MX2021009104A - Aleacion de soldadura. - Google Patents

Aleacion de soldadura.

Info

Publication number
MX2021009104A
MX2021009104A MX2021009104A MX2021009104A MX2021009104A MX 2021009104 A MX2021009104 A MX 2021009104A MX 2021009104 A MX2021009104 A MX 2021009104A MX 2021009104 A MX2021009104 A MX 2021009104A MX 2021009104 A MX2021009104 A MX 2021009104A
Authority
MX
Mexico
Prior art keywords
solder alloy
alloy
solder
balance
mass
Prior art date
Application number
MX2021009104A
Other languages
English (en)
Inventor
Shunsaku Yoshikawa
Takashi Saito
Yuuki Iijima
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2021009104A publication Critical patent/MX2021009104A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

Abstract

Una aleación para soldar tiene una composición de aleación que consiste, en % de masa, en Ag: 0 a 4%, Cu: 0.1 a 1.0%, Ni: 0.01 a 0.3%, Sb: 5.1 a 7.5%, Bi: 0.1 a 4.5%, Co: 0.001 a 0.3%, P: 0.001 a 0.2%, y el resto es Sn.
MX2021009104A 2020-07-31 2021-07-28 Aleacion de soldadura. MX2021009104A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020130472A JP6836040B1 (ja) 2020-07-31 2020-07-31 はんだ合金

Publications (1)

Publication Number Publication Date
MX2021009104A true MX2021009104A (es) 2022-02-01

Family

ID=74661733

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021009104A MX2021009104A (es) 2020-07-31 2021-07-28 Aleacion de soldadura.

Country Status (8)

Country Link
US (1) US11577344B2 (es)
EP (1) EP3944923A1 (es)
JP (1) JP6836040B1 (es)
KR (1) KR102314989B1 (es)
CN (1) CN114055009A (es)
BR (1) BR102021014263B1 (es)
MX (1) MX2021009104A (es)
TW (1) TWI758214B (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
TW202406664A (zh) * 2022-08-12 2024-02-16 日商千住金屬工業股份有限公司 焊接合金、焊接膏及焊接接點
CN115156756B (zh) * 2022-08-25 2023-08-15 深圳市鑫富锦新材料有限公司 一种环保的低温无残留锡膏

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6192797A (ja) * 1984-10-12 1986-05-10 Furukawa Electric Co Ltd:The Ｓｎ−Ｓｂ系合金はんだ
JP2795115B2 (ja) * 1992-12-25 1998-09-10 日本鋼管株式会社 打ち抜き性および曲げ加工性の優れた高珪素鋼板
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
CN101934438A (zh) 2005-08-18 2011-01-05 千住金属工业株式会社 无铅低温焊料
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
BR112014032941A2 (pt) 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
EP3278920B1 (en) 2014-04-02 2020-03-04 Senju Metal Industry Co., Ltd. Use of a solder alloy for bonding in a module
JP5723056B1 (ja) 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP6200534B2 (ja) 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
CN106001978B (zh) 2015-03-24 2020-02-07 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
ES2830150T3 (es) 2015-07-24 2021-06-03 Harima Chemicals Inc Aleación de soldadura, pasta de soldadura y placa de circuito electrónico
JP6192797B1 (ja) 2016-03-16 2017-09-06 株式会社精工技研 光ファイバフェルール研磨用治具および載置部材
WO2017164194A1 (ja) 2016-03-22 2017-09-28 株式会社タムラ製作所 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置
JP6125084B1 (ja) 2016-11-17 2017-05-10 株式会社タムラ製作所 鉛フリーはんだ合金を用いたソルダペースト組成物、電子回路基板および電子制御装置
EP3449023B1 (en) 2016-05-06 2022-04-20 Alpha Assembly Solutions Inc. High reliability lead-free solder alloy
JP2018083211A (ja) * 2016-11-24 2018-05-31 ハリマ化成株式会社 ソルダペースト、フラックスおよび電子回路基板
JP2018140427A (ja) 2017-02-28 2018-09-13 千住金属工業株式会社 はんだ材料、はんだペースト、フォームはんだ及びはんだ継手
BR112019020490B1 (pt) 2017-03-31 2023-03-28 Senju Metal Industry Co., Ltd Liga de solda, pasta de solda e junta de solda
WO2019053866A1 (ja) * 2017-09-14 2019-03-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板及び電子制御装置
WO2020047481A1 (en) * 2018-08-31 2020-03-05 Indium Corporation Snbi and snin solder alloys
KR20240042569A (ko) 2018-10-24 2024-04-02 알파 어셈블리 솔루션스 인크. 중합체 기재, 인쇄 회로 기판 및 기타 접합 응용을 위한 저온 납땜 해법
JP6731037B2 (ja) 2018-12-28 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
JP7241716B2 (ja) 2020-04-06 2023-03-17 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置

Also Published As

Publication number Publication date
BR102021014263B1 (pt) 2022-09-13
CN114055009A (zh) 2022-02-18
US11577344B2 (en) 2023-02-14
JP6836040B1 (ja) 2021-02-24
TW202208097A (zh) 2022-03-01
TWI758214B (zh) 2022-03-11
KR102314989B1 (ko) 2021-10-21
BR102021014263A2 (pt) 2022-02-01
JP2022026827A (ja) 2022-02-10
EP3944923A1 (en) 2022-02-02
US20220032406A1 (en) 2022-02-03

Similar Documents

Publication Publication Date Title
MY188098A (en) Solder alloy, solder ball, solder preform, solder paste and solder joint
MX2021009104A (es) Aleacion de soldadura.
MY187838A (en) Solder alloy, solder powder, and solder paste, and solder joint using same
JP2017209732A5 (es)
JP2010029942A5 (es)
MY186516A (en) High impact toughness solder alloy
JP2003094195A5 (es)
MY195124A (en) Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, in-Vehicle Electronic Circuit, Ecu Electronic Circuit, In-Vehicle Electronic Circuit Device and Ecu Electronic Circuit Device
PH12019501934A1 (en) Solder material, solder paste, formed solder and solder joint
MY191908A (en) Lead-free solder alloy and solder joint part
MY153585A (en) Lead-free solder alloy having reduced shrinkage cavities
EP1614500A4 (en) WELDING IN PASTE
HRP20220954T1 (hr) Legura za lemljenje, pasta za lemljenje, kugla za lemljenje, lem s jezgrom od fluks smole, i lemni spoj
EP1705258A3 (en) Composition, methods and devices for high temperature lead-free solder
MX2023008470A (es) Aleacion de soldadura, bola de soldadura, arreglo de rejilla de bolas y junta de soldadura sin plomo y sin antimonio.
HRP20211378T1 (hr) Spojna legura, spojna pasta i spojni zglob
PH12020551403A1 (en) Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
TW200706662A (en) Cu-Ni-Si-Zn-Sn based alloy strip excellent in thermal peeling resistance of Tin plating, and Tin plated strip thereof
MX2016015710A (es) Aleacion de soldadura.
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
MY178830A (en) Solder ball, solder joint, and joining method
JP2017051984A5 (es)
MY195069A (en) Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board
MX2021015960A (es) Aleacion de soldadura, articulo fundido, articulo formado y junta de soldadura.
PH12020550954A1 (en) Solder alloy and solder joint