PH12022552111A1 - Lead-free and antimony-free solder alloy, solder ball, and solder joint - Google Patents
Lead-free and antimony-free solder alloy, solder ball, and solder jointInfo
- Publication number
- PH12022552111A1 PH12022552111A1 PH1/2022/552111A PH12022552111A PH12022552111A1 PH 12022552111 A1 PH12022552111 A1 PH 12022552111A1 PH 12022552111 A PH12022552111 A PH 12022552111A PH 12022552111 A1 PH12022552111 A1 PH 12022552111A1
- Authority
- PH
- Philippines
- Prior art keywords
- free
- solder
- antimony
- lead
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/346—Solder materials or compositions specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020023276A JP6928284B1 (ja) | 2020-02-14 | 2020-02-14 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| PCT/JP2021/004570 WO2021161953A1 (ja) | 2020-02-14 | 2021-02-08 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12022552111A1 true PH12022552111A1 (en) | 2024-01-29 |
Family
ID=77292175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH1/2022/552111A PH12022552111A1 (en) | 2020-02-14 | 2021-02-08 | Lead-free and antimony-free solder alloy, solder ball, and solder joint |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US12576463B2 (https=) |
| EP (1) | EP4105349B1 (https=) |
| JP (2) | JP6928284B1 (https=) |
| KR (1) | KR102543580B1 (https=) |
| CN (1) | CN115397605B (https=) |
| FI (1) | FI4105349T3 (https=) |
| MX (2) | MX2022009912A (https=) |
| MY (1) | MY199336A (https=) |
| PH (1) | PH12022552111A1 (https=) |
| PL (1) | PL4105349T3 (https=) |
| TW (2) | TWI765570B (https=) |
| WO (1) | WO2021161953A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7007623B1 (ja) * | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
| JP7381980B1 (ja) | 2023-04-28 | 2023-11-16 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだ継手、および回路 |
| JP7633557B1 (ja) | 2023-12-28 | 2025-02-20 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだペースト、およびはんだ継手 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816877A (ja) * | 1981-07-24 | 1983-01-31 | Fuji Xerox Co Ltd | 記録装置のロ−ル紙給紙機構 |
| US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
| JP3649384B2 (ja) * | 2000-07-03 | 2005-05-18 | 日立金属株式会社 | はんだボールおよびその製造方法 |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| JP2007160401A (ja) * | 2005-11-15 | 2007-06-28 | Hitachi Metals Ltd | はんだ合金、はんだボールおよびそれを用いたはんだ接合部 |
| JP5030442B2 (ja) * | 2006-03-09 | 2012-09-19 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
| US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| KR100797161B1 (ko) * | 2007-05-25 | 2008-01-23 | 한국생산기술연구원 | 주석-은-구리-인듐의 4원계 무연솔더 조성물 |
| CN103492112B (zh) | 2012-04-16 | 2016-08-17 | 株式会社谷黑组 | 焊接装置、焊接方法以及所制造的基板及电子部件 |
| BR112014032941A2 (pt) * | 2012-06-30 | 2017-06-27 | Senju Metal Industry Co | bola de solda sem chumbo |
| JP6241477B2 (ja) * | 2013-04-16 | 2017-12-06 | 千住金属工業株式会社 | 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法 |
| TWI576195B (zh) * | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| KR20150127445A (ko) | 2014-05-07 | 2015-11-17 | 애큐러스 사이언티픽 컴퍼니 리미티드 | 은-비함유 및 납-비함유 솔더 조성물 |
| BR112018068596A2 (pt) * | 2016-03-22 | 2019-02-12 | Tamura Corporation | liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico |
| CN108290249B (zh) * | 2016-09-13 | 2020-01-10 | 千住金属工业株式会社 | 软钎料合金、焊料球和钎焊接头 |
| JP2018167310A (ja) | 2017-03-30 | 2018-11-01 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
| JP2019155467A (ja) | 2018-03-16 | 2019-09-19 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP6700568B1 (ja) | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手 |
-
2020
- 2020-02-14 JP JP2020023276A patent/JP6928284B1/ja active Active
-
2021
- 2021-02-08 FI FIEP21754525.0T patent/FI4105349T3/fi active
- 2021-02-08 CN CN202180028097.5A patent/CN115397605B/zh active Active
- 2021-02-08 KR KR1020227031749A patent/KR102543580B1/ko active Active
- 2021-02-08 PL PL21754525.0T patent/PL4105349T3/pl unknown
- 2021-02-08 PH PH1/2022/552111A patent/PH12022552111A1/en unknown
- 2021-02-08 MX MX2022009912A patent/MX2022009912A/es unknown
- 2021-02-08 WO PCT/JP2021/004570 patent/WO2021161953A1/ja not_active Ceased
- 2021-02-08 MX MX2023008513A patent/MX2023008513A/es unknown
- 2021-02-08 MY MYPI2022004366A patent/MY199336A/en unknown
- 2021-02-08 EP EP21754525.0A patent/EP4105349B1/en active Active
- 2021-02-08 US US17/799,561 patent/US12576463B2/en active Active
- 2021-02-09 TW TW110104909A patent/TWI765570B/zh active
- 2021-02-09 TW TW111102941A patent/TWI781050B/zh active
- 2021-04-30 JP JP2021077395A patent/JP7025679B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FI4105349T3 (fi) | 2026-01-16 |
| MX2022009912A (es) | 2022-09-09 |
| JP2021126704A (ja) | 2021-09-02 |
| KR20220129112A (ko) | 2022-09-22 |
| EP4105349B1 (en) | 2025-12-10 |
| CN115397605B (zh) | 2024-04-30 |
| MY199336A (en) | 2023-10-24 |
| WO2021161953A1 (ja) | 2021-08-19 |
| KR102543580B1 (ko) | 2023-06-15 |
| MX2023008513A (es) | 2024-01-02 |
| PL4105349T3 (pl) | 2026-03-30 |
| CN115397605A (zh) | 2022-11-25 |
| JP2021126685A (ja) | 2021-09-02 |
| TWI765570B (zh) | 2022-05-21 |
| US12576463B2 (en) | 2026-03-17 |
| JP6928284B1 (ja) | 2021-09-01 |
| EP4105349A1 (en) | 2022-12-21 |
| JP7025679B2 (ja) | 2022-02-25 |
| BR112022016141A2 (pt) | 2022-10-04 |
| TW202219287A (zh) | 2022-05-16 |
| US20230060857A1 (en) | 2023-03-02 |
| TWI781050B (zh) | 2022-10-11 |
| TW202138576A (zh) | 2021-10-16 |
| EP4105349A4 (en) | 2023-09-06 |
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