SG11201608933SA - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- SG11201608933SA SG11201608933SA SG11201608933SA SG11201608933SA SG11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA SG 11201608933S A SG11201608933S A SG 11201608933SA
- Authority
- SG
- Singapore
- Prior art keywords
- lead
- free solder
- solder alloy
- alloy
- free
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094277 | 2014-04-30 | ||
| JP2015004403 | 2015-01-13 | ||
| PCT/JP2015/062818 WO2015166945A1 (en) | 2014-04-30 | 2015-04-28 | Lead-free solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201608933SA true SG11201608933SA (en) | 2016-12-29 |
Family
ID=54358672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201608933SA SG11201608933SA (en) | 2014-04-30 | 2015-04-28 | Lead-free solder alloy |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US10286497B2 (en) |
| EP (2) | EP3708292A1 (en) |
| JP (3) | JP5872114B1 (en) |
| KR (1) | KR20160147996A (en) |
| CN (3) | CN105339131A (en) |
| AU (1) | AU2015254179B2 (en) |
| BR (2) | BR112016024855B1 (en) |
| CA (1) | CA2946994C (en) |
| HK (1) | HK1259425A1 (en) |
| MX (2) | MX2016014012A (en) |
| MY (1) | MY188657A (en) |
| PH (1) | PH12016502152B1 (en) |
| RU (3) | RU2018118008A (en) |
| SG (1) | SG11201608933SA (en) |
| WO (1) | WO2015166945A1 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10286497B2 (en) * | 2014-04-30 | 2019-05-14 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| JP6788337B2 (en) * | 2015-10-16 | 2020-11-25 | Ａｇｃ株式会社 | Composition for bonding |
| JP6504401B2 (en) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | Solder alloy and mounting structure using the same |
| CN105665956A (en) * | 2016-03-23 | 2016-06-15 | 徐宏达 | Soft solder alloy used for brazing aluminum and brazing aluminum alloy |
| JP6755546B2 (en) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | Joining method |
| EP3381601B1 (en) * | 2016-09-13 | 2020-12-02 | Senju Metal Industry Co., Ltd | Solder alloy, solder ball and solder joint |
| CN106825983B (en) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | SnAgSbNi series lead-free soldering tin alloy and preparation method and application thereof |
| WO2018174162A1 (en) * | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | Solder joint |
| ES2887361T3 (en) * | 2017-03-31 | 2021-12-22 | Senju Metal Industry Co | Solder Alloy, Solder Paste and Solder Bond |
| WO2018235925A1 (en) * | 2017-06-22 | 2018-12-27 | Ａｇｃ株式会社 | Window material, and optical package |
| CN107671451A (en) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | Electric connector and its solder |
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| JP7420363B2 (en) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | solder joints |
| JP7287606B2 (en) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | Lead-free solder alloy |
| CN108994480A (en) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | A kind of SnBiAgCu high-reliability lead-free solder alloy |
| CN109702374B (en) * | 2019-02-13 | 2021-02-09 | 南昌大学 | Sn-Cu-Ni-In lead-free solder alloy and preparation method thereof |
| EP3828294B1 (en) * | 2019-04-11 | 2022-11-16 | Nihon Superior Co., Ltd. | Lead-free solder alloy and solder joint part |
| CN110315238B (en) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | Carbon nanotube reinforced lead-free solder, and preparation method and application thereof |
| JP6912742B1 (en) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | Lead-free and antimony-free solder alloys, solder balls, and solder fittings |
| TWI833132B (en) * | 2020-11-19 | 2024-02-21 | 日商千住金屬工業股份有限公司 | Solder alloys, solder balls and solder joints |
| KR20220091404A (en) * | 2020-12-23 | 2022-06-30 | 엠케이전자 주식회사 | Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same |
| JP2023060639A (en) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | Solder composition and electronic component |
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| US4879096A (en) | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
| KR19980068127A (en) * | 1997-02-15 | 1998-10-15 | 김광호 | Lead-Free Alloys for Soldering |
| JP3152945B2 (en) | 1998-03-26 | 2001-04-03 | 株式会社日本スペリア社 | Lead-free solder alloy |
| JP3363393B2 (en) * | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | Lead-free solder alloy |
| US6365097B1 (en) * | 1999-01-29 | 2002-04-02 | Fuji Electric Co., Ltd. | Solder alloy |
| JP3262113B2 (en) * | 1999-01-29 | 2002-03-04 | 富士電機株式会社 | Solder alloy |
| JP3775172B2 (en) | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | Solder composition and soldered article |
| AU2001214037A1 (en) | 2000-11-16 | 2002-05-27 | H-Technologies Group Incorporated | Lead-free solders |
| US20030021718A1 (en) | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
| US8216395B2 (en) | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| RU2219030C1 (en) * | 2002-05-27 | 2003-12-20 | Открытое акционерное общество "ГАЗ" | Solder for low-temperature soldering |
| US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| JP4401671B2 (en) | 2003-03-31 | 2010-01-20 | 千住金属工業株式会社 | High temperature lead-free solder alloys and electronic components |
| GB2406101C (en) | 2004-10-27 | 2007-09-11 | Quantum Chem Tech Singapore | Improvements in ro relating to solders |
| GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
| JP2006255762A (en) | 2005-03-18 | 2006-09-28 | Uchihashi Estec Co Ltd | Wire-shaped solder for electronic component |
| TWI465312B (en) | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | A replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath |
| US8641964B2 (en) * | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
| GB2431412B (en) * | 2005-10-24 | 2009-10-07 | Alpha Fry Ltd | Lead-free solder alloy |
| CN1788918A (en) * | 2005-12-20 | 2006-06-21 | 徐振五 | Leadless environment-friendly soldering |
| US20070172381A1 (en) | 2006-01-23 | 2007-07-26 | Deram Brian T | Lead-free solder with low copper dissolution |
| CN100439028C (en) * | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
| WO2009013114A1 (en) | 2007-07-20 | 2009-01-29 | Inventio Ag | Method for ascertaining the speed of a lift cabin and a control unit for implementing this method |
| CN101214591B (en) * | 2008-01-18 | 2010-11-24 | 重庆工学院 | Low silver hypoeutectic Sn-Cu-Ag lead-free solder for electronic micro connection |
| JP5249958B2 (en) * | 2008-02-22 | 2013-07-31 | 株式会社日本スペリア社 | Ni concentration adjustment method for lead-free solder containing Ni |
| KR101318454B1 (en) * | 2008-04-23 | 2013-10-16 | 센주긴조쿠고교 가부시키가이샤 | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| EP2277657B1 (en) * | 2008-04-23 | 2012-07-11 | Senju Metal Industry Co., Ltd | Lead-free solder |
| CN101585119A (en) * | 2009-02-26 | 2009-11-25 | 郴州金箭焊料有限公司 | Oxidation resistant low silver lead-free solder alloy |
| JP2011251310A (en) * | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | Lead-free solder alloy |
| JP4787384B1 (en) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | Low silver solder alloy and solder paste composition |
| CN103476541B (en) * | 2011-04-15 | 2016-12-28 | 日本斯倍利亚社股份有限公司 | Lead-free solder alloy |
| JP2013000744A (en) | 2011-06-10 | 2013-01-07 | Nihon Superior Co Ltd | Lead-free solder alloy, and soldered joint using the same |
| JP2013252548A (en) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | Solder paste for joining micro component |
| WO2014002304A1 (en) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | Solder alloy, solder paste, and electronic circuit board |
| JP5238088B1 (en) * | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
| US8875253B2 (en) * | 2012-07-03 | 2014-10-28 | Facebook, Inc. | Trust metrics on shared computers |
| CN103889644B (en) | 2012-10-09 | 2019-12-31 | 阿尔法组装解决方案公司 | High-temperature reliable lead-free and antimony-free tin solder |
| TWI460046B (en) | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
| CN103008904B (en) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | SnCuNiGaGeIn serial silver-free and lead-free solder alloy |
| TWI576195B (en) | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| US10286497B2 (en) * | 2014-04-30 | 2019-05-14 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
-
2015
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/en active IP Right Grant
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/en active Pending
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 MX MX2016014012A patent/MX2016014012A/en unknown
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/en active Pending
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/en not_active Application Discontinuation
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/en active
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/en active Search and Examination
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/en active
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/en active Application Filing
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/en active Active
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/en active IP Right Grant
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/en active Pending
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/en active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/en active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/en unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152B1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/en unknown
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