CN115397605B - 无铅且无锑的软钎料合金、焊料球和钎焊接头 - Google Patents

无铅且无锑的软钎料合金、焊料球和钎焊接头 Download PDF

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Publication number
CN115397605B
CN115397605B CN202180028097.5A CN202180028097A CN115397605B CN 115397605 B CN115397605 B CN 115397605B CN 202180028097 A CN202180028097 A CN 202180028097A CN 115397605 B CN115397605 B CN 115397605B
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CN
China
Prior art keywords
solder
free
alloy
antimony
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180028097.5A
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English (en)
Chinese (zh)
Other versions
CN115397605A (zh
Inventor
饭岛裕贵
吉川俊策
斋藤岳
出井宽大
松藤贵大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN115397605A publication Critical patent/CN115397605A/zh
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
CN202180028097.5A 2020-02-14 2021-02-08 无铅且无锑的软钎料合金、焊料球和钎焊接头 Active CN115397605B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-023276 2020-02-14
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
PCT/JP2021/004570 WO2021161953A1 (ja) 2020-02-14 2021-02-08 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (2)

Publication Number Publication Date
CN115397605A CN115397605A (zh) 2022-11-25
CN115397605B true CN115397605B (zh) 2024-04-30

Family

ID=77292175

Family Applications (1)

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CN202180028097.5A Active CN115397605B (zh) 2020-02-14 2021-02-08 无铅且无锑的软钎料合金、焊料球和钎焊接头

Country Status (12)

Country Link
US (1) US12576463B2 (https=)
EP (1) EP4105349B1 (https=)
JP (2) JP6928284B1 (https=)
KR (1) KR102543580B1 (https=)
CN (1) CN115397605B (https=)
FI (1) FI4105349T3 (https=)
MX (2) MX2022009912A (https=)
MY (1) MY199336A (https=)
PH (1) PH12022552111A1 (https=)
PL (1) PL4105349T3 (https=)
TW (2) TWI765570B (https=)
WO (1) WO2021161953A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP7381980B1 (ja) 2023-04-28 2023-11-16 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路
JP7633557B1 (ja) 2023-12-28 2025-02-20 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト、およびはんだ継手

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020807A (ja) * 2000-07-03 2002-01-23 Hitachi Metals Ltd はんだボールおよびその製造方法
JP2007237249A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 鉛フリーハンダ合金、ハンダボール及び電子部材
CN104602862A (zh) * 2012-06-30 2015-05-06 千住金属工业株式会社 无铅焊料球
CN107427969A (zh) * 2016-03-22 2017-12-01 株式会社田村制作所 无铅软钎料合金、助焊剂组合物、焊膏组合物、电子电路基板和电子控制装置
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法
CN108290249A (zh) * 2016-09-13 2018-07-17 千住金属工业株式会社 软钎料合金、焊料球和钎焊接头

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JPS5816877A (ja) * 1981-07-24 1983-01-31 Fuji Xerox Co Ltd 記録装置のロ−ル紙給紙機構
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP2007160401A (ja) * 2005-11-15 2007-06-28 Hitachi Metals Ltd はんだ合金、はんだボールおよびそれを用いたはんだ接合部
US8562906B2 (en) * 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
CN103492112B (zh) 2012-04-16 2016-08-17 株式会社谷黑组 焊接装置、焊接方法以及所制造的基板及电子部件
TWI576195B (zh) * 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20150127445A (ko) 2014-05-07 2015-11-17 애큐러스 사이언티픽 컴퍼니 리미티드 은-비함유 및 납-비함유 솔더 조성물
JP2018167310A (ja) 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
JP2019155467A (ja) 2018-03-16 2019-09-19 千住金属工業株式会社 鉛フリーはんだ合金
JP6700568B1 (ja) 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020807A (ja) * 2000-07-03 2002-01-23 Hitachi Metals Ltd はんだボールおよびその製造方法
JP2007237249A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 鉛フリーハンダ合金、ハンダボール及び電子部材
CN104602862A (zh) * 2012-06-30 2015-05-06 千住金属工业株式会社 无铅焊料球
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法
CN107427969A (zh) * 2016-03-22 2017-12-01 株式会社田村制作所 无铅软钎料合金、助焊剂组合物、焊膏组合物、电子电路基板和电子控制装置
CN108290249A (zh) * 2016-09-13 2018-07-17 千住金属工业株式会社 软钎料合金、焊料球和钎焊接头

Also Published As

Publication number Publication date
FI4105349T3 (fi) 2026-01-16
MX2022009912A (es) 2022-09-09
JP2021126704A (ja) 2021-09-02
KR20220129112A (ko) 2022-09-22
EP4105349B1 (en) 2025-12-10
MY199336A (en) 2023-10-24
WO2021161953A1 (ja) 2021-08-19
KR102543580B1 (ko) 2023-06-15
MX2023008513A (es) 2024-01-02
PL4105349T3 (pl) 2026-03-30
CN115397605A (zh) 2022-11-25
PH12022552111A1 (en) 2024-01-29
JP2021126685A (ja) 2021-09-02
TWI765570B (zh) 2022-05-21
US12576463B2 (en) 2026-03-17
JP6928284B1 (ja) 2021-09-01
EP4105349A1 (en) 2022-12-21
JP7025679B2 (ja) 2022-02-25
BR112022016141A2 (pt) 2022-10-04
TW202219287A (zh) 2022-05-16
US20230060857A1 (en) 2023-03-02
TWI781050B (zh) 2022-10-11
TW202138576A (zh) 2021-10-16
EP4105349A4 (en) 2023-09-06

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