JP2020025982A5 - - Google Patents

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Publication number
JP2020025982A5
JP2020025982A5 JP2018181045A JP2018181045A JP2020025982A5 JP 2020025982 A5 JP2020025982 A5 JP 2020025982A5 JP 2018181045 A JP2018181045 A JP 2018181045A JP 2018181045 A JP2018181045 A JP 2018181045A JP 2020025982 A5 JP2020025982 A5 JP 2020025982A5
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JP
Japan
Prior art keywords
mass
lead
free solder
solder alloy
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018181045A
Other languages
English (en)
Japanese (ja)
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JP2020025982A (ja
JP7287606B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to PCT/JP2019/037903 priority Critical patent/WO2020067307A1/ja
Priority to CN201980062723.5A priority patent/CN112752630A/zh
Priority to KR1020217011906A priority patent/KR20210062060A/ko
Publication of JP2020025982A publication Critical patent/JP2020025982A/ja
Publication of JP2020025982A5 publication Critical patent/JP2020025982A5/ja
Application granted granted Critical
Publication of JP7287606B2 publication Critical patent/JP7287606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018181045A 2018-08-10 2018-09-26 鉛フリーはんだ合金 Active JP7287606B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/037903 WO2020067307A1 (ja) 2018-08-10 2019-09-26 鉛フリーはんだ合金
CN201980062723.5A CN112752630A (zh) 2018-08-10 2019-09-26 无铅焊料合金
KR1020217011906A KR20210062060A (ko) 2018-08-10 2019-09-26 무연땜납합금

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018151991 2018-08-10
JP2018151991 2018-08-10

Publications (3)

Publication Number Publication Date
JP2020025982A JP2020025982A (ja) 2020-02-20
JP2020025982A5 true JP2020025982A5 (es) 2022-01-11
JP7287606B2 JP7287606B2 (ja) 2023-06-06

Family

ID=69620807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018181045A Active JP7287606B2 (ja) 2018-08-10 2018-09-26 鉛フリーはんだ合金

Country Status (4)

Country Link
JP (1) JP7287606B2 (es)
KR (1) KR20210062060A (es)
CN (1) CN112752630A (es)
WO (1) WO2020067307A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
CN114055010A (zh) * 2021-11-05 2022-02-18 安徽工业大学 一种含微量Ge的铜基合金钎料、制备方法及其钎焊方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU228385B1 (en) 1993-01-19 2013-03-28 Endorech Inc Use of dehydroepiandrosterone for the preparation of a medicament for the treatment of sexual disordes
WO1999048639A1 (fr) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
CN101288923A (zh) * 2008-02-27 2008-10-22 重庆机电职业技术学院 一种低铜亚共晶Sn-Cu无铅钎料
JP4968381B2 (ja) * 2008-04-23 2012-07-04 千住金属工業株式会社 鉛フリーはんだ
JP2011156558A (ja) * 2010-01-30 2011-08-18 Nihon Superior Co Ltd 鉛フリーはんだ合金
WO2012131861A1 (ja) * 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
TWI655052B (zh) 2012-10-09 2019-04-01 美商‧阿爾發裝配解決方案公司 無鉛、無銻焊接合金、彼之用途、包含彼之焊接點，以及形成焊接點之方法
SG11201608933SA (en) 2014-04-30 2016-12-29 Nihon Superior Co Ltd Lead-free solder alloy
JP2017087248A (ja) 2015-11-08 2017-05-25 株式会社日本スペリア社 はんだペースト組成物
GR1009565B (el) 2016-07-14 2019-08-06 Galenica Α.Ε. Νεα παραγωγα 1,2,4-τριαζολο-[3,4-b]-1,3,4-θειαδιαζολιων
JP6119912B1 (ja) 2016-09-13 2017-04-26 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手
WO2018174162A1 (ja) 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
JP2019141881A (ja) 2018-02-21 2019-08-29 千住金属工業株式会社 鉛フリーはんだ合金

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