MX2022011589A - Aleacion de soldadura, bola de soldadura y junta de soldadura. - Google Patents
Aleacion de soldadura, bola de soldadura y junta de soldadura.Info
- Publication number
- MX2022011589A MX2022011589A MX2022011589A MX2022011589A MX2022011589A MX 2022011589 A MX2022011589 A MX 2022011589A MX 2022011589 A MX2022011589 A MX 2022011589A MX 2022011589 A MX2022011589 A MX 2022011589A MX 2022011589 A MX2022011589 A MX 2022011589A
- Authority
- MX
- Mexico
- Prior art keywords
- solder
- formula
- alloy
- joint
- ball
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 229910045601 alloy Inorganic materials 0.000 title abstract 6
- 239000000956 alloy Substances 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Abstract
Se proporcionan una aleación de soldadura, una bola de soldadura, y una junta de soldadura que tienen un excelente rendimiento de contacto del pasador y una fuerza de unión elevada. La aleación de soldadura tiene una composición de aleación que consiste, en % en masa, de Ag: 0.8 a 1.5 %, Cu: 0.1 a 1.0 %, Ni: 0.01 a 0.10 % y P: 0.006 % a 0.009 %, siendo el resto Sn. La composición de la aleación satisface preferentemente las siguientes relaciones (1) y (2) 2.0 = Ag x Cu x Ni/P = 25; 0.500 = Sn ? P = 0.778. Los elementos Ag, Cu, Ni, P y Sn en las relaciones (1) y (2) representan cada uno los contenidos (en % en masa) en la composición de la aleación.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020048691A JP7068370B2 (ja) | 2020-03-19 | 2020-03-19 | はんだ合金、はんだボールおよびはんだ継手 |
| PCT/JP2021/009530 WO2021187271A1 (ja) | 2020-03-19 | 2021-03-10 | はんだ合金、はんだボールおよびはんだ継手 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2022011589A true MX2022011589A (es) | 2022-10-18 |
Family
ID=77768268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022011589A MX2022011589A (es) | 2020-03-19 | 2021-03-10 | Aleacion de soldadura, bola de soldadura y junta de soldadura. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230129147A1 (es) |
| JP (3) | JP7068370B2 (es) |
| KR (1) | KR102583568B1 (es) |
| CN (1) | CN115335186A (es) |
| BR (1) | BR112022018499A2 (es) |
| MX (1) | MX2022011589A (es) |
| TW (1) | TWI753800B (es) |
| WO (1) | WO2021187271A1 (es) |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030442U (es) | 1973-06-23 | 1975-04-05 | ||
| JPS5633837U (es) | 1979-08-24 | 1981-04-02 | ||
| JPH06155068A (ja) * | 1992-11-19 | 1994-06-03 | Matsushita Electric Ind Co Ltd | クリーム半田材料 |
| JP4079026B2 (ja) * | 2002-04-16 | 2008-04-23 | 唯知 須賀 | 無残渣ソルダペースト |
| JP2004141910A (ja) | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| KR20050030237A (ko) * | 2004-11-13 | 2005-03-29 | 삼성전자주식회사 | 무연 솔더 합금 |
| EP1924394A2 (en) * | 2005-08-24 | 2008-05-28 | FRY'S METALS, INC. d/b/a ALPHA METALS, INC. | Solder alloy |
| JP5030442B2 (ja) | 2006-03-09 | 2012-09-19 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
| WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
| EP2886243B1 (en) | 2012-06-30 | 2018-03-14 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
| JP5893528B2 (ja) * | 2012-07-27 | 2016-03-23 | 新日鉄住金マテリアルズ株式会社 | 無鉛はんだバンプ接合構造 |
| US20160279741A1 (en) * | 2015-03-24 | 2016-09-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit board, and electronic control device |
| JP6281157B2 (ja) * | 2015-09-30 | 2018-02-21 | オリジン電気株式会社 | 還元ガス用ソルダペースト、半田付け製品の製造方法 |
| EP4036262A1 (en) * | 2016-05-06 | 2022-08-03 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| JP6592815B1 (ja) * | 2018-09-25 | 2019-10-23 | 株式会社コナミアミューズメント | ゲーム装置 |
-
2020
- 2020-03-19 JP JP2020048691A patent/JP7068370B2/ja active Active
-
2021
- 2021-03-10 KR KR1020227032379A patent/KR102583568B1/ko active IP Right Grant
- 2021-03-10 WO PCT/JP2021/009530 patent/WO2021187271A1/ja unknown
- 2021-03-10 MX MX2022011589A patent/MX2022011589A/es unknown
- 2021-03-10 BR BR112022018499A patent/BR112022018499A2/pt not_active Application Discontinuation
- 2021-03-10 US US17/912,384 patent/US20230129147A1/en active Pending
- 2021-03-10 CN CN202180022148.3A patent/CN115335186A/zh active Pending
- 2021-03-17 TW TW110109525A patent/TWI753800B/zh active
- 2021-09-15 JP JP2021150213A patent/JP2021192924A/ja active Pending
- 2021-09-15 JP JP2021150212A patent/JP2021192923A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021192923A (ja) | 2021-12-23 |
| CN115335186A (zh) | 2022-11-11 |
| WO2021187271A1 (ja) | 2021-09-23 |
| KR20220143112A (ko) | 2022-10-24 |
| TW202140807A (zh) | 2021-11-01 |
| BR112022018499A2 (pt) | 2022-10-25 |
| EP4122639A1 (en) | 2023-01-25 |
| KR102583568B1 (ko) | 2023-10-05 |
| JP7068370B2 (ja) | 2022-05-16 |
| TWI753800B (zh) | 2022-01-21 |
| JP2021169099A (ja) | 2021-10-28 |
| US20230129147A1 (en) | 2023-04-27 |
| JP2021192924A (ja) | 2021-12-23 |
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