CN105290638A - 一种加镉焊锡条 - Google Patents

一种加镉焊锡条 Download PDF

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Publication number
CN105290638A
CN105290638A CN201510850424.1A CN201510850424A CN105290638A CN 105290638 A CN105290638 A CN 105290638A CN 201510850424 A CN201510850424 A CN 201510850424A CN 105290638 A CN105290638 A CN 105290638A
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CN
China
Prior art keywords
content
cadmium
soldering tin
tin
rare earth
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Pending
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CN201510850424.1A
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English (en)
Inventor
杨伟帅
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Suzhou Lotte Chemical Technology Co Ltd
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Suzhou Lotte Chemical Technology Co Ltd
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Priority to CN201510850424.1A priority Critical patent/CN105290638A/zh
Publication of CN105290638A publication Critical patent/CN105290638A/zh
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种加镉焊锡条,包括锡、铅、铜、银元素,还含有镉元素和稀土合金,所述铅含量为6-8%,所述铜含量为1-2.5%,所述银含量为0.1-1.2%,所述镉含量为5-8.5%,所述稀土合金含量为3.6-5.8%,其余为锡,所述含量为重量百分比。通过上述方式,本发明加镉焊锡条大幅度降低了镉的含量,降低了加镉焊锡条的毒性,降低了对操作者身体和对环境的不良影响,使用效果更加环保。

Description

一种加镉焊锡条
技术领域
本发明涉及焊锡条领域,特别是涉及一种加镉焊锡条。
背景技术
在某些对温度比较敏感的场合焊接时,通常可以使用加镉焊锡,它的熔点在145℃,所以称之为超低温焊锡丝,现有的加镉焊锡条中镉的含量一般为15%以上,但由于镉的毒性较强,所以应慎谨使用。
发明内容
本发明主要解决的技术问题是提供一种大幅度降低了镉的含量、降低了加镉焊锡条的毒性的加镉焊锡条。
为解决上述技术问题,本发明提供一种加镉焊锡条,包括锡、铅、铜、银元素,还含有镉元素和稀土合金,所述铅含量为6-8%,所述铜含量为1-2.5%,所述银含量为0.1-1.2%,所述镉含量为5-8.5%,所述稀土合金含量为3.6-5.8%,其余为锡,所述含量为重量百分比。
在本发明一个较佳实施例中,所述铅含量为6%,所述铜含量为1%,所述银含量为0.1%,所述镉含量为5%,所述稀土合金含量为3.6%,其余为锡,所述含量为重量百分比。
在本发明一个较佳实施例中,所述铅含量为8%,所述铜含量为2.5%,所述银含量为1.2%,所述镉含量为8.5%,所述稀土合金含量为5.8%,其余为锡,所述含量为重量百分比。
在本发明一个较佳实施例中,所述铅含量为7.5%,所述铜含量为1.3%,所述银含量为0.75%,所述镉含量为5.6%,所述稀土合金含量为4.5%,其余为锡,所述含量为重量百分比。
本发明的有益效果是:本发明加镉焊锡条大幅度降低了镉的含量,降低了加镉焊锡条的毒性,降低了对操作者身体和对环境的不良影响,使用效果更加环保。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例1
一种加镉焊锡条,除了包括锡、铅、铜、银元素之外,还含有镉元素和稀土合金,所述铅含量为6%,所述铜含量为1%,所述银含量为0.1%,所述镉含量为5%,所述稀土合金含量为3.6%,其余为锡,所述含量为重量百分比。
实施例2
一种加镉焊锡条,除了包括锡、铅、铜、银元素之外,还含有镉元素和稀土合金,所述铅含量为8%,所述铜含量为2.5%,所述银含量为1.2%,所述镉含量为8.5%,所述稀土合金含量为5.8%,其余为锡,所述含量为重量百分比。
实施例3
一种加镉焊锡条,除了包括锡、铅、铜、银元素之外,还含有镉元素和稀土合金,所述铅含量为7.5%,所述铜含量为1.3%,所述银含量为0.75%,所述镉含量为5.6%,所述稀土合金含量为4.5%,其余为锡,所述含量为重量百分比
区别于现有技术,本发明加镉焊锡条大幅度降低了镉的含量,降低了加镉焊锡条的毒性,降低了对操作者身体和对环境的不良影响,使用效果更加环保。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书内容所作的等效结构或等效流程变换,或直接或间接运用在其它相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (4)

1.一种加镉焊锡条,其特征在于,包括锡、铅、铜、银元素,还含有镉元素和稀土合金,所述铅含量为6-8%,所述铜含量为1-2.5%,所述银含量为0.1-1.2%,所述镉含量为5-8.5%,所述稀土合金含量为3.6-5.8%,其余为锡,所述含量为重量百分比。
2.根据权利要求1所述的加镉焊锡条,其特征在于,所述铅含量为6%,所述铜含量为1%,所述银含量为0.1%,所述镉含量为5%,所述稀土合金含量为3.6%,其余为锡,所述含量为重量百分比。
3.根据权利要求1所述的加镉焊锡条,其特征在于,所述铅含量为8%,所述铜含量为2.5%,所述银含量为1.2%,所述镉含量为8.5%,所述稀土合金含量为5.8%,其余为锡,所述含量为重量百分比。
4.根据权利要求1所述的加镉焊锡条,其特征在于,所述铅含量为7.5%,所述铜含量为1.3%,所述银含量为0.75%,所述镉含量为5.6%,所述稀土合金含量为4.5%,其余为锡,所述含量为重量百分比。
CN201510850424.1A 2015-11-30 2015-11-30 一种加镉焊锡条 Pending CN105290638A (zh)

Priority Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105618954A (zh) * 2016-03-15 2016-06-01 力创(台山)电子科技有限公司 一种用于电液伺服阀组装工艺焊接的焊料

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4885459A (zh) * 1972-02-19 1973-11-13
JPS5772789A (en) * 1980-10-27 1982-05-07 Taruchin Kk Solder alloy
EP0652072A1 (en) * 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Solder
CN1712175A (zh) * 2005-07-14 2005-12-28 上海上电电容器有限公司 低温焊料
CN101125396A (zh) * 2006-08-17 2008-02-20 黄柏山 锡膏及其应用于热压焊接的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4885459A (zh) * 1972-02-19 1973-11-13
JPS5772789A (en) * 1980-10-27 1982-05-07 Taruchin Kk Solder alloy
EP0652072A1 (en) * 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Solder
CN1110203A (zh) * 1993-11-09 1995-10-18 松下电器产业株式会社 钎料
CN1712175A (zh) * 2005-07-14 2005-12-28 上海上电电容器有限公司 低温焊料
CN101125396A (zh) * 2006-08-17 2008-02-20 黄柏山 锡膏及其应用于热压焊接的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105618954A (zh) * 2016-03-15 2016-06-01 力创(台山)电子科技有限公司 一种用于电液伺服阀组装工艺焊接的焊料

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Application publication date: 20160203