BR112016009750A2 - ligas de solda livres de prata, livres de chumbo - Google Patents

ligas de solda livres de prata, livres de chumbo

Info

Publication number
BR112016009750A2
BR112016009750A2 BR112016009750A BR112016009750A BR112016009750A2 BR 112016009750 A2 BR112016009750 A2 BR 112016009750A2 BR 112016009750 A BR112016009750 A BR 112016009750A BR 112016009750 A BR112016009750 A BR 112016009750A BR 112016009750 A2 BR112016009750 A2 BR 112016009750A2
Authority
BR
Brazil
Prior art keywords
free
silver
soldering alloys
lead
alloys
Prior art date
Application number
BR112016009750A
Other languages
English (en)
Other versions
BR112016009750B1 (pt
Inventor
Murphy Michael
S Pandher Ranjit
Original Assignee
Alpha Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals filed Critical Alpha Metals
Priority to BR122019027680-3A priority Critical patent/BR122019027680B1/pt
Publication of BR112016009750A2 publication Critical patent/BR112016009750A2/pt
Publication of BR112016009750B1 publication Critical patent/BR112016009750B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0266—Rods, electrodes, wires flux-cored
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
BR112016009750-5A 2013-10-31 2014-10-29 ligas de solda livres de prata, livres de chumbo BR112016009750B1 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BR122019027680-3A BR122019027680B1 (pt) 2013-10-31 2014-10-29 Ligas de solda livres de prata e chumbo e junta de solda compreendendo tais ligas

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361898202P 2013-10-31 2013-10-31
US61/898,202 2013-10-31
PCT/US2014/062866 WO2015066155A1 (en) 2013-10-31 2014-10-29 Lead-free, silver-free solder alloys

Publications (2)

Publication Number Publication Date
BR112016009750A2 true BR112016009750A2 (pt) 2018-05-02
BR112016009750B1 BR112016009750B1 (pt) 2021-05-25

Family

ID=53005062

Family Applications (2)

Application Number Title Priority Date Filing Date
BR122019027680-3A BR122019027680B1 (pt) 2013-10-31 2014-10-29 Ligas de solda livres de prata e chumbo e junta de solda compreendendo tais ligas
BR112016009750-5A BR112016009750B1 (pt) 2013-10-31 2014-10-29 ligas de solda livres de prata, livres de chumbo

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BR122019027680-3A BR122019027680B1 (pt) 2013-10-31 2014-10-29 Ligas de solda livres de prata e chumbo e junta de solda compreendendo tais ligas

Country Status (9)

Country Link
US (1) US20160271738A1 (pt)
EP (2) EP3062956B1 (pt)
JP (1) JP2016537206A (pt)
KR (2) KR102522501B1 (pt)
CN (1) CN105829016A (pt)
BR (2) BR122019027680B1 (pt)
MX (2) MX2016005465A (pt)
SG (1) SG11201603421PA (pt)
WO (1) WO2015066155A1 (pt)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104858564A (zh) * 2015-06-01 2015-08-26 谷华 一种不溶解铜的焊锡
WO2018212498A1 (ko) 2017-05-15 2018-11-22 엘지이노텍 주식회사 올인원 칩 온 필름용 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
JP6678704B2 (ja) * 2018-07-20 2020-04-08 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP6691304B2 (ja) * 2018-07-20 2020-04-28 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP6722378B2 (ja) * 2018-07-20 2020-07-15 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP6691305B2 (ja) * 2018-07-20 2020-04-28 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
US11344976B2 (en) 2017-11-24 2022-05-31 Senju Metal Industry Co., Ltd. Solder material, solder paste, and solder joint
CN108213767A (zh) * 2018-02-28 2018-06-29 西安理工大学 一种低熔点Sn-Zn-Bi-Ga钎料合金的制备方法
JP6521160B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6555402B1 (ja) * 2018-07-27 2019-08-07 千住金属工業株式会社 ソルダペースト
JP6643691B2 (ja) * 2018-07-27 2020-02-12 千住金属工業株式会社 ソルダペースト
JP6573019B1 (ja) 2018-10-25 2019-09-11 千住金属工業株式会社 フラックス及びソルダペースト
MY189490A (en) 2019-05-27 2022-02-16 Senju Metal Industry Co Solder alloy, solder paste, solder ball, solder preform, and solder joint
JP6649596B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、およびはんだ継手
KR20220012904A (ko) * 2019-05-27 2022-02-04 센주긴조쿠고교 가부시키가이샤 납땜 합금, 솔더 페이스트, 납땜 볼, 솔더 프리폼, 납땜 조인트, 차재 전자 회로, ecu 전자 회로, 차재 전자 회로 장치, 및 ecu 전자 회로 장치
JP6777873B1 (ja) * 2019-05-27 2020-10-28 千住金属工業株式会社 フラックス及びソルダペースト
JP6777872B1 (ja) * 2019-05-27 2020-10-28 千住金属工業株式会社 フラックス及びソルダペースト
JP6649597B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、およびはんだ継手
JP6649595B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
CN113423851B (zh) * 2019-05-27 2022-07-26 千住金属工业株式会社 焊料合金、焊膏、焊球、焊料预制件、焊接接头和电路
US11813686B2 (en) 2019-05-27 2023-11-14 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate
JP6773986B1 (ja) * 2019-05-28 2020-10-21 千住金属工業株式会社 新規なロジン化合物及びその製造方法、フラックス、はんだペースト
JP2020011301A (ja) * 2019-08-07 2020-01-23 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP2020055038A (ja) * 2019-12-27 2020-04-09 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP2020110843A (ja) * 2020-03-17 2020-07-27 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
JP2020099950A (ja) * 2020-03-17 2020-07-02 千住金属工業株式会社 はんだ材料、ソルダペースト、及びはんだ継手
CN113070604B (zh) * 2021-04-08 2022-01-04 上杭县紫金佳博电子新材料科技有限公司 一种双层焊料片及其制备工艺

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100377232B1 (ko) * 1998-03-26 2003-03-26 니혼 슈페리어 샤 가부시키 가이샤 무연땜납합금
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
CN1570166A (zh) * 2004-05-09 2005-01-26 邓和升 无铅焊料合金及其制备方法
GB2421030B (en) 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
JP2007075836A (ja) * 2005-09-12 2007-03-29 Heesung Material Ltd 半田付け用無鉛合金
CN1931508A (zh) * 2005-09-15 2007-03-21 喜星素材株式会社 无铅焊料合金
CN1799759A (zh) * 2006-01-04 2006-07-12 东莞市千岛金属锡品有限公司 一种无铅焊料及其制备方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
EP1971699A2 (en) 2006-01-10 2008-09-24 Illinois Tool Works Inc. Lead-free solder with low copper dissolution
CN1803381A (zh) * 2006-01-11 2006-07-19 黄守友 无铅焊料及其制备方法
CN100439028C (zh) * 2007-01-24 2008-12-03 太仓市南仓金属材料有限公司 一种无铅软钎锡焊料
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101214591B (zh) * 2008-01-18 2010-11-24 重庆工学院 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料
EP2243590B1 (en) * 2008-02-22 2020-04-15 Nihon Superior Sha Co., Ltd Method of regulating nickel concentration in lead-free solder containing nickel
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
CN101391350B (zh) * 2008-11-05 2011-01-12 太仓市首创锡业有限公司 一种免清洗无铅焊锡丝及其制备方法
CN101391351A (zh) * 2008-11-05 2009-03-25 太仓市首创锡业有限公司 一种无铅焊料
CN101879667A (zh) * 2009-05-07 2010-11-10 成都飞融科技有限公司 通用型低银无铅电子钎料
CN102699563A (zh) * 2012-06-23 2012-10-03 浙江亚通焊材有限公司 一种低银无铅软钎料
CN103008904B (zh) * 2012-11-28 2015-04-08 一远电子科技有限公司 一种SnCuNiGaGeIn系无银无铅焊料合金
CN104395035B (zh) * 2013-05-29 2017-10-20 新日铁住金高新材料株式会社 钎料球以及电子构件

Also Published As

Publication number Publication date
KR102273620B1 (ko) 2021-07-06
BR122019027680B1 (pt) 2021-06-15
EP3062956A1 (en) 2016-09-07
EP3062956A4 (en) 2017-09-13
MX2021012411A (es) 2021-11-18
EP3385027A1 (en) 2018-10-10
CN105829016A (zh) 2016-08-03
JP2016537206A (ja) 2016-12-01
SG11201603421PA (en) 2016-05-30
EP3062956B1 (en) 2019-09-11
MX2016005465A (es) 2016-08-03
US20160271738A1 (en) 2016-09-22
KR20160078379A (ko) 2016-07-04
KR20210084673A (ko) 2021-07-07
WO2015066155A1 (en) 2015-05-07
BR112016009750B1 (pt) 2021-05-25
KR102522501B1 (ko) 2023-04-14

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/10/2014, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 9A ANUIDADE.

B21H Decision of lapse of a patent or of a certificate of addition of invention cancelled [chapter 21.8 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 21.6 NA RPI NO 2746 DE 22/08/2023 POR TER SIDO INDEVIDA.