MX2023008594A - Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. - Google Patents

Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.

Info

Publication number
MX2023008594A
MX2023008594A MX2023008594A MX2023008594A MX2023008594A MX 2023008594 A MX2023008594 A MX 2023008594A MX 2023008594 A MX2023008594 A MX 2023008594A MX 2023008594 A MX2023008594 A MX 2023008594A MX 2023008594 A MX2023008594 A MX 2023008594A
Authority
MX
Mexico
Prior art keywords
free
solder
antimony
lead
alloy
Prior art date
Application number
MX2023008594A
Other languages
English (en)
Inventor
Shunsaku Yoshikawa
Takashi Saito
Takahiro MATSUFUJI
Kanta DEI
Yuuki Iijima
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2023008594A publication Critical patent/MX2023008594A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pens And Brushes (AREA)
  • Crushing And Grinding (AREA)

Abstract

Se proporciona una aleación de soldadura, bolas de soldadura y junta de soldadura sin plomo y ni antimonio que tienen esfuerzo cortante mejorado obtenida por la minuciosidad de grano en una interfaz unida y puede suprimir la falla de fusión. La aleación de soldadura sin plomo y ni antimonio que tiene una composición de aleación que consiste de, en % en masa, de 0.1 a 4.5% de Ag, de 0.20 a 0.85% de Cu, de 0.2 a 5.00% de Bi, de 0.005 a 0.09% de Ni y de 0.0005 a 0.0090 % de Ge siendo el resto Sn y la composición de aleación satisface las siguientes relaciones (1) y (2): 0.013 = (Ag + Cu + Ni + Bi) ? Ge = 0.027 (1), Sn ? Cu ? Ni = 5.0 (2). Ag, Cu, Ni, Bi, Ge y Sn en las relaciones (1) y (2) representan cada uno el contenido (% en masa) en la composición de la aleación.
MX2023008594A 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio. MX2023008594A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020023277A JP6912742B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
PCT/JP2021/004571 WO2021161954A1 (ja) 2020-02-14 2021-02-08 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (1)

Publication Number Publication Date
MX2023008594A true MX2023008594A (es) 2024-01-24

Family

ID=77057404

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2023008594A MX2023008594A (es) 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.
MX2022009911A MX2022009911A (es) 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2022009911A MX2022009911A (es) 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.

Country Status (9)

Country Link
US (1) US20230068294A1 (es)
EP (1) EP4105348A4 (es)
JP (2) JP6912742B1 (es)
KR (1) KR102543492B1 (es)
CN (1) CN115397606B (es)
BR (1) BR112022016142A2 (es)
MX (2) MX2023008594A (es)
TW (2) TWI771903B (es)
WO (1) WO2021161954A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
CN116472140A (zh) * 2020-11-19 2023-07-21 千住金属工业株式会社 焊料合金、焊球及焊料接头
JP7155360B1 (ja) 2021-08-02 2022-10-18 株式会社日本製鋼所 反応装置、反応システム、材料製造システム、電池用材料製造システム、電池製造システム、反応生成物製造方法、電池用材料製造方法および電池製造方法

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JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
TWI742813B (zh) * 2019-09-02 2021-10-11 美商阿爾發金屬化工公司 高溫超高可靠性合金
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JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
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Also Published As

Publication number Publication date
KR20220129113A (ko) 2022-09-22
JP7011208B2 (ja) 2022-01-26
CN115397606B (zh) 2023-11-03
MX2022009911A (es) 2022-09-09
TWI771903B (zh) 2022-07-21
JP2021126703A (ja) 2021-09-02
JP6912742B1 (ja) 2021-08-04
BR112022016142A2 (pt) 2022-10-04
JP2021126686A (ja) 2021-09-02
TWI784761B (zh) 2022-11-21
US20230068294A1 (en) 2023-03-02
WO2021161954A1 (ja) 2021-08-19
CN115397606A (zh) 2022-11-25
EP4105348A1 (en) 2022-12-21
KR102543492B1 (ko) 2023-06-15
TW202206615A (zh) 2022-02-16
EP4105348A4 (en) 2023-09-06
TW202130828A (zh) 2021-08-16

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