BR112016024855A2 - liga de solda isenta de chumbo - Google Patents
liga de solda isenta de chumboInfo
- Publication number
- BR112016024855A2 BR112016024855A2 BR112016024855A BR112016024855A BR112016024855A2 BR 112016024855 A2 BR112016024855 A2 BR 112016024855A2 BR 112016024855 A BR112016024855 A BR 112016024855A BR 112016024855 A BR112016024855 A BR 112016024855A BR 112016024855 A2 BR112016024855 A2 BR 112016024855A2
- Authority
- BR
- Brazil
- Prior art keywords
- resistivity
- free solder
- solder alloy
- lead
- lead free
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 title abstract 3
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
trata-se de uma liga de solda isenta de chumbo e soldagem com a capacidade de manter forte resistibilidade de junção mesmo em um estado de temperatura elevada após a soldagem e que tem alta confiabilidade e versatilidade. a composição da liga de solda isenta de chumbo da presente invenção tem sn-cu-ni como uma composição básica, que inclui 0,1 a 2,0% em massa de cu, e 0,01 a 0,5% em massa de ni, 0,1 a 5% em massa de bi, e 76,0 a 99,5% em massa de sn, de modo que seja possível implementar a soldagem com alta confiabilidade sem diminuir a resistibilidade de junção de uma junta soldada mesmo em um estado em que a mesma é exposta à temperatura elevada por um longo tempo, assim como a resistibilidade de junção no momento de ligação.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR122021001612-7A BR122021001612B1 (pt) | 2014-04-30 | 2015-04-28 | Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-094277 | 2014-04-30 | ||
JP2014094277 | 2014-04-30 | ||
JP2015004403 | 2015-01-13 | ||
JP2015-004403 | 2015-01-13 | ||
PCT/JP2015/062818 WO2015166945A1 (ja) | 2014-04-30 | 2015-04-28 | 鉛フリーはんだ合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112016024855A2 true BR112016024855A2 (pt) | 2017-08-15 |
BR112016024855B1 BR112016024855B1 (pt) | 2021-05-04 |
Family
ID=54358672
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR122021001612-7A BR122021001612B1 (pt) | 2014-04-30 | 2015-04-28 | Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma |
BR112016024855-4A BR112016024855B1 (pt) | 2014-04-30 | 2015-04-28 | liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR122021001612-7A BR122021001612B1 (pt) | 2014-04-30 | 2015-04-28 | Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma |
Country Status (15)
Country | Link |
---|---|
US (1) | US10286497B2 (pt) |
EP (2) | EP3138658B1 (pt) |
JP (3) | JP5872114B1 (pt) |
KR (1) | KR20160147996A (pt) |
CN (3) | CN108515289A (pt) |
AU (1) | AU2015254179B2 (pt) |
BR (2) | BR122021001612B1 (pt) |
CA (1) | CA2946994C (pt) |
HK (1) | HK1259425A1 (pt) |
MX (2) | MX2016014012A (pt) |
MY (1) | MY188657A (pt) |
PH (1) | PH12016502152A1 (pt) |
RU (3) | RU2662176C2 (pt) |
SG (1) | SG11201608933SA (pt) |
WO (1) | WO2015166945A1 (pt) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Agc株式会社 | 接合用組成物 |
JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
KR101951162B1 (ko) | 2016-09-13 | 2019-02-21 | 센주긴조쿠고교 가부시키가이샤 | 땜납 합금, 땜납 볼 및 땜납 조인트 |
CN106825983B (zh) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用 |
WO2018174162A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | はんだ継手 |
HUE056341T2 (hu) * | 2017-03-31 | 2022-02-28 | Senju Metal Industry Co | Forrasztóötvözet, forrasztópaszta és forrasztási kötés |
JP7205470B2 (ja) * | 2017-06-22 | 2023-01-17 | Agc株式会社 | 窓材、光学パッケージ |
CN107671451A (zh) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | 电连接器及其焊料 |
US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
JP7420363B2 (ja) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | はんだ継手 |
JP7287606B2 (ja) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
CN109702374B (zh) * | 2019-02-13 | 2021-02-09 | 南昌大学 | 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法 |
IL287143B1 (en) * | 2019-04-11 | 2024-08-01 | Nihon Superior Co Ltd | Lead-free solder alloy and solder joint |
CN110315238B (zh) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | 一种碳纳米管增强无铅钎料、其制备方法及其应用 |
US20220281035A1 (en) * | 2019-08-05 | 2022-09-08 | Nihon Superior Co., Ltd. | Solder-metal mesh composite material and method for producing same |
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
EP4249165A4 (en) * | 2020-11-19 | 2024-05-15 | Senju Metal Industry Co., Ltd. | WELDING ALLOY, WELDING GLOBULE AND SOFT SOLDER JOINT |
US20220212293A1 (en) * | 2020-12-23 | 2022-07-07 | Mk Electron Co., Ltd. | Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same |
JP2023060639A (ja) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | はんだ組成物および電子部品 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4879096A (en) | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
KR19980068127A (ko) * | 1997-02-15 | 1998-10-15 | 김광호 | 납땜용 무연 합금 |
JP3152945B2 (ja) | 1998-03-26 | 2001-04-03 | 株式会社日本スペリア社 | 無鉛はんだ合金 |
JP3363393B2 (ja) * | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
US6365097B1 (en) * | 1999-01-29 | 2002-04-02 | Fuji Electric Co., Ltd. | Solder alloy |
JP3262113B2 (ja) * | 1999-01-29 | 2002-03-04 | 富士電機株式会社 | はんだ合金 |
JP3775172B2 (ja) | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
ES2241671T3 (es) | 2000-11-16 | 2005-11-01 | SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE. LTD | Soldeo blando sin plomo. |
TW592872B (en) | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
RU2219030C1 (ru) * | 2002-05-27 | 2003-12-20 | Открытое акционерное общество "ГАЗ" | Припой для низкотемпературной пайки |
US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
JP4401671B2 (ja) | 2003-03-31 | 2010-01-20 | 千住金属工業株式会社 | 高温鉛フリーはんだ合金および電子部品 |
GB2406101C (en) | 2004-10-27 | 2007-09-11 | Quantum Chem Tech Singapore | Improvements in ro relating to solders |
GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
JP2006255762A (ja) | 2005-03-18 | 2006-09-28 | Uchihashi Estec Co Ltd | 電子部品用線状はんだ |
TWI465312B (zh) | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
US8641964B2 (en) * | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
GB2431412B (en) * | 2005-10-24 | 2009-10-07 | Alpha Fry Ltd | Lead-free solder alloy |
CN1788918A (zh) * | 2005-12-20 | 2006-06-21 | 徐振五 | 无铅环保焊料 |
US20070172381A1 (en) | 2006-01-23 | 2007-07-26 | Deram Brian T | Lead-free solder with low copper dissolution |
CN100439028C (zh) * | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
WO2009013114A1 (de) | 2007-07-20 | 2009-01-29 | Inventio Ag | Verfahren zur ermittlung der geschwindigkeit einer aufzugskabine und eine steuereinheit zur durchführung dieses verfahrens |
CN101214591B (zh) * | 2008-01-18 | 2010-11-24 | 重庆工学院 | 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料 |
US8557021B2 (en) * | 2008-02-22 | 2013-10-15 | Nihon Superior Sha Co., Ltd. | Method of regulating nickel concentration in lead-free solder containing nickel |
WO2009131114A1 (ja) * | 2008-04-23 | 2009-10-29 | 千住金属工業株式会社 | 鉛フリーはんだ |
CN102066043B (zh) * | 2008-04-23 | 2014-05-07 | 千住金属工业株式会社 | 抑制缩孔的无铅焊料合金 |
CN101585119A (zh) * | 2009-02-26 | 2009-11-25 | 郴州金箭焊料有限公司 | 抗氧化低银无铅焊料合金 |
JP2011251310A (ja) * | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
JP4787384B1 (ja) | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
EP2698225B1 (en) * | 2011-04-15 | 2018-07-25 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
JP2013000744A (ja) | 2011-06-10 | 2013-01-07 | Nihon Superior Co Ltd | 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 |
JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
JP5238088B1 (ja) * | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
US8875253B2 (en) * | 2012-07-03 | 2014-10-28 | Facebook, Inc. | Trust metrics on shared computers |
JP6395713B2 (ja) | 2012-10-09 | 2018-09-26 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. | 鉛フリーかつアンチモンフリーの高温信頼性錫はんだ |
TWI460046B (zh) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
CN103008904B (zh) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | 一种SnCuNiGaGeIn系无银无铅焊料合金 |
TWI576195B (zh) | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
-
2015
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/ru active
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/ru active
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/ko active Search and Examination
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/zh active Pending
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/pt active IP Right Grant
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/pt active IP Right Grant
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/ru not_active Application Discontinuation
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/ja active Active
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/zh active Pending
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/ja active Application Filing
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/zh active Pending
- 2015-04-28 MX MX2016014012A patent/MX2016014012A/es unknown
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/ja active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/ja active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/es unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152A1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/zh unknown
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR112016024855A2 (pt) | liga de solda isenta de chumbo | |
MY186064A (en) | High reliability lead-free solder alloys for harsh environment electronics applications | |
BR112016002151A2 (pt) | metal de adição para brasagem, metal de adição para brasagem em sanduíche, usos dos metais de adição para brasagem, combinação de um metal de adição para brasagem, método para união de peças metálicas através de brasagem, e artigo brasado | |
EP3449023A4 (en) | HIGHLY RELIABLE LEAD-FREE SOLDERING ALLOY | |
HUE052698T2 (hu) | Ólommentes forrasztó ötvözet, folyasztószer készítmény, forrasztó paszta készítmény, elektronikus áramköri kártya és elektronikus vezérlõ eszköz | |
MX2021012411A (es) | Aleaciones de soldadura libres de plata, libres de plomo. | |
BR112014032941A2 (pt) | bola de solda sem chumbo | |
BR112017019527A2 (pt) | método de soldagem baseada em metal não soldável diretamente de materiais um para o outro, utilizando um espaçador | |
EP2979807A4 (en) | SOLDER ALLOY, SOLDERING COMPOSITION, SOLDERING PASTE, AND ELECTRONIC CIRCUIT SUBSTRATE | |
HRP20182112T1 (hr) | Legura za lemljenje bez olova | |
BR112016026813A2 (pt) | composição | |
BR112013021668A2 (pt) | liga de solda para dispositivos de energia e junta de solda tendo uma alta densidade de corrente | |
TWI561639B (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
MY183868A (en) | Flux for flux cored solder and flux cored solder | |
MY177221A (en) | Solder alloy | |
SG11202004067UA (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
JP2016047555A5 (pt) | ||
TR201907368T4 (tr) | Sert lehimlemeye yönelik akı. | |
PH12017500404A1 (en) | Lead-free solder alloy for use in terminal preplating, and electronic component | |
HUE059839T2 (hu) | Nagy megbízhatóságú ólommentes forraszötvözet extrém környezetekben történõ elektronikai alkalmazásokhoz | |
SG11202004068XA (en) | Cost-effective lead-free solder alloy for electronic applications | |
PH12018501147A1 (en) | Solder alloy for preventing fe leaching, flux-cored solder, wire solder, flux-cored wire solder, flux-coated solder and solder joint | |
SG10201402705VA (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
HUP1500351A2 (en) | Calibration series for the monitoring of lead content of sac 305 type solder alloy by x-ray fluorescence method | |
UA109622C2 (uk) | Порошковий дріт для зварювання та наплавлення високоолов'яних бронз |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 28/04/2015, OBSERVADAS AS CONDICOES LEGAIS. |