FI4105349T3 - Lyijytön ja antimoniton juoteseos, juotoskuula, ja juoteseoksen käyttö juotosliitoksena - Google Patents

Lyijytön ja antimoniton juoteseos, juotoskuula, ja juoteseoksen käyttö juotosliitoksena

Info

Publication number
FI4105349T3
FI4105349T3 FIEP21754525.0T FI21754525T FI4105349T3 FI 4105349 T3 FI4105349 T3 FI 4105349T3 FI 21754525 T FI21754525 T FI 21754525T FI 4105349 T3 FI4105349 T3 FI 4105349T3
Authority
FI
Finland
Prior art keywords
free
solder
antimony
lead
alloy
Prior art date
Application number
FIEP21754525.0T
Other languages
English (en)
Finnish (fi)
Inventor
Yuuki Iijima
Shunsaku Yoshikawa
Takashi Saito
Kanta DEI
Takahiro MATSUFUJI
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of FI4105349T3 publication Critical patent/FI4105349T3/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
FIEP21754525.0T 2020-02-14 2021-02-08 Lyijytön ja antimoniton juoteseos, juotoskuula, ja juoteseoksen käyttö juotosliitoksena FI4105349T3 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
PCT/JP2021/004570 WO2021161953A1 (ja) 2020-02-14 2021-02-08 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (1)

Publication Number Publication Date
FI4105349T3 true FI4105349T3 (fi) 2026-01-16

Family

ID=77292175

Family Applications (1)

Application Number Title Priority Date Filing Date
FIEP21754525.0T FI4105349T3 (fi) 2020-02-14 2021-02-08 Lyijytön ja antimoniton juoteseos, juotoskuula, ja juoteseoksen käyttö juotosliitoksena

Country Status (12)

Country Link
US (1) US12576463B2 (https=)
EP (1) EP4105349B1 (https=)
JP (2) JP6928284B1 (https=)
KR (1) KR102543580B1 (https=)
CN (1) CN115397605B (https=)
FI (1) FI4105349T3 (https=)
MX (2) MX2022009912A (https=)
MY (1) MY199336A (https=)
PH (1) PH12022552111A1 (https=)
PL (1) PL4105349T3 (https=)
TW (2) TWI765570B (https=)
WO (1) WO2021161953A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP7381980B1 (ja) 2023-04-28 2023-11-16 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路
JP7633557B1 (ja) 2023-12-28 2025-02-20 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト、およびはんだ継手

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816877A (ja) * 1981-07-24 1983-01-31 Fuji Xerox Co Ltd 記録装置のロ−ル紙給紙機構
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3649384B2 (ja) * 2000-07-03 2005-05-18 日立金属株式会社 はんだボールおよびその製造方法
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP2007160401A (ja) * 2005-11-15 2007-06-28 Hitachi Metals Ltd はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
US8562906B2 (en) * 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
CN103492112B (zh) 2012-04-16 2016-08-17 株式会社谷黑组 焊接装置、焊接方法以及所制造的基板及电子部件
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法
TWI576195B (zh) * 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20150127445A (ko) 2014-05-07 2015-11-17 애큐러스 사이언티픽 컴퍼니 리미티드 은-비함유 및 납-비함유 솔더 조성물
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
CN108290249B (zh) * 2016-09-13 2020-01-10 千住金属工业株式会社 软钎料合金、焊料球和钎焊接头
JP2018167310A (ja) 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
JP2019155467A (ja) 2018-03-16 2019-09-19 千住金属工業株式会社 鉛フリーはんだ合金
JP6700568B1 (ja) 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Also Published As

Publication number Publication date
MX2022009912A (es) 2022-09-09
JP2021126704A (ja) 2021-09-02
KR20220129112A (ko) 2022-09-22
EP4105349B1 (en) 2025-12-10
CN115397605B (zh) 2024-04-30
MY199336A (en) 2023-10-24
WO2021161953A1 (ja) 2021-08-19
KR102543580B1 (ko) 2023-06-15
MX2023008513A (es) 2024-01-02
PL4105349T3 (pl) 2026-03-30
CN115397605A (zh) 2022-11-25
PH12022552111A1 (en) 2024-01-29
JP2021126685A (ja) 2021-09-02
TWI765570B (zh) 2022-05-21
US12576463B2 (en) 2026-03-17
JP6928284B1 (ja) 2021-09-01
EP4105349A1 (en) 2022-12-21
JP7025679B2 (ja) 2022-02-25
BR112022016141A2 (pt) 2022-10-04
TW202219287A (zh) 2022-05-16
US20230060857A1 (en) 2023-03-02
TWI781050B (zh) 2022-10-11
TW202138576A (zh) 2021-10-16
EP4105349A4 (en) 2023-09-06

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