CN101214589B - 多元无铅钎料 - Google Patents

多元无铅钎料 Download PDF

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CN101214589B
CN101214589B CN200810063852XA CN200810063852A CN101214589B CN 101214589 B CN101214589 B CN 101214589B CN 200810063852X A CN200810063852X A CN 200810063852XA CN 200810063852 A CN200810063852 A CN 200810063852A CN 101214589 B CN101214589 B CN 101214589B
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solder
lead
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leadless solder
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CN101214589A (zh
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何鹏
冯吉才
刘多
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Harbin Institute of Technology
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Harbin Institute of Technology
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Abstract

多元无铅钎料,它涉及一种无铅钎料。本发明解决了现有钎料Ag含量高、抗蠕变强度低及润湿性差的问题。本发明的多元无铅钎料按质量百分比由以下成分组成:0.5~2.0%Ag,0.002~0.2%P,0.01~1.0%Zn,0.02~3.0%Ti,0.01~2.5%Zr,0.01~3.5%Ni,0.01~0.25%Cr,0.01~0.2%V,0.02~1.5%混合RE,其余为Sn。与常用的Sn-3.5Ag钎料相比,相同测试的条件下,本发明的多元无铅钎料抗氧化性能提高了15~21%,润湿角降低了4°~7°,抗蠕变强度提高了5~10%。而且本发明降低了生产成本。

Description

多元无铅钎料
技术领域
本发明涉及一种无铅钎料。
背景技术
目前国内外在研发无铅软钎料方面已经取得了一定的成果,Sn-3.5Ag在250℃时的润湿角为38°~45°,Sn-3.5Ag在20℃时的蠕变强度为13.7MPa,Sn-0.7Cu在20℃时的蠕变强度为8.6Mpa,使无铅钎料存在润湿性差,抗蠕变强度低的问题,与传统的Sn-Pb钎料相比,无铅钎料的很多性能还需要进一步改善。在电子封装与组装过程中,Sn-Ag钎料合金由于具备较好的综合性能,已经有了广泛的应用,但是多数合金中Ag含量较高,基本都在3%-5%(质量)之间,导致实际生产应用中的成本较高。
发明内容
本发明的目的是为了解决现有钎料Ag含量高、抗蠕变强度低、润湿性差的问题,提供了一种多元无铅钎料。
本发明的多元无铅钎料按质量百分比由以下成分组成:0.5~2.0%Ag,0.002~0.2%P,0.01~1.0%Zn,0.02~3.0%Ti,0.01~2.5%Zr,0.01~3.5%Ni,0.01~0.25%Cr,0.01~0.2%V,0.02~1.5%混合RE,其余为Sn。所述的混合RE为Ce与La的质量比为5∶4的Ce和La基混合稀土。
本发明钎料中的P和Zn,使无铅钎料的抗氧化性能提高了15~21%,当无铅钎料在惰性母材上使用时,钎料中加入的Ti和Zr便可以通过与母材成份的化学反应推动润湿的进行,Ti和Zr与母材反应生成一薄层产物,钎料在该产物上的润湿性要远好于直接在焊接母材上的润湿,增强了钎料的反应活性,V的加入也促进钎料在母材上的润湿,与常用的Sn-3.5Ag钎料相比,相同的条件下,使用本发明钎料润湿角降低了4°~7°,钎料中加入的Ni和Cr使钎料的抗蠕变强度提高了5~10%。本发明中的稀土元素RE能够细化钎料组织,使组织更均匀,改善钎料合金的力学性能。本发明降低了生产成本。
具体实施方式
具体实施方式一:本实施方式中多元无铅钎料按质量百分比由以下成分组成:0.5~2.0%Ag,0.002~0.2%P,0.01~1.0%Zn,0.02~3.0%Ti,0.01~2.5%Zr,0.01~3.5%Ni,0.01~0.25%Cr,0.01~0.2%V,0.02~1.5%混合RE,其余为Sn。所述的混合RE为Ce与La的质量比为5∶4的Ce和La基混合稀土。
本发明钎料中的P和Zn,使无铅钎料的抗氧化性能提高了15~21%,当无铅钎料在惰性母材上使用时,钎料中加入的Ti和Zr便可以通过与母材成份的化学反应推动润湿的进行,Ti和Zr与母材反应生成一薄层产物,钎料在该产物上的润湿性要远好于直接在焊接母材上的润湿,增强了钎料的反应活性,V的加入也促进钎料在母材上的润湿,与常用的Sn-3.5Ag钎料相比,相同的条件下,使用本发明钎料润湿角降低了4°~7°,钎料中加入的Ni和Cr使钎料的抗蠕变强度提高了5~10%。本发明中的稀土元素RE能够细化钎料组织,使组织更均匀,改善钎料合金的力学性能。
具体实施方式二:本实施方式与具体实施方式一不同的是多元无铅钎料按质量百分比由以下成分组成:2.0%Ag,0.015%P,0.25%Zn,1.0%Ti,0.75%Zr,1.8%Ni,0.05%Cr,0.02%V,0.15%混合RE,其余为Sn。
本实施方式得到的无铅钎料,其固相线温度为211℃,液相线温度为225℃,在Cu板、Ni板以及具有惰性的焊接母材上(如陶瓷)的润湿铺展性能良好,显示出了良好的钎焊工艺性能,与常用的Sn-3.5Ag钎料相比,相同的条件下,润湿角降低4°~6°,该钎料抗氧化性提高17%~20%,抗蠕变强度提高6%~10%,钎焊接头性能优异。
具体实施方式三:本实施方式与具体实施方式一不同的是多元无铅钎料按质量百分比由以下成分组成:1.5%Ag,0.018%P,0.2%Zn,1.0%Ti,0.75%Zr,1.8%Ni,0.05%Cr,0.02%V,0.15%混合RE,其余为Sn。
本实施方式得到的无铅钎料,其固相线温度为210℃,液相线温度为223℃,在Cu板、Ni板以及具有惰性的焊接母材上(如陶瓷)的润湿铺展性能良好,显示出了良好的钎焊工艺性能,与常用的Sn-3.5Ag钎料相比,相同的条件下,润湿角降低4°~7°,该钎料抗氧化性提高16%~21%,抗蠕变强度提高5%~10%,钎焊接头性能优异。
具体实施方式四:本实施方式与具体实施方式一不同的是多元无铅钎料按质量百分比由以下成分组成:1.0%Ag,0.016%P,0.2%Zn,1.2%Ti,0.5%Zr,1.5%Ni,0.08%Cr,0.015%V,0.15%混合RE,其余为Sn。
本实施方式得到的无铅钎料,其固相线温度为210℃,液相线温度为224℃,在Cu板、Ni板以及具有惰性的焊接母材上(如陶瓷)的润湿铺展性能良好,显示出了良好的钎焊工艺性能,与常用的Sn-3.5Ag钎料相比,相同的条件下,润湿角降低5°~7°,该钎料抗氧化性提高15%~20%,抗蠕变强度提高6%~8%,钎焊接头性能优异。
具体实施方式五:本实施方式与具体实施方式一不同的是多元无铅钎料按质量百分比由以下成分组成:0.5%Ag,0.016%P,0.35%Zn,1.8%Ti,0.8%Zr,1.5%Ni,0.08%Cr,0.015%V,0.1%混合RE,其余为Sn。
本实施方式得到的无铅钎料,其固相线温度为208℃,液相线温度为222℃,在Cu板、Ni板以及具有惰性的焊接母材上(如陶瓷)的润湿铺展性能良好,显示出了良好的钎焊工艺性能,与常用的Sn-3.5Ag钎料相比,相同的条件下,润湿角降低5°~7°,该钎料抗氧化性提高17%~20%,抗蠕变强度提高6%~9%,钎焊接头性能优异。

Claims (5)

1.一种多元无铅钎料,其特征在于多元无铅钎料按质量百分比由以下成分组成:0.5~2.0%Ag,0.002~0.2%P,0.01~1.0%Zn,0.02~3.0%Ti,0.01~2.5%Zr,0.01~3.5%Ni,0.01~0.25%Cr,0.01~0.2%V,0.02~1.5%混合RE,其余为Sn;所述的混合RE为Ce与La的质量比为5∶4的Ce和La基混合稀土。
2.权利要求1所述的多元无铅钎料,其特征在于多元无铅钎料按质量百分比由以下成分组成:2.0%Ag,0.015%P,0.25%Zn,1.0%Ti,0.75%Zr,1.8%Ni,0.05%Cr,0.02%V,0.15%混合RE,其余为Sn。
3.权利要求1所述的多元无铅钎料,其特征在于多元无铅钎料按质量百分比由以下成分组成:1.5%Ag,0.018%P,0.2%Zn,1.0%Ti,0.75%Zr,1.8%Ni,0.05%Cr,0.02%V,0.15%混合RE,其余为Sn。
4.权利要求1所述的多元无铅钎料,其特征在于多元无铅钎料按质量百分比由以下成分组成:1.0%Ag,0.016%P,0.2%Zn,1.2%Ti,0.5%Zr,1.5%Ni,0.08%Cr,0.015%V,0.15%混合RE,其余为Sn。
5.权利要求1所述的多元无铅钎料,其特征在于多元无铅钎料按质量百分比由以下成分组成:0.5%Ag,0.016%P,0.35%Zn,1.8%Ti,0.8%Zr,1.5%Ni,0.08%Cr,0.015%V,0.1%混合RE,其余为Sn。
CN200810063852XA 2008-01-14 2008-01-14 多元无铅钎料 Expired - Fee Related CN101214589B (zh)

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US20130099371A1 (en) * 2011-10-21 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package having solder jointed region with controlled ag content

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CN101920406B (zh) * 2010-09-16 2012-05-09 上海交通大学 Sn-Ag-Zn-Cr共晶无铅焊料
CN101927410B (zh) * 2010-09-16 2012-10-17 上海交通大学 Sn-Ag-Zn-Bi-Cr无铅焊料
CN106624434A (zh) * 2016-11-30 2017-05-10 安徽华众焊业有限公司 锡锑焊料合金

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Publication number Priority date Publication date Assignee Title
US20130099371A1 (en) * 2011-10-21 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package having solder jointed region with controlled ag content

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