MX2021000260A - Aleacion de soldadura libre de plomo. - Google Patents
Aleacion de soldadura libre de plomo.Info
- Publication number
- MX2021000260A MX2021000260A MX2021000260A MX2021000260A MX2021000260A MX 2021000260 A MX2021000260 A MX 2021000260A MX 2021000260 A MX2021000260 A MX 2021000260A MX 2021000260 A MX2021000260 A MX 2021000260A MX 2021000260 A MX2021000260 A MX 2021000260A
- Authority
- MX
- Mexico
- Prior art keywords
- lead
- solder
- mass
- free
- alloy
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 229910045601 alloy Inorganic materials 0.000 title abstract 5
- 239000000956 alloy Substances 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 3
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
El propósito de la presente invención es proveer una aleación de soldadura libre de plomo y soldadura en la cual es posible mantener alta resistencia de unión que no disminuye incluso en un estado de alta temperatura después de la soldadura, la aleación de soldadura libre de plomo y soldadura que tiene alto grado de confiabilidad y versatilidad. En la presente invención, la composición base es Sn-Cu-Ni, la composición de aleación libre de plomo contiene 0.1 a 2.0% en masa de Cu, 0.01 a 0.5% en masa de Ni, 0.1 a 5% en masa de Bi y 76.0 a 99.5% en masa de Sn. Como resultado de tal composición de aleación libre de plomo, la fuerza de unión de la soldadura no disminuye durante la soldadura, incluso cuando la soldadura es expuesta a altas temperaturas durante un largo período de tiempo, como será evidente, permitiendo mediante esto una soldadura altamente confiable.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094277 | 2014-04-30 | ||
| JP2015004403 | 2015-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2021000260A true MX2021000260A (es) | 2021-04-12 |
Family
ID=54358672
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016014012A MX2016014012A (es) | 2014-04-30 | 2015-04-28 | Aleacion de soldadura libre de plomo. |
| MX2021000260A MX2021000260A (es) | 2014-04-30 | 2016-10-25 | Aleacion de soldadura libre de plomo. |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016014012A MX2016014012A (es) | 2014-04-30 | 2015-04-28 | Aleacion de soldadura libre de plomo. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US10286497B2 (es) |
| EP (2) | EP3138658B1 (es) |
| JP (3) | JP5872114B1 (es) |
| KR (1) | KR20160147996A (es) |
| CN (3) | CN108515289A (es) |
| AU (1) | AU2015254179B2 (es) |
| BR (2) | BR112016024855B1 (es) |
| CA (1) | CA2946994C (es) |
| HK (1) | HK1259425A1 (es) |
| MX (2) | MX2016014012A (es) |
| MY (1) | MY188657A (es) |
| PH (1) | PH12016502152A1 (es) |
| RU (3) | RU2662176C2 (es) |
| SG (1) | SG11201608933SA (es) |
| WO (1) | WO2015166945A1 (es) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Ａｇｃ株式会社 | 接合用組成物 |
| JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| PT3381601T (pt) | 2016-09-13 | 2021-01-05 | Senju Metal Industry Co | Liga de solda, esferas de solda e juntas de solda |
| CN106825983B (zh) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用 |
| JPWO2018174162A1 (ja) * | 2017-03-23 | 2019-03-28 | 株式会社日本スペリア社 | はんだ継手 |
| BR112019020490B1 (pt) * | 2017-03-31 | 2023-03-28 | Senju Metal Industry Co., Ltd | Liga de solda, pasta de solda e junta de solda |
| KR102563840B1 (ko) * | 2017-06-22 | 2023-08-07 | 에이지씨 가부시키가이샤 | 창재, 광학 패키지 |
| CN107671451A (zh) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | 电连接器及其焊料 |
| US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| JP7420363B2 (ja) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | はんだ継手 |
| JP7287606B2 (ja) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
| CN109702374B (zh) * | 2019-02-13 | 2021-02-09 | 南昌大学 | 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法 |
| PT3828294T (pt) * | 2019-04-11 | 2023-01-26 | Nihon Superior Co Ltd | Liga de solda sem chumbo e parte de junta de solda |
| CN110315238B (zh) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | 一种碳纳米管增强无铅钎料、其制备方法及其应用 |
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| EP4249165A4 (en) * | 2020-11-19 | 2024-05-15 | Senju Metal Industry Co | WELDING ALLOY, WELDING GLOBULE AND SOFT SOLDER JOINT |
| US20220212293A1 (en) * | 2020-12-23 | 2022-07-07 | Mk Electron Co., Ltd. | Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same |
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| US4879096A (en) | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
| KR19980068127A (ko) * | 1997-02-15 | 1998-10-15 | 김광호 | 납땜용 무연 합금 |
| DE69918758T2 (de) | 1998-03-26 | 2004-11-25 | Nihon Superior Sha Co., Ltd., Suita | Bleifreie Lötlegierung |
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| PT1333957E (pt) | 2000-11-16 | 2005-09-30 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Soldas isentas de chumbo |
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| KR101184234B1 (ko) * | 2008-04-23 | 2012-09-19 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납 |
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| US9339893B2 (en) * | 2011-04-15 | 2016-05-17 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| JP2013000744A (ja) * | 2011-06-10 | 2013-01-07 | Nihon Superior Co Ltd | 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 |
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| JP5238088B1 (ja) * | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
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| EP2773484B1 (en) | 2012-10-09 | 2017-05-24 | Alpha Assembly Solutions Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
| TWI460046B (zh) | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
| CN103008904B (zh) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | 一种SnCuNiGaGeIn系无银无铅焊料合金 |
| TWI576195B (zh) | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| AU2015254179B2 (en) * | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
-
2015
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/pt active IP Right Grant
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/ru active
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/ja active Application Filing
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/ru not_active Application Discontinuation
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/zh active Pending
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/ja active Active
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/pt active IP Right Grant
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/ko active Search and Examination
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/ru active
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-04-28 MX MX2016014012A patent/MX2016014012A/es unknown
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/zh active Pending
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/zh active Pending
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/ja active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/ja active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/es unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152A1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/zh unknown
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