MX2021015960A - Aleacion de soldadura, articulo fundido, articulo formado y junta de soldadura. - Google Patents
Aleacion de soldadura, articulo fundido, articulo formado y junta de soldadura.Info
- Publication number
- MX2021015960A MX2021015960A MX2021015960A MX2021015960A MX2021015960A MX 2021015960 A MX2021015960 A MX 2021015960A MX 2021015960 A MX2021015960 A MX 2021015960A MX 2021015960 A MX2021015960 A MX 2021015960A MX 2021015960 A MX2021015960 A MX 2021015960A
- Authority
- MX
- Mexico
- Prior art keywords
- article
- solder
- cast
- alloy
- solder alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/06—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
- B22D11/0611—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars formed by a single casting wheel, e.g. for casting amorphous metal strips or wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
- B22D21/027—Casting heavy metals with low melting point, i.e. less than 1000 degrees C, e.g. Zn 419 degrees C, Pb 327 degrees C, Sn 232 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Continuous Casting (AREA)
- Arc Welding In General (AREA)
Abstract
Se proporciona una aleación de soldadura con la cual es posible fundir un artículo fundido que tiene un espesor deseado, un artículo fundido, un artículo formado y una junta de soldadura. La aleación de soldadura tiene una composición de aleación que comprende, en términos de % en masa, 0.1-2.0% de Cu, 0.01-0.4% de Ni, 0.001-0.08% de P y 0.001-0.08% de Ge, siendo el resto Sn. La composición de la aleación satisface las expresiones (1) a (3). Expresión (1): (Cu + 5Ni) = 0.945% Expresión (2): (P + Ge) = 0.15% Expresión (3): 2.0 = (Cu + 5Ni)/(P + Ge) = 1000. En expresiones (1) a (3), Cu, Ni, P y Ge representan cada uno el contenido de componente (en % en masa) dentro de la aleación de soldadura.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019121359A JP6721851B1 (ja) | 2019-06-28 | 2019-06-28 | はんだ合金、鋳造物、形成物およびはんだ継手 |
PCT/JP2020/023190 WO2020262040A1 (ja) | 2019-06-28 | 2020-06-12 | はんだ合金、鋳造物、形成物およびはんだ継手 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021015960A true MX2021015960A (es) | 2022-02-03 |
Family
ID=71523938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021015960A MX2021015960A (es) | 2019-06-28 | 2020-06-12 | Aleacion de soldadura, articulo fundido, articulo formado y junta de soldadura. |
Country Status (9)
Country | Link |
---|---|
US (1) | US11607753B2 (es) |
EP (1) | EP3940096A4 (es) |
JP (1) | JP6721851B1 (es) |
KR (1) | KR102345176B1 (es) |
CN (1) | CN113727807B (es) |
BR (1) | BR112021026430B1 (es) |
MX (1) | MX2021015960A (es) |
TW (1) | TWI733502B (es) |
WO (1) | WO2020262040A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7007623B1 (ja) * | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6179935B1 (en) | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP2001191196A (ja) * | 1999-10-29 | 2001-07-17 | Topy Ind Ltd | ぬれ性、熱サイクル特性及び耐酸化性に優れたSn基Pbフリー半田 |
US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
US20030021718A1 (en) | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
GB2421030B (en) | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
EP1914035B1 (en) * | 2005-08-11 | 2014-08-06 | Senju Metal Industry Co., Ltd. | Lead free solder paste and application thereof |
US8641964B2 (en) * | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
KR20130073995A (ko) * | 2006-03-09 | 2013-07-03 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 무연 솔더 합금, 솔더 볼 및 전자 부재와, 자동차 탑재 전자 부재용 무연 솔더 합금, 솔더 볼 및 전자 부재 |
CN100439028C (zh) | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
CN101801588B (zh) * | 2007-07-13 | 2015-03-25 | 千住金属工业株式会社 | 车载安装用无铅焊料以及车载电路 |
CN101342642A (zh) * | 2008-08-25 | 2009-01-14 | 杨嘉骥 | 一种抗氧化低银无铅焊料 |
WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
JP5825265B2 (ja) * | 2013-01-16 | 2015-12-02 | 千住金属工業株式会社 | プリント基板のはんだ付け方法 |
CN103042315B (zh) * | 2013-01-22 | 2015-05-27 | 马莒生 | 耐热耐湿低熔点无铅焊料合金 |
JP6145164B2 (ja) * | 2013-09-11 | 2017-06-07 | 千住金属工業株式会社 | 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路 |
JP2017196647A (ja) | 2016-04-28 | 2017-11-02 | 住友金属鉱山株式会社 | Au−Sn−Ag−α系はんだ合金及びそのはんだ材料並びに該はんだ材料を用いて接合又は封止された実装基板 |
JP6365653B2 (ja) * | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | はんだ合金、はんだ継手およびはんだ付け方法 |
JP6119911B1 (ja) * | 2016-09-13 | 2017-04-26 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
EP3381601B1 (en) * | 2016-09-13 | 2020-12-02 | Senju Metal Industry Co., Ltd | Solder alloy, solder ball and solder joint |
JP6369620B1 (ja) | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
JP6439893B1 (ja) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN108941969A (zh) * | 2018-07-20 | 2018-12-07 | 广东中实金属有限公司 | 一种适用于压敏电阻的无铅焊料及其制备方法 |
JP6579253B1 (ja) * | 2018-11-09 | 2019-09-25 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
-
2019
- 2019-06-28 JP JP2019121359A patent/JP6721851B1/ja active Active
-
2020
- 2020-06-12 WO PCT/JP2020/023190 patent/WO2020262040A1/ja unknown
- 2020-06-12 MX MX2021015960A patent/MX2021015960A/es unknown
- 2020-06-12 CN CN202080029156.6A patent/CN113727807B/zh active Active
- 2020-06-12 KR KR1020217034074A patent/KR102345176B1/ko active IP Right Grant
- 2020-06-12 EP EP20831263.7A patent/EP3940096A4/en active Pending
- 2020-06-12 BR BR112021026430-2A patent/BR112021026430B1/pt active IP Right Grant
- 2020-06-12 US US17/603,500 patent/US11607753B2/en active Active
- 2020-06-22 TW TW109121061A patent/TWI733502B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3940096A4 (en) | 2022-09-07 |
JP6721851B1 (ja) | 2020-07-15 |
US20220143761A1 (en) | 2022-05-12 |
US11607753B2 (en) | 2023-03-21 |
CN113727807B (zh) | 2023-01-06 |
KR20210132209A (ko) | 2021-11-03 |
KR102345176B1 (ko) | 2021-12-30 |
BR112021026430B1 (pt) | 2023-03-28 |
BR112021026430A2 (pt) | 2022-02-15 |
TW202106434A (zh) | 2021-02-16 |
JP2021007951A (ja) | 2021-01-28 |
CN113727807A (zh) | 2021-11-30 |
EP3940096A1 (en) | 2022-01-19 |
TWI733502B (zh) | 2021-07-11 |
WO2020262040A1 (ja) | 2020-12-30 |
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