HRP20211378T1 - Spojna legura, spojna pasta i spojni zglob - Google Patents
Spojna legura, spojna pasta i spojni zglob Download PDFInfo
- Publication number
- HRP20211378T1 HRP20211378T1 HRP20211378TT HRP20211378T HRP20211378T1 HR P20211378 T1 HRP20211378 T1 HR P20211378T1 HR P20211378T T HRP20211378T T HR P20211378TT HR P20211378 T HRP20211378 T HR P20211378T HR P20211378 T1 HRP20211378 T1 HR P20211378T1
- Authority
- HR
- Croatia
- Prior art keywords
- solder
- alloy
- joint
- less
- paste
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title claims 7
- 239000000956 alloy Substances 0.000 title claims 7
- 229910000679 solder Inorganic materials 0.000 title 3
- 238000005219 brazing Methods 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Claims (3)
1. Legura za lemljenje koja ima sastav legure koji se u težinskim% sastoji od:
Ag: 1% do 4%;
Cu: 0,5% do 0,8%;
Bi: 4,9% ili više i 5,5% ili manje;
Sb: više od 1,5% i 5,5% ili manje;
Ni: 0,01% ili više i manje od 0,1%;
Co: više od 0,001% i 0,1% ili manje; i
ravnoteža je Sn,
pri čemu sastav legure zadovoljava sljedeće odnose (1) do (3):
[image]
pri čemu Ni, Co, Bi i Sb svaki predstavljaju sadržaj u masenim postocima u leguri za lemljenje.
2. Spojna pasta koja sadrži leguru za lemljenje prema zahtjevu 1.
3. Spoj za lemljenje koji sadrži leguru za lemljenje prema zahtjevu 1.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017073270 | 2017-03-31 | ||
EP18774478.4A EP3603877B1 (en) | 2017-03-31 | 2018-03-30 | Solder alloy, solder paste, and solder joint |
PCT/JP2018/013555 WO2018181873A1 (ja) | 2017-03-31 | 2018-03-30 | はんだ合金、ソルダペースト及びはんだ継手 |
Publications (1)
Publication Number | Publication Date |
---|---|
HRP20211378T1 true HRP20211378T1 (hr) | 2021-12-24 |
Family
ID=63676469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HRP20211378TT HRP20211378T1 (hr) | 2017-03-31 | 2018-03-30 | Spojna legura, spojna pasta i spojni zglob |
Country Status (16)
Country | Link |
---|---|
US (1) | US10967464B2 (hr) |
EP (1) | EP3603877B1 (hr) |
JP (1) | JP6447790B1 (hr) |
KR (1) | KR102071255B1 (hr) |
CN (1) | CN110430968B (hr) |
BR (1) | BR112019020490B1 (hr) |
DK (1) | DK3603877T3 (hr) |
ES (1) | ES2887361T3 (hr) |
HR (1) | HRP20211378T1 (hr) |
HU (1) | HUE056341T2 (hr) |
MX (1) | MX2019011465A (hr) |
MY (1) | MY188597A (hr) |
PH (1) | PH12019502148A1 (hr) |
PT (1) | PT3603877T (hr) |
TW (1) | TWI677580B (hr) |
WO (1) | WO2018181873A1 (hr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6624322B1 (ja) | 2019-03-27 | 2019-12-25 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
TWI814081B (zh) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
WO2021205760A1 (ja) * | 2020-04-10 | 2021-10-14 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手 |
JP6836040B1 (ja) | 2020-07-31 | 2021-02-24 | 千住金属工業株式会社 | はんだ合金 |
JP6936926B1 (ja) * | 2021-03-10 | 2021-09-22 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手 |
TWI778648B (zh) * | 2021-06-04 | 2022-09-21 | 岱暉股份有限公司 | 焊料合金 |
JP7421157B1 (ja) | 2022-08-12 | 2024-01-24 | 千住金属工業株式会社 | はんだ合金、はんだペースト及びはんだ継手 |
TW202406664A (zh) * | 2022-08-12 | 2024-02-16 | 日商千住金屬工業股份有限公司 | 焊接合金、焊接膏及焊接接點 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7607047A (nl) | 1976-06-28 | 1977-12-30 | Stamicarbon | Werkwijze voor het winnen van epsilon-caprolac- tam uit een epsilon-caprolactam-zwavelzuur- -reactiemengsel. |
JPS5349703A (en) | 1976-10-19 | 1978-05-06 | Nitto Tire | Pneumatic tire and rim assembly |
JPS53117216A (en) | 1977-03-23 | 1978-10-13 | Sugie Seitou Kk | Roof structure |
JPS5723056A (en) | 1980-07-17 | 1982-02-06 | Nippon Steel Corp | Preparation of molten lead-tin alloy plated steel plate with excellent plating appearance and corrosion resistance |
JPS6053248B2 (ja) | 1981-03-27 | 1985-11-25 | 工業技術院長 | 軟鋼等超厚板の水中ガス切断法 |
JPS6047254A (ja) | 1983-08-26 | 1985-03-14 | Hitachi Ltd | 光デイスクの作製方法 |
JPS6053248A (ja) | 1983-08-31 | 1985-03-26 | Daido Kogyo Co Ltd | スチ−ルベルト |
JP2005340275A (ja) | 2004-05-24 | 2005-12-08 | Denso Corp | 電子部品接合体、その製造方法、およびそれを含む電子装置 |
WO2014002304A1 (ja) * | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
WO2014013632A1 (ja) | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP5730354B2 (ja) * | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
JP5723056B1 (ja) | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
CN106001978B (zh) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | 无铅软钎料合金、电子电路基板和电子控制装置 |
JP6200534B2 (ja) | 2015-03-24 | 2017-09-20 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
WO2016179358A1 (en) * | 2015-05-05 | 2016-11-10 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
JP6053248B1 (ja) | 2015-07-24 | 2016-12-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
ES2830150T3 (es) * | 2015-07-24 | 2021-06-03 | Harima Chemicals Inc | Aleación de soldadura, pasta de soldadura y placa de circuito electrónico |
JP2016107343A (ja) * | 2015-12-24 | 2016-06-20 | 千住金属工業株式会社 | 鉛フリーはんだ合金と車載電子回路 |
JP6052381B2 (ja) * | 2015-12-24 | 2016-12-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
WO2017164194A1 (ja) | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置 |
JP6047254B1 (ja) | 2016-03-22 | 2016-12-21 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
JP2018083211A (ja) * | 2016-11-24 | 2018-05-31 | ハリマ化成株式会社 | ソルダペースト、フラックスおよび電子回路基板 |
-
2018
- 2018-03-30 BR BR112019020490-3A patent/BR112019020490B1/pt active IP Right Grant
- 2018-03-30 WO PCT/JP2018/013555 patent/WO2018181873A1/ja active Application Filing
- 2018-03-30 PT PT187744784T patent/PT3603877T/pt unknown
- 2018-03-30 MX MX2019011465A patent/MX2019011465A/es active IP Right Grant
- 2018-03-30 TW TW107111117A patent/TWI677580B/zh active
- 2018-03-30 EP EP18774478.4A patent/EP3603877B1/en active Active
- 2018-03-30 MY MYPI2019005323A patent/MY188597A/en unknown
- 2018-03-30 HU HUE18774478A patent/HUE056341T2/hu unknown
- 2018-03-30 KR KR1020197027240A patent/KR102071255B1/ko active IP Right Grant
- 2018-03-30 US US16/498,843 patent/US10967464B2/en active Active
- 2018-03-30 JP JP2018538810A patent/JP6447790B1/ja active Active
- 2018-03-30 HR HRP20211378TT patent/HRP20211378T1/hr unknown
- 2018-03-30 CN CN201880018715.6A patent/CN110430968B/zh active Active
- 2018-03-30 DK DK18774478.4T patent/DK3603877T3/da active
- 2018-03-30 ES ES18774478T patent/ES2887361T3/es active Active
-
2019
- 2019-09-19 PH PH12019502148A patent/PH12019502148A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
BR112019020490B1 (pt) | 2023-03-28 |
PT3603877T (pt) | 2021-09-09 |
CN110430968A (zh) | 2019-11-08 |
JPWO2018181873A1 (ja) | 2019-04-04 |
DK3603877T3 (da) | 2021-09-06 |
PH12019502148B1 (en) | 2020-06-08 |
HUE056341T2 (hu) | 2022-02-28 |
EP3603877A4 (en) | 2020-02-05 |
JP6447790B1 (ja) | 2019-01-09 |
WO2018181873A1 (ja) | 2018-10-04 |
US10967464B2 (en) | 2021-04-06 |
US20200114475A1 (en) | 2020-04-16 |
TWI677580B (zh) | 2019-11-21 |
TW201842206A (zh) | 2018-12-01 |
MX2019011465A (es) | 2019-11-01 |
KR20190112166A (ko) | 2019-10-02 |
EP3603877A1 (en) | 2020-02-05 |
KR102071255B1 (ko) | 2020-01-31 |
MY188597A (en) | 2021-12-22 |
CN110430968B (zh) | 2021-07-16 |
ES2887361T3 (es) | 2021-12-22 |
BR112019020490A2 (pt) | 2020-04-28 |
EP3603877B1 (en) | 2021-08-11 |
PH12019502148A1 (en) | 2020-06-08 |
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