MX2022009911A - Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. - Google Patents
Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.Info
- Publication number
- MX2022009911A MX2022009911A MX2022009911A MX2022009911A MX2022009911A MX 2022009911 A MX2022009911 A MX 2022009911A MX 2022009911 A MX2022009911 A MX 2022009911A MX 2022009911 A MX2022009911 A MX 2022009911A MX 2022009911 A MX2022009911 A MX 2022009911A
- Authority
- MX
- Mexico
- Prior art keywords
- free
- solder
- antimony
- lead
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pens And Brushes (AREA)
- Crushing And Grinding (AREA)
Abstract
Se proporciona una aleación de soldadura, bolas de soldadura y junta de soldadura sin plomo y ni antimonio que tienen esfuerzo cortante mejorado obtenida por la minuciosidad de grano en una interfaz unida y puede suprimir la falla de fusión. La aleación de soldadura sin plomo y ni antimonio que tiene una composición de aleación que consiste de, en % en masa, de 0.1 a 4.5% de Ag, de 0.20 a 0.85% de Cu, de 0.2 a 5.00% de Bi, de 0.005 a 0.09% de Ni y de 0.0005 a 0.0090% de Ge siendo el resto Sn y la composición de aleación satisface las siguientes relaciones (1) y (2): 0.013 = (Ag + Cu + Ni + Bi) × Ge = 0.027 (1), Sn × Cu × Ni = 5.0 (2). Ag, Cu, Ni, Bi, Ge y Sn en las relaciones (1) y (2) representan cada uno el contenido (% en masa) en la composición de la aleación.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020023277A JP6912742B1 (ja) | 2020-02-14 | 2020-02-14 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| PCT/JP2021/004571 WO2021161954A1 (ja) | 2020-02-14 | 2021-02-08 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2022009911A true MX2022009911A (es) | 2022-09-09 |
Family
ID=77057404
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022009911A MX2022009911A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
| MX2023008594A MX2023008594A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2023008594A MX2023008594A (es) | 2020-02-14 | 2021-02-08 | Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20230068294A1 (es) |
| EP (1) | EP4105348A4 (es) |
| JP (2) | JP6912742B1 (es) |
| KR (1) | KR102543492B1 (es) |
| CN (1) | CN115397606B (es) |
| BR (1) | BR112022016142A2 (es) |
| MX (2) | MX2022009911A (es) |
| TW (2) | TWI771903B (es) |
| WO (1) | WO2021161954A1 (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2023005700A (es) * | 2020-11-19 | 2023-11-30 | Senju Metal Industry Co | Aleacion de soldadura, bola de soldadura y junta de soldadura. |
| JP7155360B1 (ja) | 2021-08-02 | 2022-10-18 | 株式会社日本製鋼所 | 反応装置、反応システム、材料製造システム、電池用材料製造システム、電池製造システム、反応生成物製造方法、電池用材料製造方法および電池製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147409B2 (es) * | 1973-04-28 | 1976-12-15 | ||
| JP3649384B2 (ja) * | 2000-07-03 | 2005-05-18 | 日立金属株式会社 | はんだボールおよびその製造方法 |
| DE60109827T2 (de) * | 2001-08-30 | 2006-04-20 | Sumida Corp. | Bleifreie lötlegierung und diese verwendende elektronischen teile |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
| WO2014170963A1 (ja) * | 2013-04-16 | 2014-10-23 | 千住金属工業株式会社 | 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法 |
| TWI576195B (zh) * | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| US10286497B2 (en) * | 2014-04-30 | 2019-05-14 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| WO2016012754A2 (en) * | 2014-07-21 | 2016-01-28 | Alpha Metals, Inc. | Low temperature high reliability alloy for solder hierarchy |
| JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| JP6828880B2 (ja) * | 2016-10-06 | 2021-02-10 | 株式会社弘輝 | はんだペースト、はんだ合金粉 |
| US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
| JPWO2018174162A1 (ja) * | 2017-03-23 | 2019-03-28 | 株式会社日本スペリア社 | はんだ継手 |
| JP2019155467A (ja) * | 2018-03-16 | 2019-09-19 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP6700568B1 (ja) * | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手 |
-
2020
- 2020-02-14 JP JP2020023277A patent/JP6912742B1/ja active Active
-
2021
- 2021-02-08 US US17/799,575 patent/US20230068294A1/en active Pending
- 2021-02-08 KR KR1020227031751A patent/KR102543492B1/ko active IP Right Grant
- 2021-02-08 MX MX2022009911A patent/MX2022009911A/es unknown
- 2021-02-08 WO PCT/JP2021/004571 patent/WO2021161954A1/ja unknown
- 2021-02-08 MX MX2023008594A patent/MX2023008594A/es unknown
- 2021-02-08 EP EP21753207.6A patent/EP4105348A4/en active Pending
- 2021-02-08 CN CN202180028108.XA patent/CN115397606B/zh active Active
- 2021-02-08 BR BR112022016142A patent/BR112022016142A2/pt not_active Application Discontinuation
- 2021-02-09 TW TW110104842A patent/TWI771903B/zh active
- 2021-02-09 TW TW110139014A patent/TWI784761B/zh active
- 2021-03-05 JP JP2021035786A patent/JP7011208B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202130828A (zh) | 2021-08-16 |
| KR20220129113A (ko) | 2022-09-22 |
| WO2021161954A1 (ja) | 2021-08-19 |
| US20230068294A1 (en) | 2023-03-02 |
| JP6912742B1 (ja) | 2021-08-04 |
| TWI771903B (zh) | 2022-07-21 |
| EP4105348A1 (en) | 2022-12-21 |
| KR102543492B1 (ko) | 2023-06-15 |
| JP7011208B2 (ja) | 2022-01-26 |
| MX2023008594A (es) | 2024-01-24 |
| TWI784761B (zh) | 2022-11-21 |
| TW202206615A (zh) | 2022-02-16 |
| JP2021126703A (ja) | 2021-09-02 |
| CN115397606B (zh) | 2023-11-03 |
| JP2021126686A (ja) | 2021-09-02 |
| CN115397606A (zh) | 2022-11-25 |
| BR112022016142A2 (pt) | 2022-10-04 |
| EP4105348A4 (en) | 2023-09-06 |
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