ES2162278T3 - Lamina de cobre electrolitico de gran resistencia a la traccion y procedimiento para fabricarla. - Google Patents

Lamina de cobre electrolitico de gran resistencia a la traccion y procedimiento para fabricarla.

Info

Publication number
ES2162278T3
ES2162278T3 ES97918418T ES97918418T ES2162278T3 ES 2162278 T3 ES2162278 T3 ES 2162278T3 ES 97918418 T ES97918418 T ES 97918418T ES 97918418 T ES97918418 T ES 97918418T ES 2162278 T3 ES2162278 T3 ES 2162278T3
Authority
ES
Spain
Prior art keywords
copper sheet
traction resistance
procedure
manufacture
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97918418T
Other languages
English (en)
Inventor
Hisao Sakai
Toshiko Yokota
Tsutomu Asai
Susumu Takahashi
Mitsuo Suzuki
Makoto Dobashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of ES2162278T3 publication Critical patent/ES2162278T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Abstract

SE PROPORCIONA UNA LAMINA DE COBRE ELECTRODEPOSITADA, CUYA RUGOSIDAD EN LA SUPERFICIE DE LA CARA MATE DE LA LAMINA DE COBRE ES MENOR Y CUYA RESISTENCIA A LA TRACCION DE LA MISMA, PARTICULARMENTE DESPUES DE CALENTARLA, ES MEJOR, Y CUYA SUPERFICIE MATE TIENE UNA RUGOSIDAD SUPERFICIAL Rz NO SUPERIOR A 2,5 MIM Y UNA RESISTENCIA A LA TRACCION NO INFERIOR A 40 KGF DESPUES DE CALENTARLA. TAMBIEN SE INCLUYE UN PROCESO PARA PRODUCIR UNA LAMINA DE COBRE ELECTRODEPOSITADA DE GRAN RESISTENCIA A LA TRACCION QUE SE COMPONE DE UNA FASE DE ELECTROLISIS CON UN ELECTROLITO QUE CONTIENE SULFATO DE COBRE Y ACIDO SULFURICO COMO COMPONENTES PRINCIPALES, Y QUE CONTIENE DE 0,01 A 0,10 G/L DE UN POLIETER REPRESENTADO POR LA FORMULA ESTRUCTURAL B2 CH2 O -, DE 0,5 A 1,0 G/L DE IONES DE ESTAÑO, DE 0,5 A 5,0 G/L DE IONES DE HIERRO Y MENOS DE 0,1 MG/L DE IONES CLORURO.
ES97918418T 1996-05-13 1997-05-13 Lamina de cobre electrolitico de gran resistencia a la traccion y procedimiento para fabricarla. Expired - Lifetime ES2162278T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14119896 1996-05-13

Publications (1)

Publication Number Publication Date
ES2162278T3 true ES2162278T3 (es) 2001-12-16

Family

ID=15286439

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97918418T Expired - Lifetime ES2162278T3 (es) 1996-05-13 1997-05-13 Lamina de cobre electrolitico de gran resistencia a la traccion y procedimiento para fabricarla.

Country Status (11)

Country Link
US (2) US5958209A (es)
EP (1) EP0841412B1 (es)
JP (1) JP3346774B2 (es)
KR (1) KR100299392B1 (es)
CN (1) CN1125194C (es)
AT (1) ATE207141T1 (es)
DE (1) DE69707391T2 (es)
ES (1) ES2162278T3 (es)
MY (1) MY138743A (es)
TW (1) TW432124B (es)
WO (1) WO1997043466A1 (es)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000017476A (ja) * 1998-04-30 2000-01-18 Mitsui Mining & Smelting Co Ltd 分散強化型電解銅箔及びその製造方法
US6709564B1 (en) * 1999-09-30 2004-03-23 Rockwell Scientific Licensing, Llc Integrated circuit plating using highly-complexed copper plating baths
JP2001177204A (ja) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
DE10005680B4 (de) * 2000-02-07 2005-03-31 Cis Solartechnik Gmbh Trägermaterial für eine flexible, bandförmige CIS-Solarzelle
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP2002111185A (ja) * 2000-10-03 2002-04-12 Sony Chem Corp バンプ付き配線回路基板及びその製造方法
JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
AU2005202863B2 (en) * 2004-09-06 2006-11-30 Nippon Mining & Metals Co., Ltd. Method for producing sheet-form electrolytic copper
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
CN101146933B (zh) * 2005-03-31 2010-11-24 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
CN101426959B (zh) * 2006-04-28 2010-11-17 三井金属矿业株式会社 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
JP2008285727A (ja) * 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk 高抗張力電解銅箔及びその製造方法
US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
KR101386093B1 (ko) * 2010-04-14 2014-04-24 일진머티리얼즈 주식회사 전해동박 제조용 구리전해액, 전해동박의 제조방법 및 전해동박
JP5521113B2 (ja) * 2011-10-31 2014-06-11 古河電気工業株式会社 高強度、高耐熱電解銅箔及びその製造方法
JP5875350B2 (ja) * 2011-11-30 2016-03-02 三井金属鉱業株式会社 電解銅合金箔及びキャリア箔付電解銅合金箔
US9663868B2 (en) 2011-12-28 2017-05-30 Mitsui Mining & Smelting Co., Ltd. Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil
JP5722813B2 (ja) * 2012-03-02 2015-05-27 Jx日鉱日石金属株式会社 電解銅箔及び二次電池用負極集電体
JP5201431B1 (ja) * 2012-05-17 2013-06-05 日立電線株式会社 圧延銅箔
JP5201432B1 (ja) * 2012-05-17 2013-06-05 日立電線株式会社 圧延銅箔
KR101632852B1 (ko) * 2012-06-27 2016-06-22 후루카와 덴키 고교 가부시키가이샤 리튬 이온 이차 전지용 전해 구리박, 리튬 이온 이차 전지의 부극 전극 및 리튬 이온 이차 전지
CN102995086A (zh) * 2012-12-11 2013-03-27 联合铜箔(惠州)有限公司 一种生产低轮廓电解铜箔用添加剂及生产工艺
TWI499693B (zh) * 2013-02-22 2015-09-11 Jx Nippon Mining & Metals Corp Production method of copper foil and graphene for graphene production
TWI533496B (zh) 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil
JP5889443B2 (ja) * 2013-08-01 2016-03-22 古河電気工業株式会社 プリント配線基板用銅箔
KR101500566B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
KR101500565B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
TWI542739B (zh) * 2014-03-21 2016-07-21 長春石油化學股份有限公司 電解銅箔
WO2016117587A1 (ja) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
KR102318603B1 (ko) * 2016-08-23 2021-10-27 에스케이넥실리스 주식회사 이차전지의 용량 유지율을 향상시킬 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR101733410B1 (ko) 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 저온 물성이 우수한 이차전지용 전해동박 및 그의 제조방법
KR101755203B1 (ko) 2016-11-11 2017-07-10 일진머티리얼즈 주식회사 이차전지용 전해동박 및 그의 제조방법
KR101734840B1 (ko) 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
KR101733408B1 (ko) * 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 이차전지용 전해동박 및 그의 제조방법
TWI619850B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 電解液、電解銅箔及其製造方法
KR20210132382A (ko) * 2020-04-27 2021-11-04 엘지이노텍 주식회사 회로기판, 센서 구동장치 및 이를 포함하는 카메라 모듈
KR20220043617A (ko) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지 및 그것의 제조방법
KR102495997B1 (ko) 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2475974A (en) * 1945-08-28 1949-07-12 Rca Corp Electrodeposition of copper
US2482354A (en) * 1946-07-06 1949-09-20 Rca Corp Copper plating solution
US2876178A (en) * 1956-03-06 1959-03-03 Ewald H Mccoy Electrodepositing copper
US2859159A (en) * 1956-10-09 1958-11-04 Elechem Corp Bright copper plating bath containing mixtures of metal compounds
US3864227A (en) * 1973-06-20 1975-02-04 Amax Inc Method for the electrolytic refining of copper
JPS5233074A (en) * 1975-09-10 1977-03-12 Nippon Mining Co Surface treatment of printed circuit copper foil
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
US4088544A (en) * 1976-04-19 1978-05-09 Hutkin Irving J Composite and method for making thin copper foil
JPS5438053A (en) * 1977-08-29 1979-03-22 Mitsubishi Electric Corp Safety device for elevator cage
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
JPS6152387A (ja) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法
DE3687089T3 (de) * 1985-07-05 1999-10-07 Mitsui Mining & Smelting Co Verfahren zur Herstellung einer Kupferfolie durch elektrolytische Abscheidung.
JPH0639155B2 (ja) * 1986-02-21 1994-05-25 名幸電子工業株式会社 銅張積層板の製造方法
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US5322976A (en) * 1987-02-24 1994-06-21 Polyonics Corporation Process for forming polyimide-metal laminates
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
JPH0526746Y2 (es) * 1987-07-14 1993-07-07
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
JP2993968B2 (ja) * 1989-01-10 1999-12-27 古河サーキットフォイル株式会社 電解銅箔の製造方法
US5181770A (en) * 1989-04-19 1993-01-26 Olin Corporation Surface topography optimization through control of chloride concentration in electroformed copper foil
US4959119A (en) * 1989-11-29 1990-09-25 E. I. Du Pont De Nemours And Company Method for forming through holes in a polyimide substrate
US4976826A (en) * 1990-02-16 1990-12-11 Furukawa Circuit Foil Co., Ltd. Method of making electrodeposited copper foil
JPH0432155A (ja) * 1990-05-25 1992-02-04 Iwasaki Electric Co Ltd 金属蒸気放電灯点灯装置
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
KR100275899B1 (ko) * 1990-05-30 2000-12-15 마이클 에이. 센타니 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법
FR2663124A1 (fr) * 1990-06-08 1991-12-13 Kodak Pathe Procede de mesure de caracteristiques d'une bande et dispositif de mise en óoeuvre du procede.

Also Published As

Publication number Publication date
ATE207141T1 (de) 2001-11-15
CN1193360A (zh) 1998-09-16
WO1997043466A1 (fr) 1997-11-20
US5958209A (en) 1999-09-28
DE69707391D1 (de) 2001-11-22
EP0841412B1 (en) 2001-10-17
TW432124B (en) 2001-05-01
US6194056B1 (en) 2001-02-27
DE69707391T2 (de) 2002-07-11
JP3346774B2 (ja) 2002-11-18
KR19990028891A (ko) 1999-04-15
EP0841412A1 (en) 1998-05-13
CN1125194C (zh) 2003-10-22
MY138743A (en) 2009-07-31
EP0841412A4 (en) 1999-02-03
KR100299392B1 (ko) 2001-09-22

Similar Documents

Publication Publication Date Title
ES2162278T3 (es) Lamina de cobre electrolitico de gran resistencia a la traccion y procedimiento para fabricarla.
EP1031646A3 (en) Method for producing a mixed oxidant gas
JO1983B1 (en) Electrolyzer for the production of halogen gases
WO2006020078A3 (en) System and method for producing copper powder by electrowinning using the ferrous/ferric anode reaction
AR021909A1 (es) Dioxido de manganeso electrolitico de alta capacidad de descarga y metodos para su produccion
CA2265183A1 (en) Magnesium metal production
AU580241B2 (en) Cathode for electrolysis of copper and process for manufacture of cathode
KR920011591A (ko) 낮은 내부 응력을 갖는 체(sieve)재료의 형성방법 및 그에 따라 수득된 체 재료
US6168706B1 (en) Process for producing high etch gains for electrolytic capacitor manufacturing
CA2297106A1 (en) Method for producing polysulfides by electrolytic oxidation
BR0008568B1 (pt) método para produção de polissulfetos por meio de oxidação eletrolìtica.
BR9007455A (pt) Celula de eletrolise para processos eletroliticos geradores de gas
US4319972A (en) AC Etching of aluminum capacitor foil
KR940013301A (ko) 전해에 의한 금속 포일 제조 방법
KR970009865A (ko) 가스 정제방법
JPS5713186A (en) Method for modification of metallic electrode for electrolysis
WO2003035941A3 (en) Electrolytic processes with reduced cell voltage and gas formation
Kolosnitsyn et al. Cycling lithium–sulfur batteries
CN205806193U (zh) 一种手术室电解板挂钩结构
RU2211886C2 (ru) Биполярный электрод
JPS57120682A (en) Production of aluminum
PT99197A (pt) Celula electrolitica, electrolisador e processo de realizacao de electrolise
KR950035537A (ko) 극박의 전해동박 및 그 제조방법
Rao et al. Electrochemical behaviour of some vesicants on gold electrode and effect of chloride ions on it
Cipris et al. The electrochemical reduction of 2, 5-dichlorobenzenesulphonyl chloride and the corresponding disulphide

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 841412

Country of ref document: ES