ES2041374T3 - Eliminacion de contaminantes superficiales mediante radiacion desde una fuente de alta energia. - Google Patents
Eliminacion de contaminantes superficiales mediante radiacion desde una fuente de alta energia.Info
- Publication number
- ES2041374T3 ES2041374T3 ES198989112319T ES89112319T ES2041374T3 ES 2041374 T3 ES2041374 T3 ES 2041374T3 ES 198989112319 T ES198989112319 T ES 198989112319T ES 89112319 T ES89112319 T ES 89112319T ES 2041374 T3 ES2041374 T3 ES 2041374T3
- Authority
- ES
- Spain
- Prior art keywords
- elimination
- radiation
- energy source
- high energy
- surface pollutants
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008030 elimination Effects 0.000 title 1
- 238000003379 elimination reaction Methods 0.000 title 1
- 239000003344 environmental pollutant Substances 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 239000000356 contaminant Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/017—Clean surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/091—Laser beam processing of fets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/093—Laser beam treatment in general
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/906—Cleaning of wafer as interim step
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning In General (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electrodes Of Semiconductors (AREA)
- Paper (AREA)
- Calculators And Similar Devices (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
METODO Y APARATO PARA ELIMINAR LOS CONTAMINANTES SUPERFICIALES DE LA SUPERFICIE DE UN SUBSTRATO MEDIANTE LA IRRADIACION DE UNA FUENTE DE ALTA ENERGIA. EL INVENTO PERMITE LA ELIMINACION DE LOS CONTAMINANTES SUPERFICIALES SIN ALTERAR LA ESTRUCTURA MOLECULAR SUYACENTE DEL SUBSTRATO. LA FUENTE DE IRRADIACION DE ALTA ENERGIA CONSTA DE UN LASER PULSATIL (11).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/216,903 US5024968A (en) | 1988-07-08 | 1988-07-08 | Removal of surface contaminants by irradiation from a high-energy source |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2041374T3 true ES2041374T3 (es) | 1993-11-16 |
Family
ID=22808939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES198989112319T Expired - Lifetime ES2041374T3 (es) | 1988-07-08 | 1989-07-06 | Eliminacion de contaminantes superficiales mediante radiacion desde una fuente de alta energia. |
Country Status (16)
Country | Link |
---|---|
US (1) | US5024968A (es) |
EP (1) | EP0350021B1 (es) |
JP (1) | JP2634245B2 (es) |
KR (1) | KR0157608B1 (es) |
AT (1) | ATE88923T1 (es) |
AU (1) | AU620766B2 (es) |
BR (1) | BR8907529A (es) |
CA (1) | CA1328908C (es) |
DE (1) | DE68906318T2 (es) |
DK (1) | DK303490A (es) |
ES (1) | ES2041374T3 (es) |
FI (1) | FI910075A0 (es) |
HK (1) | HK5195A (es) |
LV (1) | LV11116B (es) |
NO (1) | NO180739C (es) |
WO (1) | WO1990000812A1 (es) |
Families Citing this family (139)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5525727A (en) * | 1982-05-18 | 1996-06-11 | University Of Florida | Brain-specific drug delivery |
US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
US5531857A (en) * | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
US6048588A (en) * | 1988-07-08 | 2000-04-11 | Cauldron Limited Partnership | Method for enhancing chemisorption of material |
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
US5151135A (en) * | 1989-09-15 | 1992-09-29 | Amoco Corporation | Method for cleaning surfaces using UV lasers |
JP2819166B2 (ja) * | 1989-10-03 | 1998-10-30 | キヤノン株式会社 | 放射光用光学素子の汚れ除去装置および方法 |
US5342350A (en) * | 1990-02-16 | 1994-08-30 | Jean Amiel | Method of endoscopically treating lithiases with a multichannel probe suitable for draining the treated lithiases |
FR2658412A1 (fr) * | 1990-02-19 | 1991-08-23 | Amiel Jean | Dispositif endoscopique notamment pour la destruction endoscopique de calcul par lithotritie. |
US5493445A (en) * | 1990-03-29 | 1996-02-20 | The United States Of America As Represented By The Secretary Of The Navy | Laser textured surface absorber and emitter |
US5322988A (en) * | 1990-03-29 | 1994-06-21 | The United States Of America As Represented By The Secretary Of The Navy | Laser texturing |
JP2977098B2 (ja) * | 1990-08-31 | 1999-11-10 | 忠弘 大見 | 帯電物の中和装置 |
US5093279A (en) * | 1991-02-01 | 1992-03-03 | International Business Machines Corporation | Laser ablation damascene process |
EP0502356A3 (en) * | 1991-02-28 | 1993-03-10 | Texas Instruments Incorporated | Photo-stimulated removal of trace metals |
US5695569A (en) * | 1991-02-28 | 1997-12-09 | Texas Instruments Incorporated | Removal of metal contamination |
JP2920850B2 (ja) * | 1991-03-25 | 1999-07-19 | 東京エレクトロン株式会社 | 半導体の表面処理方法及びその装置 |
JP2816037B2 (ja) * | 1991-07-25 | 1998-10-27 | 忠弘 大見 | 帯電物体の中和装置 |
JPH05218276A (ja) * | 1991-11-12 | 1993-08-27 | Motorola Inc | 割れにくい半導体装置およびその作製方法 |
US5571335A (en) * | 1991-12-12 | 1996-11-05 | Cold Jet, Inc. | Method for removal of surface coatings |
US5328517A (en) * | 1991-12-24 | 1994-07-12 | Mcdonnell Douglas Corporation | Method and system for removing a coating from a substrate using radiant energy and a particle stream |
US5194723A (en) * | 1991-12-24 | 1993-03-16 | Maxwell Laboratories, Inc. | Photoacoustic control of a pulsed light material removal process |
US5613509A (en) * | 1991-12-24 | 1997-03-25 | Maxwell Laboratories, Inc. | Method and apparatus for removing contaminants and coatings from a substrate using pulsed radiant energy and liquid carbon dioxide |
US5204517A (en) * | 1991-12-24 | 1993-04-20 | Maxwell Laboratories, Inc. | Method and system for control of a material removal process using spectral emission discrimination |
US5281798A (en) * | 1991-12-24 | 1994-01-25 | Maxwell Laboratories, Inc. | Method and system for selective removal of material coating from a substrate using a flashlamp |
US5782253A (en) * | 1991-12-24 | 1998-07-21 | Mcdonnell Douglas Corporation | System for removing a coating from a substrate |
US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
JPH07505577A (ja) * | 1992-03-31 | 1995-06-22 | コールドロン リミテッド パートナーシップ | 照射による表面汚染物の除去 |
US5512123A (en) * | 1992-05-19 | 1996-04-30 | Maxwell Laboratories | Method for using pulsed optical energy to increase the bondability of a surface |
TW372972B (en) * | 1992-10-23 | 1999-11-01 | Novartis Ag | Antiretroviral acyl compounds |
US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
US6017397A (en) * | 1993-03-05 | 2000-01-25 | Hyundai Eletronics America | Automated washing method |
US5373140A (en) * | 1993-03-16 | 1994-12-13 | Vernay Laboratories, Inc. | System for cleaning molding equipment using a laser |
TW252211B (es) * | 1993-04-12 | 1995-07-21 | Cauldron Ltd Parthership | |
US5656096A (en) * | 1993-05-25 | 1997-08-12 | Polygon Industries, Inc. | Method for photopyrolitically removing a contaminant |
US5482561A (en) * | 1993-06-11 | 1996-01-09 | Hughes Aircraft Company | Method for removing organic deposits from sand particles with laser beam |
US5518956A (en) * | 1993-09-02 | 1996-05-21 | General Electric Company | Method of isolating vertical shorts in an electronic array using laser ablation |
US5814156A (en) * | 1993-09-08 | 1998-09-29 | Uvtech Systems Inc. | Photoreactive surface cleaning |
WO1995007152A1 (en) * | 1993-09-08 | 1995-03-16 | Uvtech Systems, Inc. | Surface processing |
JP3355251B2 (ja) * | 1993-11-02 | 2002-12-09 | 株式会社日立製作所 | 電子装置の製造方法 |
GB9323052D0 (en) * | 1993-11-09 | 1994-01-05 | British Nuclear Fuels Plc | Radioactive decontamination |
US5543356A (en) * | 1993-11-10 | 1996-08-06 | Hitachi, Ltd. | Method of impurity doping into semiconductor |
US5584938A (en) * | 1993-12-10 | 1996-12-17 | Texas Instruments Incorporated | Electrostatic particle removal and characterization |
GB9407058D0 (en) * | 1994-04-09 | 1994-06-01 | British Nuclear Fuels Plc | Material removal by laser ablation |
US5516369A (en) * | 1994-05-06 | 1996-05-14 | United Microelectronics Corporation | Method and apparatus for particle reduction from semiconductor wafers |
US6015503A (en) * | 1994-06-14 | 2000-01-18 | Fsi International, Inc. | Method and apparatus for surface conditioning |
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-
1989
- 1989-07-06 AT AT89112319T patent/ATE88923T1/de not_active IP Right Cessation
- 1989-07-06 ES ES198989112319T patent/ES2041374T3/es not_active Expired - Lifetime
- 1989-07-06 DE DE89112319T patent/DE68906318T2/de not_active Expired - Fee Related
- 1989-07-06 EP EP89112319A patent/EP0350021B1/en not_active Expired - Lifetime
- 1989-07-07 KR KR1019890009662A patent/KR0157608B1/ko not_active IP Right Cessation
- 1989-07-07 WO PCT/US1989/002952 patent/WO1990000812A1/en active Application Filing
- 1989-07-07 BR BR898907529A patent/BR8907529A/pt not_active Application Discontinuation
- 1989-07-07 AU AU38676/89A patent/AU620766B2/en not_active Ceased
- 1989-07-07 CA CA000605060A patent/CA1328908C/en not_active Expired - Fee Related
- 1989-07-10 JP JP1177848A patent/JP2634245B2/ja not_active Expired - Fee Related
-
1990
- 1990-12-21 DK DK303490A patent/DK303490A/da not_active Application Discontinuation
-
1991
- 1991-01-07 FI FI910075A patent/FI910075A0/fi unknown
- 1991-01-07 NO NO910067A patent/NO180739C/no not_active IP Right Cessation
-
1994
- 1994-05-04 LV LVP-94-95A patent/LV11116B/en unknown
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1995
- 1995-01-12 HK HK5195A patent/HK5195A/xx not_active IP Right Cessation
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LV11116A (lv) | 1996-04-20 |
JPH0286128A (ja) | 1990-03-27 |
EP0350021A2 (en) | 1990-01-10 |
US5024968A (en) | 1991-06-18 |
EP0350021B1 (en) | 1993-05-05 |
AU620766B2 (en) | 1992-02-20 |
FI910075A0 (fi) | 1991-01-07 |
NO180739C (no) | 1997-06-04 |
DK303490D0 (da) | 1990-12-21 |
LV11116B (en) | 1996-10-20 |
KR900002414A (ko) | 1990-02-28 |
NO910067L (no) | 1991-01-07 |
EP0350021A3 (en) | 1990-05-23 |
NO910067D0 (no) | 1991-01-07 |
JP2634245B2 (ja) | 1997-07-23 |
CA1328908C (en) | 1994-04-26 |
NO180739B (no) | 1997-02-24 |
KR0157608B1 (ko) | 1998-12-01 |
BR8907529A (pt) | 1991-06-11 |
DK303490A (da) | 1991-02-25 |
DE68906318D1 (de) | 1993-06-09 |
AU3867689A (en) | 1990-02-05 |
ATE88923T1 (de) | 1993-05-15 |
HK5195A (en) | 1995-01-20 |
WO1990000812A1 (en) | 1990-01-25 |
DE68906318T2 (de) | 1993-10-07 |
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