TWI765570B - 無鉛且無銻之焊料合金、焊球，及焊料接頭 - Google Patents

無鉛且無銻之焊料合金、焊球，及焊料接頭 Download PDF

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Publication number
TWI765570B
TWI765570B TW110104909A TW110104909A TWI765570B TW I765570 B TWI765570 B TW I765570B TW 110104909 A TW110104909 A TW 110104909A TW 110104909 A TW110104909 A TW 110104909A TW I765570 B TWI765570 B TW I765570B
Authority
TW
Taiwan
Prior art keywords
solder
free
alloy
antimony
lead
Prior art date
Application number
TW110104909A
Other languages
English (en)
Chinese (zh)
Other versions
TW202138576A (zh
Inventor
飯島裕貴
吉川俊策
齋藤岳
出井寛大
松藤貴大
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202138576A publication Critical patent/TW202138576A/zh
Application granted granted Critical
Publication of TWI765570B publication Critical patent/TWI765570B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
TW110104909A 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭 TWI765570B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-023276 2020-02-14
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (2)

Publication Number Publication Date
TW202138576A TW202138576A (zh) 2021-10-16
TWI765570B true TWI765570B (zh) 2022-05-21

Family

ID=77292175

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110104909A TWI765570B (zh) 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭
TW111102941A TWI781050B (zh) 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111102941A TWI781050B (zh) 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭

Country Status (12)

Country Link
US (1) US12576463B2 (https=)
EP (1) EP4105349B1 (https=)
JP (2) JP6928284B1 (https=)
KR (1) KR102543580B1 (https=)
CN (1) CN115397605B (https=)
FI (1) FI4105349T3 (https=)
MX (2) MX2022009912A (https=)
MY (1) MY199336A (https=)
PH (1) PH12022552111A1 (https=)
PL (1) PL4105349T3 (https=)
TW (2) TWI765570B (https=)
WO (1) WO2021161953A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP7381980B1 (ja) 2023-04-28 2023-11-16 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路
JP7633557B1 (ja) 2023-12-28 2025-02-20 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト、およびはんだ継手

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020807A (ja) * 2000-07-03 2002-01-23 Hitachi Metals Ltd はんだボールおよびその製造方法
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法

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JPS5816877A (ja) * 1981-07-24 1983-01-31 Fuji Xerox Co Ltd 記録装置のロ−ル紙給紙機構
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP2007160401A (ja) * 2005-11-15 2007-06-28 Hitachi Metals Ltd はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
US8562906B2 (en) * 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
CN103492112B (zh) 2012-04-16 2016-08-17 株式会社谷黑组 焊接装置、焊接方法以及所制造的基板及电子部件
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
TWI576195B (zh) * 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20150127445A (ko) 2014-05-07 2015-11-17 애큐러스 사이언티픽 컴퍼니 리미티드 은-비함유 및 납-비함유 솔더 조성물
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
CN108290249B (zh) * 2016-09-13 2020-01-10 千住金属工业株式会社 软钎料合金、焊料球和钎焊接头
JP2018167310A (ja) 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
JP2019155467A (ja) 2018-03-16 2019-09-19 千住金属工業株式会社 鉛フリーはんだ合金
JP6700568B1 (ja) 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020807A (ja) * 2000-07-03 2002-01-23 Hitachi Metals Ltd はんだボールおよびその製造方法
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法

Also Published As

Publication number Publication date
FI4105349T3 (fi) 2026-01-16
MX2022009912A (es) 2022-09-09
JP2021126704A (ja) 2021-09-02
KR20220129112A (ko) 2022-09-22
EP4105349B1 (en) 2025-12-10
CN115397605B (zh) 2024-04-30
MY199336A (en) 2023-10-24
WO2021161953A1 (ja) 2021-08-19
KR102543580B1 (ko) 2023-06-15
MX2023008513A (es) 2024-01-02
PL4105349T3 (pl) 2026-03-30
CN115397605A (zh) 2022-11-25
PH12022552111A1 (en) 2024-01-29
JP2021126685A (ja) 2021-09-02
US12576463B2 (en) 2026-03-17
JP6928284B1 (ja) 2021-09-01
EP4105349A1 (en) 2022-12-21
JP7025679B2 (ja) 2022-02-25
BR112022016141A2 (pt) 2022-10-04
TW202219287A (zh) 2022-05-16
US20230060857A1 (en) 2023-03-02
TWI781050B (zh) 2022-10-11
TW202138576A (zh) 2021-10-16
EP4105349A4 (en) 2023-09-06

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