JP6928284B1 - 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 - Google Patents

鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 Download PDF

Info

Publication number
JP6928284B1
JP6928284B1 JP2020023276A JP2020023276A JP6928284B1 JP 6928284 B1 JP6928284 B1 JP 6928284B1 JP 2020023276 A JP2020023276 A JP 2020023276A JP 2020023276 A JP2020023276 A JP 2020023276A JP 6928284 B1 JP6928284 B1 JP 6928284B1
Authority
JP
Japan
Prior art keywords
solder
free
alloy
antimony
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020023276A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021126685A (ja
Inventor
裕貴 飯島
裕貴 飯島
俊策 吉川
俊策 吉川
岳 齋藤
岳 齋藤
寛大 出井
寛大 出井
貴大 松藤
貴大 松藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2020023276A priority Critical patent/JP6928284B1/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to KR1020227031749A priority patent/KR102543580B1/ko
Priority to CN202180028097.5A priority patent/CN115397605B/zh
Priority to PH1/2022/552111A priority patent/PH12022552111A1/en
Priority to MX2023008513A priority patent/MX2023008513A/es
Priority to PL21754525.0T priority patent/PL4105349T3/pl
Priority to MYPI2022004366A priority patent/MY199336A/en
Priority to MX2022009912A priority patent/MX2022009912A/es
Priority to PCT/JP2021/004570 priority patent/WO2021161953A1/ja
Priority to US17/799,561 priority patent/US12576463B2/en
Priority to FIEP21754525.0T priority patent/FI4105349T3/fi
Priority to BR112022016141-7A priority patent/BR112022016141B1/pt
Priority to EP21754525.0A priority patent/EP4105349B1/en
Priority to TW111102941A priority patent/TWI781050B/zh
Priority to TW110104909A priority patent/TWI765570B/zh
Priority to JP2021077395A priority patent/JP7025679B2/ja
Application granted granted Critical
Publication of JP6928284B1 publication Critical patent/JP6928284B1/ja
Publication of JP2021126685A publication Critical patent/JP2021126685A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2020023276A 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 Active JP6928284B1 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
FIEP21754525.0T FI4105349T3 (fi) 2020-02-14 2021-02-08 Lyijytön ja antimoniton juoteseos, juotoskuula, ja juoteseoksen käyttö juotosliitoksena
PH1/2022/552111A PH12022552111A1 (en) 2020-02-14 2021-02-08 Lead-free and antimony-free solder alloy, solder ball, and solder joint
MX2023008513A MX2023008513A (es) 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.
PL21754525.0T PL4105349T3 (pl) 2020-02-14 2021-02-08 Stop lutowniczy wolny od ołowiu i wolny od antymonu, kulka lutownicza i zastosowanie stopu lutowniczego jako połączenie lutowane
MYPI2022004366A MY199336A (en) 2020-02-14 2021-02-08 Lead-free and antimony-free solder alloy, solder ball, and solder joint
MX2022009912A MX2022009912A (es) 2020-02-14 2021-02-08 Aleacion de soldadura, bola de soldadura y junta de soldadura sin plomo ni antimonio.
PCT/JP2021/004570 WO2021161953A1 (ja) 2020-02-14 2021-02-08 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
KR1020227031749A KR102543580B1 (ko) 2020-02-14 2021-02-08 납 프리 또한 안티몬 프리의 땜납 합금, 땜납 볼 및 땜납 이음
CN202180028097.5A CN115397605B (zh) 2020-02-14 2021-02-08 无铅且无锑的软钎料合金、焊料球和钎焊接头
BR112022016141-7A BR112022016141B1 (pt) 2020-02-14 2021-02-08 Liga de solda livre de chumbo e de antimônio, esfera de solda, matriz de grade de esferas e junta de solda
EP21754525.0A EP4105349B1 (en) 2020-02-14 2021-02-08 Lead-free and antimony-free solder alloy, solder ball, and use of the solder alloy as solder joint
US17/799,561 US12576463B2 (en) 2020-02-14 2021-02-08 Lead-free and antimony-free solder alloy, solder ball, and solder joint
TW111102941A TWI781050B (zh) 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭
TW110104909A TWI765570B (zh) 2020-02-14 2021-02-09 無鉛且無銻之焊料合金、焊球，及焊料接頭
JP2021077395A JP7025679B2 (ja) 2020-02-14 2021-04-30 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020023276A JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021077395A Division JP7025679B2 (ja) 2020-02-14 2021-04-30 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Publications (2)

Publication Number Publication Date
JP6928284B1 true JP6928284B1 (ja) 2021-09-01
JP2021126685A JP2021126685A (ja) 2021-09-02

Family

ID=77292175

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020023276A Active JP6928284B1 (ja) 2020-02-14 2020-02-14 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
JP2021077395A Active JP7025679B2 (ja) 2020-02-14 2021-04-30 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021077395A Active JP7025679B2 (ja) 2020-02-14 2021-04-30 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手

Country Status (12)

Country Link
US (1) US12576463B2 (https=)
EP (1) EP4105349B1 (https=)
JP (2) JP6928284B1 (https=)
KR (1) KR102543580B1 (https=)
CN (1) CN115397605B (https=)
FI (1) FI4105349T3 (https=)
MX (2) MX2022009912A (https=)
MY (1) MY199336A (https=)
PH (1) PH12022552111A1 (https=)
PL (1) PL4105349T3 (https=)
TW (2) TWI765570B (https=)
WO (1) WO2021161953A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP7381980B1 (ja) 2023-04-28 2023-11-16 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路
JP7633557B1 (ja) 2023-12-28 2025-02-20 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト、およびはんだ継手

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816877A (ja) * 1981-07-24 1983-01-31 Fuji Xerox Co Ltd 記録装置のロ−ル紙給紙機構
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3649384B2 (ja) * 2000-07-03 2005-05-18 日立金属株式会社 はんだボールおよびその製造方法
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
JP2007160401A (ja) * 2005-11-15 2007-06-28 Hitachi Metals Ltd はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
US8562906B2 (en) * 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
CN103492112B (zh) 2012-04-16 2016-08-17 株式会社谷黑组 焊接装置、焊接方法以及所制造的基板及电子部件
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
JP6241477B2 (ja) * 2013-04-16 2017-12-06 千住金属工業株式会社 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法
TWI576195B (zh) * 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
KR20150127445A (ko) 2014-05-07 2015-11-17 애큐러스 사이언티픽 컴퍼니 리미티드 은-비함유 및 납-비함유 솔더 조성물
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
CN108290249B (zh) * 2016-09-13 2020-01-10 千住金属工业株式会社 软钎料合金、焊料球和钎焊接头
JP2018167310A (ja) 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
JP2019155467A (ja) 2018-03-16 2019-09-19 千住金属工業株式会社 鉛フリーはんだ合金
JP6700568B1 (ja) 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Also Published As

Publication number Publication date
FI4105349T3 (fi) 2026-01-16
MX2022009912A (es) 2022-09-09
JP2021126704A (ja) 2021-09-02
KR20220129112A (ko) 2022-09-22
EP4105349B1 (en) 2025-12-10
CN115397605B (zh) 2024-04-30
MY199336A (en) 2023-10-24
WO2021161953A1 (ja) 2021-08-19
KR102543580B1 (ko) 2023-06-15
MX2023008513A (es) 2024-01-02
PL4105349T3 (pl) 2026-03-30
CN115397605A (zh) 2022-11-25
PH12022552111A1 (en) 2024-01-29
JP2021126685A (ja) 2021-09-02
TWI765570B (zh) 2022-05-21
US12576463B2 (en) 2026-03-17
EP4105349A1 (en) 2022-12-21
JP7025679B2 (ja) 2022-02-25
BR112022016141A2 (pt) 2022-10-04
TW202219287A (zh) 2022-05-16
US20230060857A1 (en) 2023-03-02
TWI781050B (zh) 2022-10-11
TW202138576A (zh) 2021-10-16
EP4105349A4 (en) 2023-09-06

Similar Documents

Publication Publication Date Title
JP6912742B1 (ja) 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
CN114245765B (zh) 无铅且无锑的软钎料合金、焊料球、球栅阵列和钎焊接头
JP7025679B2 (ja) 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
HK40078768A (en) Lead-free and antimony-free solder alloy, solder ball, and solder joint
HK40078769A (zh) 无铅且无锑的软釺料合金、焊料球和釺焊接头
HK40066658B (en) Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
HK40066658A (en) Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
HK40078768B (zh) 无铅且无锑的软釺料合金、焊料球和釺焊接头
HK40078769B (zh) 无铅且无锑的软釺料合金、焊料球和釺焊接头

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200424

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200424

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200612

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200804

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200930

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210105

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210430

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210706

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210719

R150 Certificate of patent or registration of utility model

Ref document number: 6928284

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250