JP2016508878A - Pbを含まない半田合金 - Google Patents
Pbを含まない半田合金 Download PDFInfo
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- JP2016508878A JP2016508878A JP2015552997A JP2015552997A JP2016508878A JP 2016508878 A JP2016508878 A JP 2016508878A JP 2015552997 A JP2015552997 A JP 2015552997A JP 2015552997 A JP2015552997 A JP 2015552997A JP 2016508878 A JP2016508878 A JP 2016508878A
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- solder alloy
- solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 121
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 112
- 239000000956 alloy Substances 0.000 title claims abstract description 112
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 12
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 229910052796 boron Inorganic materials 0.000 claims abstract description 8
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 description 42
- 230000008018 melting Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 239000011777 magnesium Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- 229910052745 lead Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000006023 eutectic alloy Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本開示の実施形態が詳細に言及される。図面に関して本明細書に記載される実施形態は、説明であり例証となるものであり、本開示を一般的に理解するために使用される。実施形態は本開示を限定するようには解釈されないものとする。同一または同様の機能を有する同一または同様の要素(複数可)は、記載の全体にわたって類似の参照番号によって示される。
表1に示す組成を有するPbを含まない半田合金E1を次のステップによって調製した。特定した組成を有する第1の混合物を準備し、第1の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E2を次のステップによって調製した。特定した組成を有する第2の混合物を準備し、第2の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E3を次のステップによって調製した。特定した組成を有する第3の混合物を準備し、第3の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E4を次のステップによって調製した。特定した組成を有する第4の混合物を準備し、第4の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E5を次のステップによって調製した。特定した組成を有する第5の混合物を準備し、第5の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E6を次のステップによって調製した。特定した組成を有する第6の混合物を準備し、第6の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E7を次のステップによって調製した。特定した組成を有する第7の混合物を準備し、第7の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E8を次のステップによって調製した。特定した組成を有する第8の混合物を準備し、第8の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E9を次のステップによって調製した。特定した組成を有する第9の混合物を準備し、第9の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金E10を次のステップによって調製した。特定した組成を有する第10の混合物を準備し、第10の混合物を溶融し注型した。
表1に示す組成を有するPbを含まない半田合金CE1を準備した。
表1に示す組成を有するPbを含まない半田合金CE2を準備した。
濡れ角度
Pbを含まない半田合金E1−E10およびCE1−CE2を濡れ性試験で試験した。Pbを含まない半田合金のすべての濡れ角度θを表2に示す。
Pbを含まない半田合金E1−E10およびCE1−CE2のそれぞれを、85%RH、85℃の温度で2000時間加熱した。Pbを含まない半田合金E1−E10およびCE1−CE2のそれぞれの半田付けスポットの表面の亀裂長さを記録した。結果を表2に示す。
Pbを含まない半田合金E1、E6、E8およびE9の融点を試験し、結果はそれぞれ196℃、192℃、192℃および190.5℃であった。
Claims (1)
- 4−12wt%のZn、
0.5−4wt%のBi、
0.5−5wt%のIn、
0.005−0.5wt%のP、
0.001−0.5wt%のZr、
0−0.1wt%のY、0−0.2wt%のGe、0−0.05wt%のMg、0−0.02wt%のB、0−0.05wt%のAl、0−0.2wt%のNiおよび0−0.3wt%のAgからなる群から選択される少なくとも1つ、ならびに
残部のSn
を含む、Pbを含まない半田合金。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310025378.2 | 2013-01-22 | ||
CN201310025378.2A CN103042315B (zh) | 2013-01-22 | 2013-01-22 | 耐热耐湿低熔点无铅焊料合金 |
PCT/CN2014/071032 WO2014114225A1 (en) | 2013-01-22 | 2014-01-21 | Pb-FREE SOLDER ALLOY |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016508878A true JP2016508878A (ja) | 2016-03-24 |
JP6062070B2 JP6062070B2 (ja) | 2017-01-18 |
Family
ID=48055300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015552997A Active JP6062070B2 (ja) | 2013-01-22 | 2014-01-21 | Pbを含まない半田合金 |
Country Status (10)
Country | Link |
---|---|
US (1) | US10828731B2 (ja) |
EP (1) | EP2948570B1 (ja) |
JP (1) | JP6062070B2 (ja) |
KR (1) | KR101749439B1 (ja) |
CN (1) | CN103042315B (ja) |
MY (1) | MY184028A (ja) |
RU (1) | RU2617309C2 (ja) |
SG (1) | SG11201505623XA (ja) |
TW (1) | TWI538763B (ja) |
WO (1) | WO2014114225A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103042315B (zh) * | 2013-01-22 | 2015-05-27 | 马莒生 | 耐热耐湿低熔点无铅焊料合金 |
JP2014151364A (ja) * | 2013-02-13 | 2014-08-25 | Toyota Industries Corp | はんだ及びダイボンド構造 |
DE102013013296B4 (de) * | 2013-08-12 | 2020-08-06 | Schott Ag | Konverter-Kühlkörperverbund mit metallischer Lotverbindung und Verfahren zu dessen Herstellung |
CN103722303A (zh) * | 2013-12-23 | 2014-04-16 | 苏州宏泉高压电容器有限公司 | 一种锆金银焊接材料及其制备方法 |
CN106041353B (zh) * | 2016-06-17 | 2018-05-25 | 天津大学 | 一种Sn-Zn-Bi系无铅焊料合金及其制备方法 |
CN106238951A (zh) * | 2016-08-26 | 2016-12-21 | 王泽陆 | 一种环保高强度无铅钎料及其制备工艺 |
CN106825979B (zh) * | 2017-01-04 | 2019-11-12 | 南京信息工程大学 | 一种低熔点Sn-Zn-Bi-Mg系无铅焊料及其制备方法 |
CN106956091A (zh) * | 2017-05-02 | 2017-07-18 | 泰州朗瑞新能源科技有限公司 | 一种焊接材料及其制备方法 |
CN108296668A (zh) * | 2017-12-21 | 2018-07-20 | 柳州智臻智能机械有限公司 | 一种无铅焊料合金及其制备方法 |
CN109595972A (zh) * | 2018-11-01 | 2019-04-09 | 广西瑞祺丰新材料有限公司 | 一种铝合金冷却管 |
JP6721851B1 (ja) * | 2019-06-28 | 2020-07-15 | 千住金属工業株式会社 | はんだ合金、鋳造物、形成物およびはんだ継手 |
CN111922551A (zh) * | 2020-08-12 | 2020-11-13 | 昆山联金科技发展有限公司 | 一种Sn-Zn系无铅焊膏及其制备方法 |
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2013
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2014
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- 2014-01-21 RU RU2015135232A patent/RU2617309C2/ru active
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- 2014-01-21 EP EP14743284.3A patent/EP2948570B1/en active Active
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JPH0994687A (ja) * | 1995-09-29 | 1997-04-08 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2000015478A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Corp | ハンダ材 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
JP2005103562A (ja) * | 2003-09-29 | 2005-04-21 | Toshiba Corp | 非鉛系接合材料 |
JP2008521619A (ja) * | 2004-12-01 | 2008-06-26 | アルファ フライ リミテッド | はんだ合金 |
CN1718796A (zh) * | 2005-08-02 | 2006-01-11 | 马莒生 | 一种低熔点无铅焊料合金 |
JP2009502512A (ja) * | 2005-08-02 | 2009-01-29 | キョセイ マ | 一種低融点無鉛はんだ合金 |
JP2008031550A (ja) * | 2006-06-26 | 2008-02-14 | Hitachi Cable Ltd | PbフリーのSn系材料及び配線用導体並びに端末接続部並びにPbフリーはんだ合金 |
Also Published As
Publication number | Publication date |
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KR20150105446A (ko) | 2015-09-16 |
CN103042315A (zh) | 2013-04-17 |
MY184028A (en) | 2021-03-17 |
EP2948570B1 (en) | 2019-02-27 |
EP2948570A4 (en) | 2016-09-28 |
US20150343570A1 (en) | 2015-12-03 |
TWI538763B (zh) | 2016-06-21 |
TW201431636A (zh) | 2014-08-16 |
RU2015135232A (ru) | 2017-03-02 |
EP2948570A1 (en) | 2015-12-02 |
SG11201505623XA (en) | 2015-08-28 |
JP6062070B2 (ja) | 2017-01-18 |
WO2014114225A1 (en) | 2014-07-31 |
CN103042315B (zh) | 2015-05-27 |
KR101749439B1 (ko) | 2017-06-21 |
RU2617309C2 (ru) | 2017-04-24 |
US10828731B2 (en) | 2020-11-10 |
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