板4的朝外面41。在本實施例中,補強槽件5的數量為三,然而本發明不限於此。
如圖5及圖7所示,強化件6呈長條狀,這些強化件6彼此相隔一定距離地排列於外底板4及各本體模組1的底面111、121之間,各強化件6之間的距離可為等距或不等距,較佳地以平行的方式排列。這些強化件6的底部61及頂部62分別頂抵於外底板4及各本體模組1的底面111、121(緊配接觸)而形成一H形結構(類H鋼)。此結構抗彎能力強,便於即拆即裝,能加強模組化大型載具100的底座的強度,避免因長時間承載而彎曲、變形。並且補強槽件5 可降低使用磨耗,即便磨損也能單獨替換,無須更換整個模組化大型載具100,且節省更換時間、有效降低成本,並延長模組化大型載具100整體壽命。
進一步地,在本實施例中,補強槽件5為金屬材料。然而本發明不限於此,補強槽件5可為其他種類的強度高、耐磨耗之材料。
進一步地,在本實施例中,強化件6為金屬材料。然而本發明不限於此,強化件6可為其他種類的強度高、質量輕之材料,例如碳纖維複合材料。
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。
100:模組化大型載具
1:本體模組
11:第一本體模組
111:底面
12:第二本體模組
121:底面
2:密封構件
3:背板
31:透光區
A-A:線段
B-B:線段
d:深度方向

Claims (10)

  1. 一種模組化大型載具,其包含:至少二本體模組,各該本體模組的周緣彼此連接且沿一深度方向排列,其中該等本體模組的二外側分別具有一垂直扣槽,該垂直扣槽沿垂直於該深度方向的一高度方向延伸;至少一密封構件,環繞設置於各該本體模組的連接處;以及一背板,設置於最尾端的該本體模組的後側。
  2. 如請求項1所述之模組化大型載具,其中該背板與該本體模組一體式連結。
  3. 如請求項1所述之模組化大型載具,其中該背板為具透光性、部分透光性或完全不透光性三者其中之一。
  4. 如請求項1或2所述之模組化大型載具,其中該等本體模組為螺絲鎖扣或彼此卡合。
  5. 如請求項1所述之模組化大型載具,其中該等本體模組的二外側分別具有沿該深度方向延伸的一運送槽道。
  6. 如請求項5所述之模組化大型載具,其中該運送槽道上設有一定位凹口部。
  7. 如請求項1所述之模組化大型載具,更包括:一外底板,具有一朝外面及一朝內面,該朝內面朝向該等本體模組的底面;複數補強槽件,可拆卸地設置於該朝外面,該等補強槽件各自具有一滑槽;以及 複數強化件,呈長條狀,該等強化件彼此相隔一定距離地排列於該外底板及該本體模組的底面之間,且該等強化件的底部及頂部分別頂抵於該外底板及該本體模組的底面。
  8. 如請求項7所述之模組化大型載具,其中該強化件、該外底板及該本體模組的底面形成一H形結構。
  9. 如請求項7所述之模組化大型載具,其中該補強槽件為金屬材料。
  10. 如請求項7所述之模組化大型載具,其中該強化件為金屬材料或碳纖維複合材料。
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