MX2023008513A - Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. - Google Patents
Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.Info
- Publication number
- MX2023008513A MX2023008513A MX2023008513A MX2023008513A MX2023008513A MX 2023008513 A MX2023008513 A MX 2023008513A MX 2023008513 A MX2023008513 A MX 2023008513A MX 2023008513 A MX2023008513 A MX 2023008513A MX 2023008513 A MX2023008513 A MX 2023008513A
- Authority
- MX
- Mexico
- Prior art keywords
- free
- solder
- antimony
- lead
- alloy
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 229910045601 alloy Inorganic materials 0.000 title abstract 6
- 239000000956 alloy Substances 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
Abstract
Se proporciona una aleación de soldadura, bolas de soldadura y junta de soldadura sin plomo y ni antimonio, la cual tienen esfuerzo cortante mejorado obtenida por la minuciosidad de grano en una interfaz unida y puede suprimir la falla de fusión. La aleación de soldadura sin plomo y ni antimonio que tiene una composición de aleación que consiste de, en % en m asa, de 0.1 a 4.5% de Ag, de 0.20 a 0.85% de Cu, de 0.005 a 0.090 % de Ni y de 0.0005 a 0.0090% de Ge siendo el resto Sn y la composición de aleación satisface las siguientes relaciones (1) y (2): 0.006 = (Ag + Cu + Ni) x Ge < 0.023 (1), Sn/Cu) x (Ni x Ge)/(Ni + Ge) < (0.89 (2). Ag, Cu, Ni, Ge y Sn en las relaciones (1) y (2) representan cada uno el contenido (% en masa) en la composición de la aleación.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020023276A JP6928284B1 (ja) | 2020-02-14 | 2020-02-14 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| PCT/JP2021/004570 WO2021161953A1 (ja) | 2020-02-14 | 2021-02-08 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2023008513A true MX2023008513A (es) | 2024-01-02 |
Family
ID=77292175
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2023008513A MX2023008513A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
| MX2022009912A MX2022009912A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022009912A MX2022009912A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20230060857A1 (es) |
| EP (1) | EP4105349A4 (es) |
| JP (2) | JP6928284B1 (es) |
| KR (1) | KR102543580B1 (es) |
| CN (1) | CN115397605B (es) |
| BR (1) | BR112022016141A2 (es) |
| MX (2) | MX2023008513A (es) |
| TW (2) | TWI765570B (es) |
| WO (1) | WO2021161953A1 (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7007623B1 (ja) * | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
| JP7381980B1 (ja) | 2023-04-28 | 2023-11-16 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816877A (ja) * | 1981-07-24 | 1983-01-31 | Fuji Xerox Co Ltd | 記録装置のロ−ル紙給紙機構 |
| JP3649384B2 (ja) * | 2000-07-03 | 2005-05-18 | 日立金属株式会社 | はんだボールおよびその製造方法 |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| JP3865396B2 (ja) * | 2003-07-08 | 2007-01-10 | 日本ピラー工業株式会社 | 融着型の樹脂製管継手構造 |
| JP4807724B2 (ja) * | 2005-02-28 | 2011-11-02 | 財団法人電力中央研究所 | 鉄道車両の製造方法 |
| JP2007160401A (ja) * | 2005-11-15 | 2007-06-28 | Hitachi Metals Ltd | はんだ合金、はんだボールおよびそれを用いたはんだ接合部 |
| US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| JP5030442B2 (ja) * | 2006-03-09 | 2012-09-19 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
| KR100797161B1 (ko) | 2007-05-25 | 2008-01-23 | 한국생산기술연구원 | 주석-은-구리-인듐의 4원계 무연솔더 조성물 |
| US9289841B2 (en) * | 2012-04-16 | 2016-03-22 | Tanigurogumi Corporation | Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method |
| BR112014032941A2 (pt) * | 2012-06-30 | 2017-06-27 | Senju Metal Industry Co | bola de solda sem chumbo |
| WO2014170963A1 (ja) * | 2013-04-16 | 2014-10-23 | 千住金属工業株式会社 | 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法 |
| TWI576195B (zh) * | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| KR20150127445A (ko) * | 2014-05-07 | 2015-11-17 | 애큐러스 사이언티픽 컴퍼니 리미티드 | 은-비함유 및 납-비함유 솔더 조성물 |
| WO2017164194A1 (ja) * | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置 |
| PT3381601T (pt) * | 2016-09-13 | 2021-01-05 | Senju Metal Industry Co | Liga de solda, esferas de solda e juntas de solda |
| JP2018167310A (ja) * | 2017-03-30 | 2018-11-01 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
| JP2019155467A (ja) * | 2018-03-16 | 2019-09-19 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP6700568B1 (ja) * | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手 |
-
2020
- 2020-02-14 JP JP2020023276A patent/JP6928284B1/ja active Active
-
2021
- 2021-02-08 WO PCT/JP2021/004570 patent/WO2021161953A1/ja unknown
- 2021-02-08 US US17/799,561 patent/US20230060857A1/en active Pending
- 2021-02-08 MX MX2023008513A patent/MX2023008513A/es unknown
- 2021-02-08 KR KR1020227031749A patent/KR102543580B1/ko active IP Right Grant
- 2021-02-08 BR BR112022016141A patent/BR112022016141A2/pt not_active Application Discontinuation
- 2021-02-08 EP EP21754525.0A patent/EP4105349A4/en active Pending
- 2021-02-08 CN CN202180028097.5A patent/CN115397605B/zh active Active
- 2021-02-08 MX MX2022009912A patent/MX2022009912A/es unknown
- 2021-02-09 TW TW110104909A patent/TWI765570B/zh active
- 2021-02-09 TW TW111102941A patent/TWI781050B/zh active
- 2021-04-30 JP JP2021077395A patent/JP7025679B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6928284B1 (ja) | 2021-09-01 |
| TW202138576A (zh) | 2021-10-16 |
| TWI781050B (zh) | 2022-10-11 |
| US20230060857A1 (en) | 2023-03-02 |
| TWI765570B (zh) | 2022-05-21 |
| KR20220129112A (ko) | 2022-09-22 |
| JP7025679B2 (ja) | 2022-02-25 |
| WO2021161953A1 (ja) | 2021-08-19 |
| CN115397605B (zh) | 2024-04-30 |
| EP4105349A1 (en) | 2022-12-21 |
| BR112022016141A2 (pt) | 2022-10-04 |
| TW202219287A (zh) | 2022-05-16 |
| MX2022009912A (es) | 2022-09-09 |
| KR102543580B1 (ko) | 2023-06-15 |
| JP2021126685A (ja) | 2021-09-02 |
| JP2021126704A (ja) | 2021-09-02 |
| CN115397605A (zh) | 2022-11-25 |
| EP4105349A4 (en) | 2023-09-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX2022009912A (es) | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. | |
| CN102936669B (zh) | 一种低熔点无铅焊料合金 | |
| MX2023008470A (es) | Aleacion de soldadura, bola de soldadura, arreglo de rejilla de bolas y junta de soldadura sin plomo y sin antimonio. | |
| WO2004096484A3 (de) | Lotmaterial auf snagcu-basis | |
| PH12015502404B1 (en) | Lead-free solder alloy | |
| KR19980068127A (ko) | 납땜용 무연 합금 | |
| MY194455A (en) | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint | |
| MY188098A (en) | Solder alloy, solder ball, solder preform, solder paste and solder joint | |
| MX2022009911A (es) | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. | |
| TW201417933A (zh) | 高強度無銀無鉛焊錫 | |
| CN101992362A (zh) | 一种适宜制粉的具有抗氧化能力的无铅焊料合金 | |
| TW201442818A (zh) | 抗高溫時效高強度無鉛焊錫 | |
| CN101716702A (zh) | 多元合金无镉低银钎料 | |
| EP2261964A4 (en) | LEAD-FREE SOLDERING CONNECTION STRUCTURE AND LOAD BALL | |
| CN100352596C (zh) | 一种含混合稀土的无铅软钎料及其制备方法 | |
| JP2010172902A (ja) | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 | |
| CN108927609B (zh) | 一种复合无铅锡膏的制备方法 | |
| JP2001287082A (ja) | はんだ合金 | |
| PH12020550954A1 (en) | Solder alloy and solder joint | |
| US20210339344A1 (en) | Lead-free solder paste with mixed solder powders for high temperature applications | |
| JP3353686B2 (ja) | はんだ合金 | |
| CN108381058A (zh) | 一种含Ga低银铜基高性能钎料及其制备方法 | |
| JPH046476B2 (es) | ||
| MX2021015960A (es) | Aleacion de soldadura, articulo fundido, articulo formado y junta de soldadura. | |
| JP2001225188A (ja) | ハンダ合金 |