RU2015135232A - Бессвинцовый припой - Google Patents

Бессвинцовый припой Download PDF

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Publication number
RU2015135232A
RU2015135232A RU2015135232A RU2015135232A RU2015135232A RU 2015135232 A RU2015135232 A RU 2015135232A RU 2015135232 A RU2015135232 A RU 2015135232A RU 2015135232 A RU2015135232 A RU 2015135232A RU 2015135232 A RU2015135232 A RU 2015135232A
Authority
RU
Russia
Prior art keywords
free solder
weight
lead free
content
mass
Prior art date
Application number
RU2015135232A
Other languages
English (en)
Other versions
RU2617309C2 (ru
Inventor
Цзюйшен МА
Original Assignee
Цзюйшен МА
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Цзюйшен МА filed Critical Цзюйшен МА
Publication of RU2015135232A publication Critical patent/RU2015135232A/ru
Application granted granted Critical
Publication of RU2617309C2 publication Critical patent/RU2617309C2/ru

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Claims (7)

  1. Бессвинцовый припой, содержащий
  2. 4-12% содержания по массе Zn,
  3. 0,5-4% содержания по массе Bi,
  4. 0,5-5% содержания по массе In,
  5. 0,005-0,5% содержания по массе P,
  6. 0,001-0,5% содержания по массе Zr,
  7. по меньшей мере, один элемент, выбранный из группы, состоящей из: 0-0,1% содержания по массе Y, 0-0,2% содержания по массе Ge, 0-0,05% содержания по массе Mg, 0-0,02% содержания по массе B, 0-0,05% содержания по массе Al, 0-0,2% содержания по массе Ni и 0-0,3% содержания по массе Ag, и остаток составляет Sn.
RU2015135232A 2013-01-22 2014-01-21 Бессвинцовый припой RU2617309C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310025378.2A CN103042315B (zh) 2013-01-22 2013-01-22 耐热耐湿低熔点无铅焊料合金
CN201310025378.2 2013-01-22
PCT/CN2014/071032 WO2014114225A1 (en) 2013-01-22 2014-01-21 Pb-FREE SOLDER ALLOY

Publications (2)

Publication Number Publication Date
RU2015135232A true RU2015135232A (ru) 2017-03-02
RU2617309C2 RU2617309C2 (ru) 2017-04-24

Family

ID=48055300

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2015135232A RU2617309C2 (ru) 2013-01-22 2014-01-21 Бессвинцовый припой

Country Status (10)

Country Link
US (1) US10828731B2 (ru)
EP (1) EP2948570B1 (ru)
JP (1) JP6062070B2 (ru)
KR (1) KR101749439B1 (ru)
CN (1) CN103042315B (ru)
MY (1) MY184028A (ru)
RU (1) RU2617309C2 (ru)
SG (1) SG11201505623XA (ru)
TW (1) TWI538763B (ru)
WO (1) WO2014114225A1 (ru)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103042315B (zh) 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2014151364A (ja) * 2013-02-13 2014-08-25 Toyota Industries Corp はんだ及びダイボンド構造
DE102013013296B4 (de) * 2013-08-12 2020-08-06 Schott Ag Konverter-Kühlkörperverbund mit metallischer Lotverbindung und Verfahren zu dessen Herstellung
CN103722303A (zh) * 2013-12-23 2014-04-16 苏州宏泉高压电容器有限公司 一种锆金银焊接材料及其制备方法
CN106041353B (zh) * 2016-06-17 2018-05-25 天津大学 一种Sn-Zn-Bi系无铅焊料合金及其制备方法
CN106238951A (zh) * 2016-08-26 2016-12-21 王泽陆 一种环保高强度无铅钎料及其制备工艺
CN106825979B (zh) * 2017-01-04 2019-11-12 南京信息工程大学 一种低熔点Sn-Zn-Bi-Mg系无铅焊料及其制备方法
CN106956091A (zh) * 2017-05-02 2017-07-18 泰州朗瑞新能源科技有限公司 一种焊接材料及其制备方法
CN108296668A (zh) * 2017-12-21 2018-07-20 柳州智臻智能机械有限公司 一种无铅焊料合金及其制备方法
CN109595972A (zh) * 2018-11-01 2019-04-09 广西瑞祺丰新材料有限公司 一种铝合金冷却管
JP6721851B1 (ja) * 2019-06-28 2020-07-15 千住金属工業株式会社 はんだ合金、鋳造物、形成物およびはんだ継手
CN111922551A (zh) * 2020-08-12 2020-11-13 昆山联金科技发展有限公司 一种Sn-Zn系无铅焊膏及其制备方法

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
SU241950A1 (ru) * 1968-02-09 1969-04-18 И. А. Бойко, Н. В. Кургузов, И. К. Скл ров и А. И. Голубев
DE69632866T2 (de) * 1995-09-29 2005-07-14 Matsushita Electric Industrial Co., Ltd., Kadoma Bleifreies lot
JPH0994687A (ja) * 1995-09-29 1997-04-08 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
CZ297089B6 (cs) * 2000-11-16 2006-09-13 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Bezolovnatá pájecí slitina
JP4144415B2 (ja) * 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP2005103562A (ja) 2003-09-29 2005-04-21 Toshiba Corp 非鉛系接合材料
JP2007536088A (ja) * 2004-05-04 2007-12-13 エス−ボンド テクノロジーズ、エルエルシー インジウム、ビスマス及び／またはカドミウムを含有する低温活性半田を用いて形成した電子パッケージ
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
CN100364712C (zh) * 2004-12-17 2008-01-30 北京工业大学 含稀土Er的SnZn基无铅钎料
JP2006255762A (ja) * 2005-03-18 2006-09-28 Uchihashi Estec Co Ltd 電子部品用線状はんだ
CN100494436C (zh) * 2005-08-02 2009-06-03 马莒生 一种低熔点无铅焊料合金
US20080159904A1 (en) * 2005-08-24 2008-07-03 Fry's Metals, Inc. Solder alloy
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
EP2092579A2 (en) * 2006-12-04 2009-08-26 Arhus Universitet Use of thermoelectric materials for low temperature thermoelectric purposes
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Also Published As

Publication number Publication date
TWI538763B (zh) 2016-06-21
US20150343570A1 (en) 2015-12-03
EP2948570A4 (en) 2016-09-28
MY184028A (en) 2021-03-17
WO2014114225A1 (en) 2014-07-31
CN103042315B (zh) 2015-05-27
US10828731B2 (en) 2020-11-10
RU2617309C2 (ru) 2017-04-24
JP6062070B2 (ja) 2017-01-18
KR101749439B1 (ko) 2017-06-21
CN103042315A (zh) 2013-04-17
EP2948570A1 (en) 2015-12-02
SG11201505623XA (en) 2015-08-28
TW201431636A (zh) 2014-08-16
JP2016508878A (ja) 2016-03-24
KR20150105446A (ko) 2015-09-16
EP2948570B1 (en) 2019-02-27

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