ES2445402T3 - Circuito de terminación para terminación en troquel - Google Patents
Circuito de terminación para terminación en troquel Download PDFInfo
- Publication number
- ES2445402T3 ES2445402T3 ES10740862.7T ES10740862T ES2445402T3 ES 2445402 T3 ES2445402 T3 ES 2445402T3 ES 10740862 T ES10740862 T ES 10740862T ES 2445402 T3 ES2445402 T3 ES 2445402T3
- Authority
- ES
- Spain
- Prior art keywords
- voltage
- nmos
- pmos
- transistor
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/01—Details
- H03K3/012—Modifications of generator to improve response time or to decrease power consumption
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0005—Modifications of input or output impedance
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/003—Modifications for increasing the reliability for protection
- H03K19/00346—Modifications for eliminating interference or parasitic voltages or currents
- H03K19/00361—Modifications for eliminating interference or parasitic voltages or currents in field effect transistor circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0278—Arrangements for impedance matching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Dram (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15188609P | 2009-02-12 | 2009-02-12 | |
| US151886P | 2009-02-12 | ||
| PCT/CA2010/000027 WO2010091497A1 (en) | 2009-02-12 | 2010-01-11 | Termination circuit for on-die termination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2445402T3 true ES2445402T3 (es) | 2014-03-03 |
Family
ID=42539918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10740862.7T Active ES2445402T3 (es) | 2009-02-12 | 2010-01-11 | Circuito de terminación para terminación en troquel |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US8063658B2 (enExample) |
| EP (2) | EP2693641A1 (enExample) |
| JP (1) | JP5539403B2 (enExample) |
| KR (1) | KR20110128858A (enExample) |
| CN (1) | CN102396156A (enExample) |
| ES (1) | ES2445402T3 (enExample) |
| TW (1) | TWI416869B (enExample) |
| WO (1) | WO2010091497A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2693641A1 (en) | 2009-02-12 | 2014-02-05 | Mosaid Technologies Incorporated | Termination circuit for on-die termination |
| DE102010035191A1 (de) * | 2010-08-24 | 2012-03-01 | Rohde & Schwarz Gmbh & Co. Kg | Kalibriereinrichtung für einen Netzwerkanalysator |
| US8793419B1 (en) * | 2010-11-22 | 2014-07-29 | Sk Hynix Memory Solutions Inc. | Interface between multiple controllers |
| US8806233B2 (en) * | 2010-12-17 | 2014-08-12 | Intel Corporation | Power delivery noise reduction on a memory channel |
| KR20130050818A (ko) * | 2011-11-08 | 2013-05-16 | 에스케이하이닉스 주식회사 | 임피던스 조절 회로 및 이를 포함하는 반도체 장치 |
| US8648619B2 (en) | 2011-11-22 | 2014-02-11 | Micron Technology, Inc. | Termination for complementary signals |
| KR101893182B1 (ko) * | 2012-01-31 | 2018-10-05 | 에스케이하이닉스 주식회사 | 데이터 출력 회로 |
| JP6091239B2 (ja) * | 2013-02-13 | 2017-03-08 | キヤノン株式会社 | プリント回路板、プリント配線板および電子機器 |
| US8766701B1 (en) * | 2013-03-08 | 2014-07-01 | Xilinx, Inc. | Analog multiplexing with independent power supplies |
| CN105683846B (zh) | 2013-08-29 | 2018-11-16 | 格罗方德半导体公司 | 用于电压调节器的通栅强度校准技术 |
| TWI610314B (zh) | 2014-03-10 | 2018-01-01 | Toshiba Memory Corp | 半導體積體電路裝置 |
| US20150333753A1 (en) * | 2014-05-16 | 2015-11-19 | Taiwan Semiconductor Manufacturing Company Ltd. | Io and pvt calibration using bulk input technique |
| US9793181B2 (en) * | 2015-03-16 | 2017-10-17 | Stmicroelectronics (Grenoble 2) Sas | Resistor calibration using a MOS capacitor |
| CN105575419B (zh) * | 2015-12-17 | 2018-04-27 | 上海斐讯数据通信技术有限公司 | 同步动态随机存储器 |
| KR102646905B1 (ko) * | 2016-07-21 | 2024-03-12 | 삼성전자주식회사 | 온 다이 터미네이션 회로, 이를 구비하는 메모리 장치 및 메모리 시스템 |
| US10566038B2 (en) | 2017-05-29 | 2020-02-18 | Samsung Electronics Co., Ltd. | Method of controlling on-die termination and system performing the same |
| CN113675183B (zh) * | 2020-05-15 | 2024-01-30 | 敦泰电子股份有限公司 | 显示驱动电路的系统级静电放电保护电路与方法 |
| TWI748454B (zh) * | 2020-05-15 | 2021-12-01 | 敦泰電子股份有限公司 | 顯示驅動電路的系統級靜電放電保護電路與方法 |
| KR102787325B1 (ko) | 2020-09-11 | 2025-03-27 | 삼성전자주식회사 | 멀티 레벨 신호 생성을 위한 송신기 및 이를 포함하는 메모리 시스템 |
Family Cites Families (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5291121A (en) * | 1991-09-12 | 1994-03-01 | Texas Instruments Incorporated | Rail splitting virtual ground generator for single supply systems |
| KR960003219B1 (ko) * | 1993-04-16 | 1996-03-07 | 삼성전자주식회사 | 반도체 집적회로의 중간전위 발생회로 |
| US6728113B1 (en) * | 1993-06-24 | 2004-04-27 | Polychip, Inc. | Method and apparatus for non-conductively interconnecting integrated circuits |
| US6037798A (en) * | 1996-05-08 | 2000-03-14 | Telefonaktiebolaget Lm Ericsson | Line receiver circuit having termination impedances with transmission gates connected in parallel |
| JPH11185479A (ja) * | 1997-12-22 | 1999-07-09 | Toshiba Corp | 半導体集積回路 |
| JP2001078437A (ja) * | 1999-06-30 | 2001-03-23 | Toshiba Corp | ポンプ回路 |
| US6512401B2 (en) * | 1999-09-10 | 2003-01-28 | Intel Corporation | Output buffer for high and low voltage bus |
| JP2002056671A (ja) * | 2000-08-14 | 2002-02-22 | Hitachi Ltd | ダイナミック型ramのデータ保持方法と半導体集積回路装置 |
| KR100356576B1 (ko) * | 2000-09-15 | 2002-10-18 | 삼성전자 주식회사 | 프로그래머블 온 칩 터미네이션 동작을 갖는 프로그래머블데이터 출력회로 및 그 제어방법 |
| US6605958B2 (en) * | 2000-10-11 | 2003-08-12 | Vitesse Semiconductor Corporation | Precision on-chip transmission line termination |
| JP4676646B2 (ja) * | 2001-05-11 | 2011-04-27 | ルネサスエレクトロニクス株式会社 | インピーダンス調整回路および半導体装置 |
| TW530460B (en) * | 2001-06-04 | 2003-05-01 | Via Tech Inc | Pull-up terminating device |
| US6806728B2 (en) * | 2001-08-15 | 2004-10-19 | Rambus, Inc. | Circuit and method for interfacing to a bus channel |
| US7102200B2 (en) * | 2001-09-04 | 2006-09-05 | Intel Corporation | On-die termination resistor with analog compensation |
| US6836144B1 (en) * | 2001-12-10 | 2004-12-28 | Altera Corporation | Programmable series on-chip termination impedance and impedance matching |
| US6586964B1 (en) * | 2001-12-10 | 2003-07-01 | Xilinx, Inc. | Differential termination with calibration for differential signaling |
| US6670828B2 (en) * | 2002-01-31 | 2003-12-30 | Texas Instruments Incorporated | Programmable termination for CML I/O |
| JP4401621B2 (ja) * | 2002-05-07 | 2010-01-20 | 株式会社日立製作所 | 半導体集積回路装置 |
| KR100422451B1 (ko) * | 2002-05-24 | 2004-03-11 | 삼성전자주식회사 | 온-다이 터미네이션 제어방법 및 그에 따른 제어회로 |
| KR100495660B1 (ko) * | 2002-07-05 | 2005-06-16 | 삼성전자주식회사 | 온-다이 종결 회로를 구비한 반도체 집적 회로 장치 |
| US7399043B2 (en) * | 2002-12-02 | 2008-07-15 | Silverbrook Research Pty Ltd | Compensation for uneven printhead module lengths in a multi-module printhead |
| KR100506976B1 (ko) * | 2003-01-03 | 2005-08-09 | 삼성전자주식회사 | 온다이 터미네이션 회로를 가지는 동기 반도체 메모리 장치 |
| KR100532426B1 (ko) * | 2003-03-25 | 2005-11-30 | 삼성전자주식회사 | 온-칩 터미네이션 저항의 미스매치를 보상할 수 있는반도체 장치 |
| US6771097B1 (en) * | 2003-04-22 | 2004-08-03 | Broadcom Corporation | Series terminated CMOS output driver with impedance calibration |
| US6894529B1 (en) * | 2003-07-09 | 2005-05-17 | Integrated Device Technology, Inc. | Impedance-matched output driver circuits having linear characteristics and enhanced coarse and fine tuning control |
| US6859064B1 (en) * | 2003-08-20 | 2005-02-22 | Altera Corporation | Techniques for reducing leakage current in on-chip impedance termination circuits |
| KR100558489B1 (ko) * | 2003-09-02 | 2006-03-07 | 삼성전자주식회사 | 반도체 장치의 온 다이 터미네이션 회로 및 방법 |
| JP4205553B2 (ja) * | 2003-11-06 | 2009-01-07 | エルピーダメモリ株式会社 | メモリモジュール及びメモリシステム |
| JP4159454B2 (ja) * | 2003-11-27 | 2008-10-01 | エルピーダメモリ株式会社 | 半導体装置 |
| US6980020B2 (en) * | 2003-12-19 | 2005-12-27 | Rambus Inc. | Calibration methods and circuits for optimized on-die termination |
| KR100541556B1 (ko) * | 2004-03-29 | 2006-01-10 | 삼성전자주식회사 | 반도체 집적 회로 장치 및 이 장치의 온 다이 터미네이션회로 |
| KR100729916B1 (ko) * | 2004-04-08 | 2007-06-18 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 회로 |
| KR100541557B1 (ko) * | 2004-04-13 | 2006-01-10 | 삼성전자주식회사 | 메모리 모듈 및 이 모듈의 반도체 메모리 장치의 임피던스교정 방법 |
| KR100532972B1 (ko) * | 2004-04-28 | 2005-12-01 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 임피던스 조절 장치 |
| KR100605601B1 (ko) * | 2004-05-06 | 2006-07-31 | 주식회사 하이닉스반도체 | 스위칭 노이즈를 감소시킨 온다이 터미네이션 회로를구비한 반도체 메모리 장치 |
| US7282791B2 (en) * | 2004-07-09 | 2007-10-16 | Elpida Memory, Inc. | Stacked semiconductor device and semiconductor memory module |
| JP4559151B2 (ja) * | 2004-07-29 | 2010-10-06 | 富士通株式会社 | 終端回路、半導体装置、及び電子機器 |
| JP4887607B2 (ja) * | 2004-08-30 | 2012-02-29 | 富士通株式会社 | 抵抗値補償方法、抵抗値補償機能を有する回路、回路の抵抗値試験方法,抵抗値補償プログラム及び回路の抵抗値試験プログラム |
| US7188208B2 (en) * | 2004-09-07 | 2007-03-06 | Intel Corporation | Side-by-side inverted memory address and command buses |
| KR100670702B1 (ko) * | 2004-10-30 | 2007-01-17 | 주식회사 하이닉스반도체 | 온다이 터미네이션 회로를 구비한 반도체 메모리 장치 |
| KR100670699B1 (ko) * | 2004-11-01 | 2007-01-17 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 회로를 갖는 반도체메모리소자 |
| US7196567B2 (en) * | 2004-12-20 | 2007-03-27 | Rambus Inc. | Systems and methods for controlling termination resistance values for a plurality of communication channels |
| JP4143615B2 (ja) * | 2005-03-03 | 2008-09-03 | エルピーダメモリ株式会社 | オンダイターミネーション回路 |
| US7365570B2 (en) * | 2005-05-25 | 2008-04-29 | Micron Technology, Inc. | Pseudo-differential output driver with high immunity to noise and jitter |
| US7386410B2 (en) * | 2005-09-27 | 2008-06-10 | Ati Technologies Inc. | Closed loop controlled reference voltage calibration circuit and method |
| KR100753035B1 (ko) * | 2005-09-29 | 2007-08-30 | 주식회사 하이닉스반도체 | 온-다이 터미네이션 테스트 장치 |
| US7495467B2 (en) * | 2005-12-15 | 2009-02-24 | Lattice Semiconductor Corporation | Temperature-independent, linear on-chip termination resistance |
| US7429881B2 (en) * | 2006-01-06 | 2008-09-30 | Intel Corporation | Wide input common mode sense amplifier |
| KR100744130B1 (ko) * | 2006-02-20 | 2007-08-01 | 삼성전자주식회사 | 터미네이션 회로 및 이를 구비하는 반도체 메모리 장치 |
| KR100796764B1 (ko) * | 2006-05-10 | 2008-01-22 | 삼성전자주식회사 | 기준 전압 발생 회로, 이를 포함하는 반도체 장치 및 기준전압 발생 방법 |
| KR100744004B1 (ko) * | 2006-06-30 | 2007-07-30 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 회로를 구비하는 반도체메모리소자 및그의 구동방법 |
| US7417452B1 (en) | 2006-08-05 | 2008-08-26 | Altera Corporation | Techniques for providing adjustable on-chip termination impedance |
| KR100772533B1 (ko) * | 2006-09-27 | 2007-11-01 | 주식회사 하이닉스반도체 | 온 다이 터미네이션 회로 및 그의 구동 방법 |
| US7646213B2 (en) * | 2007-05-16 | 2010-01-12 | Micron Technology, Inc. | On-die system and method for controlling termination impedance of memory device data bus terminals |
| KR100881195B1 (ko) * | 2007-05-22 | 2009-02-05 | 삼성전자주식회사 | 고주파 성능을 개선한 odt 회로 |
| TW200910373A (en) * | 2007-06-08 | 2009-03-01 | Mosaid Technologies Inc | Dynamic impedance control for input/output buffers |
| US20090009212A1 (en) * | 2007-07-02 | 2009-01-08 | Martin Brox | Calibration system and method |
| KR100937996B1 (ko) * | 2007-07-03 | 2010-01-21 | 주식회사 하이닉스반도체 | 온다이 터미네이션 장치 |
| US7750666B2 (en) * | 2008-09-15 | 2010-07-06 | Integrated Device Technology, Inc. | Reduced power differential type termination circuit |
| EP2693641A1 (en) | 2009-02-12 | 2014-02-05 | Mosaid Technologies Incorporated | Termination circuit for on-die termination |
-
2010
- 2010-01-11 EP EP13190616.6A patent/EP2693641A1/en not_active Withdrawn
- 2010-01-11 KR KR1020117021235A patent/KR20110128858A/ko not_active Ceased
- 2010-01-11 ES ES10740862.7T patent/ES2445402T3/es active Active
- 2010-01-11 CN CN2010800163634A patent/CN102396156A/zh active Pending
- 2010-01-11 EP EP10740862.7A patent/EP2396885B1/en not_active Not-in-force
- 2010-01-11 JP JP2011549402A patent/JP5539403B2/ja not_active Expired - Fee Related
- 2010-01-11 US US12/685,365 patent/US8063658B2/en not_active Expired - Fee Related
- 2010-01-11 TW TW099100505A patent/TWI416869B/zh not_active IP Right Cessation
- 2010-01-11 WO PCT/CA2010/000027 patent/WO2010091497A1/en not_active Ceased
-
2011
- 2011-10-28 US US13/284,338 patent/US8471591B2/en not_active Expired - Fee Related
-
2013
- 2013-05-28 US US13/903,319 patent/US20130249592A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012517750A (ja) | 2012-08-02 |
| WO2010091497A1 (en) | 2010-08-19 |
| KR20110128858A (ko) | 2011-11-30 |
| US20100201397A1 (en) | 2010-08-12 |
| US20120126849A1 (en) | 2012-05-24 |
| EP2396885A4 (en) | 2012-09-26 |
| CN102396156A (zh) | 2012-03-28 |
| EP2396885B1 (en) | 2013-11-06 |
| US20130249592A1 (en) | 2013-09-26 |
| US8063658B2 (en) | 2011-11-22 |
| EP2396885A1 (en) | 2011-12-21 |
| EP2693641A1 (en) | 2014-02-05 |
| JP5539403B2 (ja) | 2014-07-02 |
| TW201032469A (en) | 2010-09-01 |
| US8471591B2 (en) | 2013-06-25 |
| TWI416869B (zh) | 2013-11-21 |
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