FR1066148A - Perfectionnements aux redresseurs électriques à cristaux - Google Patents

Perfectionnements aux redresseurs électriques à cristaux

Info

Publication number
FR1066148A
FR1066148A FR1066148DA FR1066148A FR 1066148 A FR1066148 A FR 1066148A FR 1066148D A FR1066148D A FR 1066148DA FR 1066148 A FR1066148 A FR 1066148A
Authority
FR
France
Prior art keywords
wire
sealed
copper
semi
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
French (fr)
Inventor
Henry Wolfson
Stantley Carden Shepard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB13657/51A external-priority patent/GB716250A/en
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Priority claimed from GB19173/53A external-priority patent/GB753488A/en
Application granted granted Critical
Publication of FR1066148A publication Critical patent/FR1066148A/fr
Priority claimed from US434865A external-priority patent/US2928030A/en
Priority claimed from GB4261/56A external-priority patent/GB797822A/en
Priority claimed from GB23454/58A external-priority patent/GB835865A/en
Expired legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/26Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Food Science & Technology (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Drying Of Solid Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Lubricants (AREA)
  • Wire Bonding (AREA)
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  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Primary Cells (AREA)
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FR1066148D 1951-06-08 1952-06-06 Perfectionnements aux redresseurs électriques à cristaux Expired FR1066148A (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
GB13657/51A GB716250A (en) 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices
GB19173/53A GB753488A (en) 1953-07-10 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements
US434865A US2928030A (en) 1954-06-07 1954-06-07 Semiconductor devices
GB4261/56A GB797822A (en) 1951-06-08 1956-02-10 Improvements in or relating to semi-conductor junction diodes
DEST13682A DE1098102B (de) 1951-06-08 1958-04-23 Verfahren zur Herstellung einer elektrischen Halbleitervorrichtung
GB23454/58A GB835865A (en) 1957-05-21 1958-07-22 Improvements in or relating to crystal rectifiers and methods of manufacture thereof
DE884824X 1958-09-30
DEST15123A DE1255823B (de) 1951-06-08 1959-05-13 Verfahren zum Herstellen von Kuehlkoerpern fuer elektrische Bauelemente aus auf einem Bolzen senkrecht zur Laengsachse angeordneten Kuehlplatten, insbesondere fuer Halbleiterleistungsgleichrichter und Transistoren

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FR1066148A true FR1066148A (fr) 1954-06-02

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ID=31982807

Family Applications (4)

Application Number Title Priority Date Filing Date
FR1066148D Expired FR1066148A (fr) 1951-06-08 1952-06-06 Perfectionnements aux redresseurs électriques à cristaux
FR66909D Expired FR66909E (fr) 1951-06-08 1954-07-06 Perfectionnements aux redresseurs électriques à cristaux
FR69762D Expired FR69762E (fr) 1951-06-08 1955-06-06 Perfectionnements aux redresseurs électriques à cristaux
FR71643D Expired FR71643E (fr) 1951-06-08 1957-02-08 Perfectionnements aux redresseurs électriques à cristaux

Family Applications After (3)

Application Number Title Priority Date Filing Date
FR66909D Expired FR66909E (fr) 1951-06-08 1954-07-06 Perfectionnements aux redresseurs électriques à cristaux
FR69762D Expired FR69762E (fr) 1951-06-08 1955-06-06 Perfectionnements aux redresseurs électriques à cristaux
FR71643D Expired FR71643E (fr) 1951-06-08 1957-02-08 Perfectionnements aux redresseurs électriques à cristaux

Country Status (8)

Country Link
US (1) US2785349A (de)
BE (4) BE512559A (de)
CH (2) CH342657A (de)
DE (6) DE968077C (de)
FR (4) FR1066148A (de)
GB (4) GB795113A (de)
LU (1) LU37433A1 (de)
NL (3) NL170157B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734755A (en) * 1984-06-09 1988-03-29 Semikron Gesellschaft Fur Gleichrichterbau Alternating load stable switchable semiconductor device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2850707A (en) * 1954-04-15 1958-09-02 Sylvania Electric Prod Electromagnetic coils
NL236678A (de) * 1958-03-04 1900-01-01
NL101704C (de) * 1958-07-02
US2937110A (en) * 1958-07-17 1960-05-17 Westinghouse Electric Corp Protective treatment for semiconductor devices
NL113317C (de) * 1958-09-16 1900-01-01
DE1275690B (de) * 1960-10-01 1968-08-22 Telefunken Patent Gehaeuse fuer Halbleiterbauelemente
DE1237695B (de) * 1961-10-24 1967-03-30 Siemens Ag Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement
DE1229647B (de) * 1961-12-22 1966-12-01 Walter Brandt G M B H Verfahren zum Herstellen einer Flaechengleichrichteranordnung
US3216084A (en) * 1963-04-10 1965-11-09 Motorola Inc Semiconductor process control technique
US3265805A (en) * 1964-02-03 1966-08-09 Power Components Inc Semiconductor power device
DE1514473C3 (de) * 1965-06-05 1981-08-20 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
DE2331106C2 (de) * 1973-06-19 1984-11-22 Hitachi Maxell, Ltd., Ibaraki, Osaka Trockenelement
US3945852A (en) * 1974-09-06 1976-03-23 P. R. Mallory & Co. Inc. Current collector for organic electrolyte batteries
USRE30458E (en) 1977-12-30 1980-12-23 Hitachi Maxell, Ltd. Dry cells
US4574330A (en) * 1982-12-20 1986-03-04 Burr-Brown Corporation Heat sink for dissipating heat generated by electronic displays
DE10128970A1 (de) * 2001-06-15 2002-12-19 Fortu Bat Batterien Gmbh Bei Normaltemperatur betreibbare, wiederaufladbare Batteriezelle
JP2010165721A (ja) * 2009-01-13 2010-07-29 Honda Motor Co Ltd 太陽電池モジュール
CN109513352B (zh) * 2019-01-10 2024-07-30 广东中烟工业有限责任公司 一种用于异味处理系统光化学管的防水装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US756676A (en) * 1902-11-10 1904-04-05 Internat Wireless Telegraph Company Wave-responsive device.
US1058210A (en) * 1910-12-30 1913-04-08 Allie Ray Welch Method of finishing castings.
US1704228A (en) * 1928-01-30 1929-03-05 Packard Motor Car Co Fastening device
US1890312A (en) * 1931-03-30 1932-12-06 Tung Sol Condensers Inc Condenser
DE710631C (de) * 1938-08-06 1941-09-18 Versuchsanstalt Fuer Luftfahrt Empfangsvorrichtung fuer elektrische Wellen
DE891404C (de) * 1941-05-27 1953-09-28 Pertrix Union G M B H Galvanisches Element, insbesondere mit Luftdepolarisation
GB572511A (en) * 1941-11-05 1945-10-11 Gen Electric Co Ltd Improvements in electric rectifiers
US2503837A (en) * 1945-07-27 1950-04-11 Bell Telephone Labor Inc Electrical translating device
GB635690A (en) * 1946-07-31 1950-04-12 Gen Electric Co Ltd Improvements in and relating to crystal rectifiers
BE478029A (de) * 1946-10-10
US2635199A (en) * 1948-01-08 1953-04-14 John M Wolfskill Piezoelectric crystal apparatus
US2513870A (en) * 1948-01-23 1950-07-04 Reeves Hoffman Corp Hermetically sealed crystal
US2615965A (en) * 1948-07-24 1952-10-28 Sylvania Electric Prod Crystal amplifier device
US2626985A (en) * 1948-08-25 1953-01-27 Sylvania Electric Prod Electrical crystal unit
BE491276A (de) * 1948-11-05
US2631115A (en) * 1949-08-06 1953-03-10 Manganese Battery Corp Electrodes for electrochemical cells
NL157875B (nl) * 1949-12-23 Stork Jansen & Sutorius Nv Vulelement voor een tegendrukvulinrichting.
US2595475A (en) * 1949-12-23 1952-05-06 Rca Corp Electrode support for semiconductor devices
US2639392A (en) * 1949-12-30 1953-05-19 Bell Telephone Labor Inc Masking device for crystals
US2622133A (en) * 1950-05-01 1952-12-16 Sprague Electric Co Sealed electrical circuit components
US2651745A (en) * 1951-02-08 1953-09-08 Int Standard Electric Corp Dry rectifier assembly
BE534817A (de) * 1954-01-14 1900-01-01
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
GB785467A (en) * 1954-12-23 1957-10-30 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
NL93941C (de) * 1955-03-24 1959-11-16
NL207356A (de) * 1955-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734755A (en) * 1984-06-09 1988-03-29 Semikron Gesellschaft Fur Gleichrichterbau Alternating load stable switchable semiconductor device

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DE1015934B (de) 1957-09-19
FR69762E (fr) 1958-12-30
DE968077C (de) 1958-01-16
DE1255823B (de) 1967-12-07
FR71643E (fr) 1960-01-13
GB795113A (en) 1958-05-14
CH342657A (de) 1959-11-30
CH384722A (de) 1965-02-26
BE512559A (de) 1900-01-01
LU37433A1 (de) 1900-01-01
BE554903A (de) 1900-01-01
NL86185C (de) 1900-01-01
DE1098102B (de) 1961-01-26
US2785349A (en) 1957-03-12
DE1069726B (de) 1959-11-26
GB914592A (en) 1963-01-02
NL170157B (nl) 1900-01-01
GB884824A (en) 1961-12-20
FR66909E (fr) 1957-10-31
GB877644A (en) 1961-09-20
BE538791A (de) 1900-01-01
BE530249A (de) 1900-01-01
NL238107A (de) 1900-01-01
DE1060992B (de) 1959-07-09

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