BR112016024855A2 - liga de solda isenta de chumbo - Google Patents

liga de solda isenta de chumbo

Info

Publication number
BR112016024855A2
BR112016024855A2 BR112016024855A BR112016024855A BR112016024855A2 BR 112016024855 A2 BR112016024855 A2 BR 112016024855A2 BR 112016024855 A BR112016024855 A BR 112016024855A BR 112016024855 A BR112016024855 A BR 112016024855A BR 112016024855 A2 BR112016024855 A2 BR 112016024855A2
Authority
BR
Brazil
Prior art keywords
resistivity
free solder
solder alloy
lead
lead free
Prior art date
Application number
BR112016024855A
Other languages
English (en)
Other versions
BR112016024855B1 (pt
Inventor
Nishimura Takatoshi
Nishimura Tetsuro
Original Assignee
Nihon Superior Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Co Ltd filed Critical Nihon Superior Co Ltd
Priority to BR122021001612-7A priority Critical patent/BR122021001612B1/pt
Publication of BR112016024855A2 publication Critical patent/BR112016024855A2/pt
Publication of BR112016024855B1 publication Critical patent/BR112016024855B1/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

trata-se de uma liga de solda isenta de chumbo e soldagem com a capacidade de manter forte resistibilidade de junção mesmo em um estado de temperatura elevada após a soldagem e que tem alta confiabilidade e versatilidade. a composição da liga de solda isenta de chumbo da presente invenção tem sn-cu-ni como uma composição básica, que inclui 0,1 a 2,0% em massa de cu, e 0,01 a 0,5% em massa de ni, 0,1 a 5% em massa de bi, e 76,0 a 99,5% em massa de sn, de modo que seja possível implementar a soldagem com alta confiabilidade sem diminuir a resistibilidade de junção de uma junta soldada mesmo em um estado em que a mesma é exposta à temperatura elevada por um longo tempo, assim como a resistibilidade de junção no momento de ligação.
BR112016024855-4A 2014-04-30 2015-04-28 liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma BR112016024855B1 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BR122021001612-7A BR122021001612B1 (pt) 2014-04-30 2015-04-28 Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-094277 2014-04-30
JP2014094277 2014-04-30
JP2015004403 2015-01-13
JP2015-004403 2015-01-13
PCT/JP2015/062818 WO2015166945A1 (ja) 2014-04-30 2015-04-28 鉛フリーはんだ合金

Publications (2)

Publication Number Publication Date
BR112016024855A2 true BR112016024855A2 (pt) 2017-08-15
BR112016024855B1 BR112016024855B1 (pt) 2021-05-04

Family

ID=54358672

Family Applications (2)

Application Number Title Priority Date Filing Date
BR122021001612-7A BR122021001612B1 (pt) 2014-04-30 2015-04-28 Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma
BR112016024855-4A BR112016024855B1 (pt) 2014-04-30 2015-04-28 liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BR122021001612-7A BR122021001612B1 (pt) 2014-04-30 2015-04-28 Liga de solda isenta de chumbo e isenta de prata, e junta soldada que utiliza a mesma

Country Status (15)

Country Link
US (1) US10286497B2 (pt)
EP (2) EP3138658B1 (pt)
JP (3) JP5872114B1 (pt)
KR (1) KR20160147996A (pt)
CN (3) CN108515289A (pt)
AU (1) AU2015254179B2 (pt)
BR (2) BR122021001612B1 (pt)
CA (1) CA2946994C (pt)
HK (1) HK1259425A1 (pt)
MX (2) MX2016014012A (pt)
MY (1) MY188657A (pt)
PH (1) PH12016502152A1 (pt)
RU (3) RU2662176C2 (pt)
SG (1) SG11201608933SA (pt)
WO (1) WO2015166945A1 (pt)

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IL287143B1 (en) * 2019-04-11 2024-08-01 Nihon Superior Co Ltd Lead-free solder alloy and solder joint
CN110315238B (zh) * 2019-07-31 2021-09-17 广东省科学院中乌焊接研究所 一种碳纳米管增强无铅钎料、其制备方法及其应用
US20220281035A1 (en) * 2019-08-05 2022-09-08 Nihon Superior Co., Ltd. Solder-metal mesh composite material and method for producing same
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
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JP2023060639A (ja) * 2021-10-18 2023-04-28 Tdk株式会社 はんだ組成物および電子部品

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Also Published As

Publication number Publication date
US10286497B2 (en) 2019-05-14
KR20160147996A (ko) 2016-12-23
CA2946994A1 (en) 2015-11-05
MX2016014012A (es) 2017-01-11
BR112016024855B1 (pt) 2021-05-04
RU2662176C2 (ru) 2018-07-24
AU2015254179A1 (en) 2016-11-17
MY188657A (en) 2021-12-22
EP3138658B1 (en) 2020-11-04
US20160368102A1 (en) 2016-12-22
JPWO2015166945A1 (ja) 2017-04-20
AU2015254179B2 (en) 2017-07-20
CN108515289A (zh) 2018-09-11
CN105339131A (zh) 2016-02-17
EP3138658A1 (en) 2017-03-08
JP2016129908A (ja) 2016-07-21
SG11201608933SA (en) 2016-12-29
BR122021001612B1 (pt) 2021-10-13
EP3138658A4 (en) 2018-04-11
WO2015166945A1 (ja) 2015-11-05
JP6339993B2 (ja) 2018-06-06
MX2021000260A (es) 2021-04-12
JP5872114B1 (ja) 2016-03-01
PH12016502152B1 (en) 2017-01-16
RU2016146520A3 (pt) 2018-05-30
PH12016502152A1 (en) 2017-01-16
EP3708292A1 (en) 2020-09-16
RU2695791C2 (ru) 2019-07-26
RU2018118007A3 (pt) 2019-02-01
JP2016129907A (ja) 2016-07-21
RU2018118008A (ru) 2018-11-02
RU2018118008A3 (pt) 2019-01-25
CN114161023A (zh) 2022-03-11
CA2946994C (en) 2020-04-14
HK1259425A1 (zh) 2019-11-29
RU2018118007A (ru) 2018-11-02
RU2016146520A (ru) 2018-05-30

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