RU2016146520A - Бессвинцовый припой - Google Patents

Бессвинцовый припой Download PDF

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Publication number
RU2016146520A
RU2016146520A RU2016146520A RU2016146520A RU2016146520A RU 2016146520 A RU2016146520 A RU 2016146520A RU 2016146520 A RU2016146520 A RU 2016146520A RU 2016146520 A RU2016146520 A RU 2016146520A RU 2016146520 A RU2016146520 A RU 2016146520A
Authority
RU
Russia
Prior art keywords
free solder
lead
solder according
paragraphs
lead free
Prior art date
Application number
RU2016146520A
Other languages
English (en)
Other versions
RU2662176C2 (ru
RU2016146520A3 (ru
Inventor
Тецуро НИСИМУРА
Такатоси НИСИМУРА
Original Assignee
Нихон Супериор Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Нихон Супериор Ко., Лтд. filed Critical Нихон Супериор Ко., Лтд.
Publication of RU2016146520A publication Critical patent/RU2016146520A/ru
Publication of RU2016146520A3 publication Critical patent/RU2016146520A3/ru
Application granted granted Critical
Publication of RU2662176C2 publication Critical patent/RU2662176C2/ru

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Claims (14)

1. Бессвинцовый припой, содержащий:
76,0-99,5 мас.% Sn;
0,1-2,0 мас.% Cu;
0,01-0,5 мас.% Ni;
0,1-5,0 мас.% Bi;
0,001-1,0 мас.% Ge; и
неизбежные примеси.
2. Бессвинцовый припой по п. 1, в который добавлены один или два или более элементов, выбранных из 0,1-5,0 мас.% Sb, 0,1-10,0 мас.% In и 0,001-1,0 мас.% Ga.
3. Бессвинцовый припой по п. 1 или 2, в котором Bi содержится в количестве от 0,5 до 4 мас.%.
4. Бессвинцовый припой по любому из пп. 1-3, в котором Bi содержится в количестве от 1 до 3 мас.%.
5. Бессвинцовый припой по любому из пп. 1-4, в котором Ge содержится в количестве от 0,001 до 0,1 мас.%.
6. Бессвинцовый припой по любому из пп. 1-5, в котором In содержится в количестве от 0,1 до 6 мас.%.
7. Бессвинцовый припой по любому из пп. 1-6, дополнительно содержащий по меньшей мере один элемент из P, Co, Ti, Al и Ag.
8. Паяное соединение, использующее бессвинцовый припой по любому из пп. 1-7.
RU2016146520A 2014-04-30 2015-04-28 Бессвинцовый припой RU2662176C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-094277 2014-04-30
JP2014094277 2014-04-30
JP2015004403 2015-01-13
JP2015-004403 2015-01-13
PCT/JP2015/062818 WO2015166945A1 (ja) 2014-04-30 2015-04-28 鉛フリーはんだ合金

Related Child Applications (2)

Application Number Title Priority Date Filing Date
RU2018118007A Division RU2695791C2 (ru) 2014-04-30 2015-04-28 Бессвинцовый припой
RU2018118008A Division RU2018118008A (ru) 2014-04-30 2015-04-28 Бессвинцовый припой

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Publication Number Publication Date
RU2016146520A true RU2016146520A (ru) 2018-05-30
RU2016146520A3 RU2016146520A3 (ru) 2018-05-30
RU2662176C2 RU2662176C2 (ru) 2018-07-24

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RU2018118008A RU2018118008A (ru) 2014-04-30 2015-04-28 Бессвинцовый припой
RU2018118007A RU2695791C2 (ru) 2014-04-30 2015-04-28 Бессвинцовый припой

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Country Status (15)

Country Link
US (1) US10286497B2 (ru)
EP (2) EP3708292A1 (ru)
JP (3) JP5872114B1 (ru)
KR (1) KR20160147996A (ru)
CN (3) CN114161023A (ru)
AU (1) AU2015254179B2 (ru)
BR (2) BR122021001612B1 (ru)
CA (1) CA2946994C (ru)
HK (1) HK1259425A1 (ru)
MX (2) MX2016014012A (ru)
MY (1) MY188657A (ru)
PH (1) PH12016502152B1 (ru)
RU (3) RU2662176C2 (ru)
SG (1) SG11201608933SA (ru)
WO (1) WO2015166945A1 (ru)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160147996A (ko) * 2014-04-30 2016-12-23 가부시키가이샤 니혼슈페리어샤 무연솔더합금
JP6788337B2 (ja) * 2015-10-16 2020-11-25 Ａｇｃ株式会社 接合用組成物
JP6504401B2 (ja) * 2015-11-05 2019-04-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
CN105665956A (zh) * 2016-03-23 2016-06-15 徐宏达 一种用于钎焊铝及其合金的软钎料合金
JP6755546B2 (ja) * 2016-08-09 2020-09-16 株式会社日本スペリア社 接合方法
PT3381601T (pt) * 2016-09-13 2021-01-05 Senju Metal Industry Co Liga de solda, esferas de solda e juntas de solda
CN106825983B (zh) * 2017-03-10 2020-05-05 南京达迈科技实业有限公司 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用
WO2018174162A1 (ja) * 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
DK3603877T3 (da) 2017-03-31 2021-09-06 Senju Metal Industry Co Loddelegering, loddepasta og loddeforbindelse
KR102563840B1 (ko) * 2017-06-22 2023-08-07 에이지씨 가부시키가이샤 창재, 광학 패키지
CN107671451A (zh) * 2017-08-21 2018-02-09 番禺得意精密电子工业有限公司 电连接器及其焊料
US11123823B2 (en) * 2017-11-08 2021-09-21 Alpha Assembly Solutions Inc. Cost-effective lead-free solder alloy for electronic applications
JP7420363B2 (ja) * 2018-03-06 2024-01-23 株式会社日本スペリア社 はんだ継手
JP7287606B2 (ja) * 2018-08-10 2023-06-06 株式会社日本スペリア社 鉛フリーはんだ合金
CN108994480A (zh) * 2018-10-10 2018-12-14 云南锡业锡材有限公司 一种SnBiAgCu高可靠性无铅焊料合金
CN109702374B (zh) * 2019-02-13 2021-02-09 南昌大学 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法
PL3828294T3 (pl) * 2019-04-11 2023-03-13 Nihon Superior Co., Ltd. Bezołowiowy stop lutowniczy i element połączenia lutowanego
CN110315238B (zh) * 2019-07-31 2021-09-17 广东省科学院中乌焊接研究所 一种碳纳米管增强无铅钎料、其制备方法及其应用
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
EP4249165A4 (en) * 2020-11-19 2024-05-15 Senju Metal Industry Co., Ltd. WELDING ALLOY, WELDING GLOBULE AND SOFT SOLDER JOINT
KR20220091404A (ko) * 2020-12-23 2022-06-30 엠케이전자 주식회사 무연 솔더 합금, 그를 포함하는 솔더 페이스트, 및 그를 포함하는 반도체 부품
JP2023060639A (ja) * 2021-10-18 2023-04-28 Tdk株式会社 はんだ組成物および電子部品

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879096A (en) 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
KR19980068127A (ko) 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
KR100377232B1 (ko) 1998-03-26 2003-03-26 니혼 슈페리어 샤 가부시키 가이샤 무연땜납합금
JP3363393B2 (ja) * 1998-12-21 2003-01-08 千住金属工業株式会社 鉛フリーはんだ合金
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3262113B2 (ja) * 1999-01-29 2002-03-04 富士電機株式会社 はんだ合金
JP3775172B2 (ja) 2000-05-22 2006-05-17 株式会社村田製作所 はんだ組成物およびはんだ付け物品
DE60019651T2 (de) 2000-11-16 2005-09-22 Singapore Asahi Chemical & Solder Industries Pte. Ltd. Bleifreies weichlot
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки
US7172726B2 (en) * 2002-10-15 2007-02-06 Senju Metal Industry Co., Ltd. Lead-free solder
JP4401671B2 (ja) 2003-03-31 2010-01-20 千住金属工業株式会社 高温鉛フリーはんだ合金および電子部品
GB2406101C (en) 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
JP2006255762A (ja) 2005-03-18 2006-09-28 Uchihashi Estec Co Ltd 電子部品用線状はんだ
TWI465312B (zh) 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
US8641964B2 (en) * 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy
CN1788918A (zh) * 2005-12-20 2006-06-21 徐振五 无铅环保焊料
US20070172381A1 (en) 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
CN100439028C (zh) 2007-01-24 2008-12-03 太仓市南仓金属材料有限公司 一种无铅软钎锡焊料
WO2009013114A1 (de) 2007-07-20 2009-01-29 Inventio Ag Verfahren zur ermittlung der geschwindigkeit einer aufzugskabine und eine steuereinheit zur durchführung dieses verfahrens
CN101214591B (zh) * 2008-01-18 2010-11-24 重庆工学院 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料
WO2009104271A1 (ja) * 2008-02-22 2009-08-27 株式会社日本スペリア社 Ｎｉを含む無鉛はんだのＮｉ濃度調整法
CN102066042B (zh) * 2008-04-23 2016-03-23 千住金属工业株式会社 无铅焊料
EP2275224B1 (en) * 2008-04-23 2014-01-22 Senju Metal Industry Co., Ltd Lead-free solder alloy suppressed in occurrence of shrinkage cavity
CN101585119A (zh) * 2009-02-26 2009-11-25 郴州金箭焊料有限公司 抗氧化低银无铅焊料合金
JP2011251310A (ja) * 2010-06-02 2011-12-15 Nippon Genma:Kk 鉛フリーはんだ合金
JP4787384B1 (ja) * 2010-10-29 2011-10-05 ハリマ化成株式会社 低銀はんだ合金およびはんだペースト組成物
JP5784109B2 (ja) * 2011-04-15 2015-09-24 株式会社日本スペリア社 鉛フリーはんだ合金
JP2013000744A (ja) * 2011-06-10 2013-01-07 Nihon Superior Co Ltd 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
WO2014002304A1 (ja) 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP5238088B1 (ja) * 2012-06-29 2013-07-17 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US8875253B2 (en) * 2012-07-03 2014-10-28 Facebook, Inc. Trust metrics on shared computers
ES2628028T3 (es) 2012-10-09 2017-08-01 Alpha Assembly Solutions Inc. Soldadura de estaño libre de plomo y libre de antimonio fiable a altas temperaturas
TWI460046B (zh) * 2012-11-12 2014-11-11 Accurus Scient Co Ltd High strength silver-free lead-free solder
CN103008904B (zh) * 2012-11-28 2015-04-08 一远电子科技有限公司 一种SnCuNiGaGeIn系无银无铅焊料合金
TWI576195B (zh) 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20160147996A (ko) * 2014-04-30 2016-12-23 가부시키가이샤 니혼슈페리어샤 무연솔더합금

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Publication number Publication date
PH12016502152A1 (en) 2017-01-16
BR112016024855B1 (pt) 2021-05-04
RU2695791C2 (ru) 2019-07-26
JPWO2015166945A1 (ja) 2017-04-20
JP2016129907A (ja) 2016-07-21
JP2016129908A (ja) 2016-07-21
CA2946994C (en) 2020-04-14
RU2018118008A3 (ru) 2019-01-25
EP3708292A1 (en) 2020-09-16
EP3138658B1 (en) 2020-11-04
JP6339993B2 (ja) 2018-06-06
EP3138658A4 (en) 2018-04-11
JP5872114B1 (ja) 2016-03-01
RU2018118007A3 (ru) 2019-02-01
CA2946994A1 (en) 2015-11-05
KR20160147996A (ko) 2016-12-23
AU2015254179B2 (en) 2017-07-20
CN105339131A (zh) 2016-02-17
US10286497B2 (en) 2019-05-14
CN108515289A (zh) 2018-09-11
RU2018118007A (ru) 2018-11-02
MY188657A (en) 2021-12-22
RU2662176C2 (ru) 2018-07-24
EP3138658A1 (en) 2017-03-08
AU2015254179A1 (en) 2016-11-17
HK1259425A1 (zh) 2019-11-29
BR122021001612B1 (pt) 2021-10-13
WO2015166945A1 (ja) 2015-11-05
PH12016502152B1 (en) 2017-01-16
BR112016024855A2 (pt) 2017-08-15
SG11201608933SA (en) 2016-12-29
US20160368102A1 (en) 2016-12-22
RU2018118008A (ru) 2018-11-02
MX2021000260A (es) 2021-04-12
CN114161023A (zh) 2022-03-11
RU2016146520A3 (ru) 2018-05-30
MX2016014012A (es) 2017-01-11

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