PL3473373T3 - Kompozycja lutownicza - Google Patents

Kompozycja lutownicza

Info

Publication number
PL3473373T3
PL3473373T3 PL17841311T PL17841311T PL3473373T3 PL 3473373 T3 PL3473373 T3 PL 3473373T3 PL 17841311 T PL17841311 T PL 17841311T PL 17841311 T PL17841311 T PL 17841311T PL 3473373 T3 PL3473373 T3 PL 3473373T3
Authority
PL
Poland
Prior art keywords
solder composition
solder
composition
Prior art date
Application number
PL17841311T
Other languages
English (en)
Inventor
Noriyoshi Uchida
Duck-Soo Jang
Ju-Heung Kim
Ho-Won Seok
Original Assignee
Koki Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Company Limited filed Critical Koki Company Limited
Publication of PL3473373T3 publication Critical patent/PL3473373T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL17841311T 2016-08-16 2017-07-11 Kompozycja lutownicza PL3473373T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016159504A JP6471306B2 (ja) 2016-08-16 2016-08-16 はんだ組成物
PCT/JP2017/025326 WO2018034083A1 (ja) 2016-08-16 2017-07-11 はんだ組成物
EP17841311.8A EP3473373B1 (en) 2016-08-16 2017-07-11 Solder composition

Publications (1)

Publication Number Publication Date
PL3473373T3 true PL3473373T3 (pl) 2021-11-29

Family

ID=61197391

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17841311T PL3473373T3 (pl) 2016-08-16 2017-07-11 Kompozycja lutownicza

Country Status (8)

Country Link
US (1) US11517985B2 (pl)
EP (1) EP3473373B1 (pl)
JP (1) JP6471306B2 (pl)
KR (1) KR102068946B1 (pl)
CN (1) CN109414787A (pl)
PL (1) PL3473373T3 (pl)
TW (1) TWI767929B (pl)
WO (1) WO2018034083A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783013B (zh) * 2019-11-06 2021-06-15 英利能源（中国）有限公司 一种太阳能电池电极浆料和电池片及其组件的制备方法
KR102202937B1 (ko) * 2019-11-13 2021-01-14 (주)호전에이블 실링성이 우수한 에폭시 플럭스 페이스트 조성물
CN117086510A (zh) * 2022-05-13 2023-11-21 东方日升新能源股份有限公司 一种高性能助焊剂及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843182B2 (ja) 1979-01-31 1983-09-26 日本電気ホームエレクトロニクス株式会社 二部材の半田付け方法
JPS62199290A (ja) * 1986-02-26 1987-09-02 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
JPH0688153B2 (ja) * 1986-02-27 1994-11-09 内橋エステック株式会社 はんだ付け用フラックス
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
JPH084953B2 (ja) * 1991-04-17 1996-01-24 ユーホーケミカル株式会社 フラックス又ははんだペースト用腐食防止剤
JP3204072B2 (ja) * 1996-03-19 2001-09-04 松下電器産業株式会社 半田ボールの搭載方法及びフラックスの塗布方法
JP2000094184A (ja) * 1998-09-17 2000-04-04 Senju Metal Ind Co Ltd はんだ付け用フラックス
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
JP4112546B2 (ja) * 2004-09-24 2008-07-02 株式会社東芝 鉛フリー接合材の製造方法
JP5023583B2 (ja) * 2006-07-07 2012-09-12 富士電機株式会社 ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法
CN101264558A (zh) * 2008-04-22 2008-09-17 太仓市首创锡业有限公司 无铅焊料水溶性助焊剂
CN101670503A (zh) * 2009-10-12 2010-03-17 东莞市焊宏爱法电子科技有限公司 无卤素水基免洗助焊剂
KR101381249B1 (ko) * 2010-03-29 2014-04-04 한국전자통신연구원 충진 조성물, 이를 포함하는 반도체 소자 및 반도체 소자의 제조 방법
CN102233495A (zh) * 2010-05-07 2011-11-09 宁波卓诚焊锡科技有限公司 无铅焊料用水溶性助焊剂
JP2012047680A (ja) * 2010-08-30 2012-03-08 Mitsubishi Materials Corp はんだフラックスの評価方法及びはんだフラックス
JP5588287B2 (ja) * 2010-09-27 2014-09-10 パナソニック株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
CN102049634A (zh) 2010-12-21 2011-05-11 东莞市剑鑫电子材料有限公司 水溶性免清洗助焊剂
JP2012192434A (ja) * 2011-03-16 2012-10-11 Mitsubishi Materials Corp フラックス、はんだペースト及び実装基板の製造方法
JP5856747B2 (ja) * 2011-03-28 2016-02-10 ハリマ化成株式会社 はんだ付け用フラックスおよびはんだペースト組成物
JP2012216678A (ja) * 2011-03-31 2012-11-08 Fujitsu Ltd 電子部品、電子機器、及びはんだペースト
CN102500955A (zh) * 2011-09-21 2012-06-20 修建东 一种水基无卤免清洗助焊剂及其制备方法
CN103212922A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种水溶性助焊剂生产方法
CN104057215B (zh) 2013-06-07 2017-02-15 攀钢集团攀枝花钢铁研究院有限公司 用于镀锌钢板的焊接防飞溅剂和镀锌涂油钢板
JP2015131336A (ja) 2014-01-15 2015-07-23 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板

Also Published As

Publication number Publication date
WO2018034083A1 (ja) 2018-02-22
TW201815513A (zh) 2018-05-01
US11517985B2 (en) 2022-12-06
EP3473373A4 (en) 2019-12-11
KR102068946B1 (ko) 2020-01-21
CN109414787A (zh) 2019-03-01
EP3473373A1 (en) 2019-04-24
JP6471306B2 (ja) 2019-02-20
US20190308284A1 (en) 2019-10-10
TWI767929B (zh) 2022-06-21
EP3473373B1 (en) 2021-05-26
KR20190032412A (ko) 2019-03-27
JP2018027550A (ja) 2018-02-22

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