EP3507393B1 - Precursors and flowable cvd methods for making low-k films to fill surface features - Google Patents

Precursors and flowable cvd methods for making low-k films to fill surface features Download PDF

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EP3507393B1
EP3507393B1 EP17847260.1A EP17847260A EP3507393B1 EP 3507393 B1 EP3507393 B1 EP 3507393B1 EP 17847260 A EP17847260 A EP 17847260A EP 3507393 B1 EP3507393 B1 EP 3507393B1
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group
plasma
situ
branched
linear
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German (de)
English (en)
French (fr)
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EP3507393A1 (en
EP3507393A4 (en
Inventor
Jianheng LI
Raymond Nicholas Vrtis
Robert Gordon Ridgeway
Manchao Xiao
Xinjian Lei
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Versum Materials US LLC
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Versum Materials US LLC
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
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    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/126—Preparation of silica of undetermined type
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    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1896—Compounds having one or more Si-O-acyl linkages
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
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    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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Definitions

  • compositions for forming a silicon-containing film in a deposition process such as, for example, a flowable chemical vapor deposition.
  • exemplary silicon-containing films that can be deposited using the compositions and methods described herein include silicon oxide, silicon nitride, silicon oxynitride or carbon-doped silicon oxide or carbon-doped silicon nitride films.
  • Flowable oxide deposition methods typically use alkoxysilane compounds as precursors for silicon-containing films which are deposited by controlled hydrolysis and condensation reactions. Such films can be deposited onto a substrate, for example, by applying a mixture of water and alkoxysilanes, optionally with solvent and/or other additives such as surfactants and porogens, onto a substrate. Typical methods for the application of these mixtures include spin coating, dip coating, spray coating, screen printing, co-condensation, and ink jet printing.
  • the water within the mixture can react with the alkoxysilanes to hydrolyze the alkoxide and/or aryloxide groups and generate silanol species, which further condense with other hydrolyzed molecules and form an oligomeric or network structure.
  • energy sources such as, for example, thermal, plasma, and/or other sources
  • Typical methods generally relate to filling gaps on substrates with a solid dielectric material by forming a flowable liquid film in the gap.
  • the flowable film is formed by reacting a dielectric precursor which may have a Si-C bond with an oxidant to form the dielectric material.
  • the dielectric precursor condenses and subsequently reacts with the oxidant to form dielectric material.
  • vapor phase reactants react to form a condensed flowable film. Since the Si-C bond is relatively inert towards reaction with water, the resultant network may be beneficially functionalized with organic functional groups which impart desired chemical and physical properties to the resultant film. For example, the addition of carbon to the network may lower the dielectric constant of the resultant film.
  • TSA trisilylamine
  • TSA trisilylamine
  • TSA is typically delivered into the reaction chamber as a gas, mixed with ammonia, and activated in a remote plasma reactor to generate NH 2 , NH, H and or N radicals or ions.
  • the TSA reacts with the plasma activated ammonia and begins to oligomerize to form higher molecular weight TSA dimers and trimers or other species which contain Si, N and H.
  • the substrate is placed in the reactor and cooled to one or more temperatures ranging from about 0 to about 50°C at a certain chamber pressures and TSA/activated ammonia mixtures the oligomers begin to condense on the wafers surface in such a way that they can "flow" to fill the trench surface feature.
  • a material which contains Si, N and H is deposited onto the wafer and fills the trench.
  • a pre-anneal step is performed to allow the film to be more SiN-like. It is desirable to have a SiN material because the next process step is oxidation at one or more temperatures ranging from 100 - 700°C using ozone or water. Because of the SiN bond distance and angles, it is known that as SiN is oxidized to SiO 2 there is a unit cell volume increase which prevents the film from shrinking.
  • EP1464726 discloses a CVD method for forming a porous low dielectric constant SiOCH film using an organosilicon precursor (e.g. diacetoxydimethylsilane) and a rate enhancer.
  • organosilicon precursor e.g. diacetoxydimethylsilane
  • the deposition temperature was 250 °C.
  • EP3051001 discloses a method for depositing silicon-containing layers using an organosilicon precursor (e.g. dimethyldiacetoxysilane) to form a silicon oxide layer, preferably at a temperature of 450 to 550 °C.
  • organosilicon precursor e.g. dimethyldiacetoxysilane
  • US2004/115954 discloses porous dielectric films prepared by depositing a Si-O-C film (e.g. using diacetoxydimethylsilane) then heating to decompose organic fragments trapped within.
  • TSA trisilylamine
  • a hardening process including thermal annealing, UV cure, or ion/radical densification, may be applied to the flowable films.
  • the hardening process may remove carbon groups, hydroxyl groups and smaller molecular weight species from the deposited materials. Referring now to FIG. 1 , this often leaves voids, cracks or spaces in the hardened material. Such films are also not suitable for low-k film applications.
  • compositions or formulations described herein and methods using same overcome the problems of the prior art by depositing a silicon-containing film on at least a portion of the substrate surface that provides desirable film properties upon post-deposition treatment.
  • the instant invention can provide a silicon containing film having: i) a mechanical integrity in terms of Young's Modulus from about 2 to about 15GPa, about 4 to about 12 and in some cases about 6 to about 10, ii) a porosity of about 10 to about 30 volume%, about 12 to about 25 and in some cases about 16 to about 22 (e.g., as measured by ellipsometric porosimetry), and iii) a dielectric constant of about 2.2 to about 3.0, about 2.4 to about 2.8 and in some cases about 2.5 to about 2.7.
  • the invention described herein provides a method for depositing a silicon-containing film, the method comprising:
  • the method of the present invention further comprises the step of subjecting the coating to a thermal treatment at one or more temperatures between about 100 °C to about 1000 °C to densify at least a portion of the coating and form a hardened layer.
  • the method of the present invention further comprises the step of exposing the hardened layer to energy selected from the group consisting of a plasma, infrared light, chemical treatment, an electron beam, or UV light to form the final silicon-containing film.
  • a precursor composition comprising at least one silicon-containing compound having at least one acetoxy group, wherein the at least one silicon-containing compound is selected from the group consisting of: I(a).
  • R is selected from hydrogen, a linear or branched C 1 to C 6 alkyl group
  • R 1 is selected from a linear or branched C 1 to C 6 alkyl group, a linear or branched C 2 to C 6 alkenyl group, a linear or branched C 2 to C 6 alkynyl group
  • R 2 is selected from a linear or branched C 1 to C 6 alkyl group
  • m 2 or 3
  • m 1 or 2
  • p 0 or 1
  • R is selected from hydrogen, a linear or branched C 1 to C 6 alkyl group
  • R 1 is selected from a linear or branched C 1 to C 6 alkyl group, a linear or branched C 2 to C 6 alkenyl group, a linear or branched C 2 to C 6 alkynyl group
  • R 3 is selected from hydrogen, a linear or branched C 1 to C 10 alkyl group
  • R 4 is selected from a linear or branched C 1 to C 6 alkyl group
  • m 2 or 3
  • n 1 or 2
  • p 0 or 1
  • letters may be used to identify claimed method steps (e.g. a, b, and c). These letters are used to aid in referring to the method steps and are not intended to indicate the order in which claimed steps are performed, unless and only to the extent that such order is specifically recited in the claims.
  • compositions or formulations described herein and methods using same overcome the problems of the prior art by depositing a silicon-containing film on at least a portion of the substrate surface that provides desirable film properties upon post-deposition treatment.
  • the present invention is directed to semiconductor thin film process techniques. Methods and system are described for improving quality of the dielectric film morphologically adapted over various device structures. More particularly, embodiments of the invention provide methods of forming silicon oxide film with increased density to achieve void free gap fill for trenches having a high aspect ratio. For example, the invention is applied to form high quality silicon oxide films for filling narrow STI trenches, among other applications.
  • flowable liquid oligomer it is meant a polysiloxane material that is flowable under deposition conditions wherein the polysiloxane is measured via FTIR. After curing the flowable liquid oligomer forms a solid carbon doped porous OSG.
  • the silicon-containing film is selected from the group consisting of a silicon nitride, a silicon carbide, a silicon oxide, a carbon-doped silicon nitride, a silicon oxynitride, and a carbon-doped silicon oxynitride film.
  • the compositions can be pre-mixed compositions, premixtures (mixed before being used in the deposition process), or in-situ mixtures (mixed during the deposition process).
  • premixtures mixed before being used in the deposition process
  • in-situ mixtures mixed during the deposition process.
  • silicon oxide refers to a film comprising silicon and oxygen selected from the group consisting of stoichiometric or non-stoichiometric silicon oxide, carbon doped silicon oxide, silicon carboxynitride and mixtures thereof.
  • the first step is placing a substrate comprising at least one surface feature into a reactor which is at a temperature of from about -20 °C to about 40 °C.
  • Suitable substrates include, but are not limited to, semiconductor materials such as gallium arsenide (“GaAs”), boronitride (“BN”) silicon, and compositions containing silicon such as crystalline silicon, polysilicon, amorphous silicon, epitaxial silicon, silicon dioxide (“SiO 2 "), silicon carbide (“SiC”), silicon oxycarbide (“SiOC”), silicon nitride (“SiN”), silicon carbonitride (“SiCN”), organosilicate glasses (“OSG”), organofluorosilicate glasses (“OFSG”), fluorosilicate glasses (“FSG”), and other appropriate substrates or mixtures thereof.
  • semiconductor materials such as gallium arsenide (“GaAs"), boronitride (“BN”) silicon
  • compositions containing silicon such as crystalline silicon, polysilicon, amorphous
  • Substrates may further comprise a variety of layers to which the film is applied such as, for example, antireflective coatings, photoresists, organic polymers, porous organic and inorganic materials, metals such as copper and aluminum, or diffusion barrier layers, e.g., TiN, Ti(C)N, TaN, Ta(C)N, Ta, W, WN, TiSiN, TaSiN, SiCN, TiSiCN, TaSiCN, or W(C)N.
  • the organosilicate glass films of the present invention are preferably capable of adhering to at least one of the foregoing materials sufficiently to pass a conventional pull test, such as an ASTM D3359-95a tape pull test.
  • the substrate may be a single crystal silicon wafer, a wafer of silicon carbide, a wafer of aluminum oxide (sapphire), a sheet of glass, a metallic foil, an organic polymer film or may be a polymeric, glass, silicon or metallic 3-dimensional article.
  • the substrate may be coated with a variety of materials well known in the art including films of silicon oxide, silicon nitride, amorphous carbon, silicon oxycarbide, silicon oxynitride, silicon carbide, gallium arsenide, gallium nitride and the like. These coatings may completely coat the substrate, may be in multiple layers of various materials and may be partially etched to expose underlying layers of material.
  • the surface may also have on it a photoresist material that has been exposed with a pattern and developed to partially coat the substrate.
  • the substrate comprises a surface feature.
  • surface feature means that the substrate or partially fabricated substrate comprises one or more of the following pores, trenches, shallow trench isolation (STI), vias, reentrant feature, or the like.
  • the surface feature(s) have a width of 100 ⁇ m or less, 1 ⁇ m in width or less, or 0.5 ⁇ m in width or less, or 50 nm in width or less.
  • the aspect ratio (the depth to width ratio) of the surface features, if present, is 0.1:1 or greater, or 1:1 or greater, or 10:1 or greater, or 20:1 or greater, or 40:1 or greater.
  • the methods used to form the films or coatings described herein are flowable chemical deposition processes.
  • suitable deposition processes for the method disclosed herein include, but are not limited to, thermal chemical vapor deposition (CVD) or plasma enhanced cyclic CVD (PECCVD) process.
  • An exemplary flowable CVD reactor is disclosed in U.S. Publ. No. 2014/0073144.
  • the term "flowable chemical vapor deposition processes" refers to any process wherein a substrate is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to provide flowable oligomeric silicon-containing species and then produce the solid film or material upon further treatment.
  • the precursors, reagents and sources used herein may be sometimes described as "gaseous", it is understood that the precursors can be either liquid or solid which are transported with or without an inert gas into the reactor via direct vaporization, bubbling or sublimation.
  • the vaporized precursors can pass through a plasma generator.
  • the films are deposited using a plasma-based (e.g., remote generated or in situ) CVD process.
  • reactor includes without limitation, a reaction chamber or deposition chamber.
  • the substrate may be exposed to one or more pre-deposition treatments such as, but not limited to, a plasma treatment, thermal treatment, chemical treatment, ultraviolet light exposure, electron beam exposure, and combinations thereof to affect one or more properties of the films.
  • pre-deposition treatments such as, but not limited to, a plasma treatment, thermal treatment, chemical treatment, ultraviolet light exposure, electron beam exposure, and combinations thereof to affect one or more properties of the films.
  • These pre-deposition treatments may occur under an atmosphere selected from inert, oxidizing, and/or reducing.
  • chemical reagents used herein may be sometimes described as "gaseous,” it is understood that the chemical reagents may be delivered directly as a gas to the reactor, delivered as vapors from vaporizing liquid or bubbling liquid using carrier gas such as nitrogen, helium or argon, vapors from subliming solid and/or transported by an inert carrier gas into the reactor.
  • carrier gas such as nitrogen, helium or argon
  • the silicon-containing compound is also referred to herein as a "precursor"
  • linear alkyl denotes a linear functional group having from 1 to 10, 3 to 10, or 1 to 6 carbon atoms.
  • branched alkyl denotes a branched functional group having from 3 to 10, or 1 to 6 carbon atoms.
  • Exemplary linear alkyl groups include, but are not limited to, methyl, ethyl, propyl, butyl, pentyl, and hexyl groups.
  • Exemplary branched alkyl groups include, but are not limited to, isopropyl, isobutyl, sec-butyl, tert-butyl, iso-pentyl, tert-pentyl, isohexyl, and neohexyl.
  • aryl denotes an aromatic cyclic functional group having from 3 to 10 carbon atoms, from 5 to 10 carbon atoms, or from 6 to 10 carbon atoms.
  • exemplary aryl groups include, but are not limited to, phenyl, benzyl, chlorobenzyl, tolyl, and o-xylyl.
  • alkenyl group denotes a group which has one or more carbon-carbon double bonds and has from 2 to 12, from 2 to 10, or from 2 to 6 carbon atoms.
  • alkenyl groups include, but are not limited to, vinyl or allyl groups.
  • alkynyl group denotes a group which has one or more carbon-carbon triple bonds and has from 2 to 10 or from 2 to 6 carbon atoms.
  • alkenyl groups include, but are not limited to, ethynyl.
  • silicon-containing precursor comprises a compound having Formula I(a)
  • examples of precursors include the following:
  • Examples of compounds of Formula I(a) include diacetoxydimethylsilane, diacetoxymethylsilane, triacetoxymethylsilane, diacetoxydivinylsilane, diacetoxymethylvinylsilane, triacetoxyvinylsilane, diacetoxydiethynylsilane, diacetoxymehylethynylsilane, and triacetoxyethynylsilane.
  • silicon-containing precursor comprises a compound having Formula I(b)
  • examples of precursors include the following:
  • Examples of compounds of Formula I(b) include diacetoxymethoxymethylsilane, diacetoxydimethoxysilane, and triacetoxymethoxysilane.
  • silicon-containing precursor comprises a compound having Formula I(c)
  • examples of precursors include the following:
  • Examples of compounds of Formula I(c) include diacetoxydimethylaminoxymethylsilane, diacetoxydi(methylethyl)aminoxymethylsilane, and diacetoxydiethylaminoxymethylsilane.
  • the silicon-containing precursor compounds described herein may be delivered to the reaction chamber such as a CVD or ALD reactor in a variety of ways.
  • a liquid delivery system may be utilized.
  • a combined liquid delivery and flash vaporization process unit may be employed, such as, for example, the turbo vaporizer manufactured by MSP Corporation of Shoreview, MN, to enable low volatility materials to be volumetrically delivered, which leads to reproducible transport and deposition without thermal decomposition of the precursor.
  • the precursors described herein may be delivered in neat liquid form, or alternatively, may be employed in solvent formulations or compositions comprising same.
  • the precursor formulations may include solvent component(s) of suitable character as may be desirable and advantageous in a given end use application to form a film on a substrate.
  • the silicon-containing precursor compounds are preferably substantially free of halide ions such as chloride or metal ions such as Al.
  • halide ions or halides
  • metal ions such as, for example, chlorides, fluorides, bromides, iodides, Al 3+ ions, Fe 2+ , Fe 3+ , Ni 2+ , Cr 3+ means less than 5 ppm (by weight), preferably less than 3 ppm, and more preferably less than 1 ppm, and most preferably 0 ppm of each halide or metal ions.
  • Chlorides or metal ions are known to act as decomposition catalysts for silicon precursors.
  • silicon precursors are known to form flammable and/or pyrophoric gases upon decomposition such as hydrogen and silane. Compositions comprising the instant precursor compounds are substantially free of such decomposition products. Therefore, the accelerated decomposition of the silicon-containing precursors presents safety and performance concerns related to the formation of these flammable and/or pyrophoric gaseous byproducts.
  • Silicon-containing precursors according to the present invention that are substantially free of halides can be achieved by (1) reducing or eliminating chloride sources during chemical synthesis, and/or (2) implementing an effective purification process to remove chloride from the crude product such that the final purified product is substantially free of chlorides.
  • Chloride sources may be reduced during synthesis by using reagents that do not contain halides such as chlorodisilanes, bromodisilanes, or iododisilanes thereby avoiding the production of by-products that contain halide ions.
  • the aforementioned reagents should be substantially free of chloride impurities such that the resulting crude product is substantially free of chloride impurities.
  • the synthesis should not use halide based solvents, catalysts, or solvents which contain unacceptably high levels of halide contamination.
  • the crude product may also be treated by various purification methods to render the final product substantially free of halides such as chlorides. Such methods are well described in the prior art and, may include, but are not limited to purification processes such as distillation, or adsorption. Distillation is commonly used to separate impurities from the desire product by exploiting differences in boiling point. Adsorption may also be used to take advantage of the differential adsorptive properties of the components to effect separation such that the final product is substantially free of halide. Adsorbents such as, for example, commercially available MgO-Al 2 O 3 blends can be used to remove halides such as chloride.
  • compositions comprising a solvent(s) and at least one silicon-containing compound described herein, the solvent or mixture thereof selected does not react with the silicon compound.
  • the amount of solvent by weight percentage in the composition ranges from 0.5% by weight to 99.5% or from 10% by weight to 75%.
  • the solvent has a boiling point (b.p.) similar to the b.p. of the precursors of Formulae I(a), I(b), and I(c) or the difference between the b.p. of the solvent and the b.p.
  • the silicon precursor precursors of Formulae I(a), I(b), and I(c) is 40 °C or less, 30 °C or less, or 20 °C or less, 10 °C or less, or 5 °C or less.
  • the difference between the boiling points ranges from any one or more of the following end-points: 0, 10, 20, 30, or 40 °C.
  • suitable ranges of b.p. difference include without limitation, 0 °C to 40 °C, 20 °C to 30 °C, or 10 °C to 30°C.
  • suitable solvents in the compositions include, but are not limited to, an ether (such as 1,4-dioxane, dibutyl ether), a tertiary amine (such as pyridine, 1-methylpiperidine, 1-ethylpiperidine, N,N'-Dimethylpiperazine, N,N,N',N'-Tetramethylethylenediamine), a nitrile (such as benzonitrile), an alkyl hydrocarbon (such as octane, nonane, dodecane, ethylcyclohexane), an aromatic hydrocarbon (such as toluene, mesitylene), a tertiary aminoether (such as bis(2-dimethylaminoethyl) ether), or mixtures thereof.
  • an ether such as 1,4-dioxane, dibutyl ether
  • a tertiary amine such as pyridine, 1-methylpiperidine, 1-ethy
  • the introducing step, wherein the at least one silicon-containing compound is introduced into the reactor is conducted at one or more temperatures ranging from -20 °C to 1000 °C, or from about 400 °C to about 1000 °C, or from about 400 °C to about 600 °C, or from about -20 °C to about 400 °C.
  • the substrate comprises a semiconductor substrate comprising a surface feature.
  • the method of the present invention includes the step of providing an in-situ plasma or remote plasma source to at least partially react the at least one silicon-containing compound to form a flowable liquid oligomer wherein the flowable liquid oligomer forms a coating on the substrate and at least partially fills at least a portion of the at least one surface feature.
  • Energy is applied to the at least one silicon-containing compound, nitrogen-containing source (if employed), oxygen source, other precursors or combination thereof to induce reaction and to form the silicon-containing film or coating on the substrate.
  • Such energy can be provided by, but not limited to, thermal, plasma, pulsed plasma, helicon plasma, high density plasma, inductively coupled plasma, X-ray, e-beam, photon, remote plasma methods, and combinations thereof.
  • a secondary RF frequency source can be used to modify the plasma characteristics at the substrate surface.
  • the plasma-generated process may comprise a direct plasma-generated process in which plasma is directly generated in the reactor, or alternatively a remote plasma-generated process in which plasma is generated outside of the reactor and supplied into the reactor.
  • a composition comprises the inventive silicon containing precursor and at least one of the oxygen or nitrogen containing source.
  • a composition comprises an oligomer obtained from the inventive precursor and at least one of oxygen or nitrogen containing source.
  • the plasma is selected from but not limited to the group consisting of a nitrogen plasma; plasma comprising nitrogen and helium; a plasma comprising nitrogen and argon; an ammonia plasma; a plasma comprising ammonia and helium; a plasma comprising ammonia and argon; helium plasma; argon plasma; hydrogen plasma; a plasma comprising hydrogen and helium; a plasma comprising hydrogen and argon; a plasma comprising ammonia and hydrogen; an organic amine plasma; a plasma comprising oxygen; a plasma comprising oxygen and hydrogen, and mixtures thereof.
  • the plasma source is selected from but not limited to the group consisting of a carbon source plasma, including a hydrocarbon plasma, a plasma comprising hydrocarbon and helium, a plasma comprising hydrocarbon and argon, carbon dioxide plasma, carbon monoxide plasma, a plasma comprising hydrocarbon and hydrogen, a plasma comprising hydrocarbon and a nitrogen source, a plasma comprising hydrocarbon and an oxygen source, and mixtures thereof.
  • a carbon source plasma including a hydrocarbon plasma, a plasma comprising hydrocarbon and helium, a plasma comprising hydrocarbon and argon, carbon dioxide plasma, carbon monoxide plasma, a plasma comprising hydrocarbon and hydrogen, a plasma comprising hydrocarbon and a nitrogen source, a plasma comprising hydrocarbon and an oxygen source, and mixtures thereof.
  • the method deposits a film upon at least a portion of the surface of a substrate comprising a surface feature.
  • the substrate is placed into the reactor and the substrate is maintained at one or more temperatures ranging from about -20°C to about 40°C. In one particular embodiment, the temperature of the substrate is less than the walls of the chamber.
  • the substrate temperature is held preferably at a temperature below 25 °C and most preferably below 10 °C and greater than -20 °C.
  • the reactor is at a pressure below atmospheric pressure or 750 torr (10 5 Pascals (Pa)) or less, or 100 torr (13332 Pa) or less. In other embodiments, the pressure of the reactor is maintained at a range of about 0.1 torr (13 Pa) to about 10 torr (1333 Pa).
  • the silicon-containing compounds react with each other and form oligomers which condense as a liquid (liquid oligomers) on the surface of the substrate and at least partially fill the features on the substrate.
  • oligomers condense as a liquid (liquid oligomers) on the surface of the substrate and at least partially fill the features on the substrate.
  • direct use of the as-deposited film can result in a dielectric that is too porous and does not have an adequate mechanical strength.
  • certain embodiments of the present development are applied to perform further treatment of the as-deposited silicon oxide layer to improve film quality with increased density and still achieve a void free gap fill.
  • void free it is meant a visual determination obtained by viewing an SEM or TEM of the deposited and cured film.
  • the flowable liquid oligomer is thermally annealed at one or more temperatures ranging from about 100 °C to about 1000 °C to densify at least a portion of the materials followed by broadband UV treatment at the temperature ranging from 100 °C to 1000 °C.
  • cross-linking is needed during the treatment. For example, when diacetoxydimethylsilane is heated, an acetic anhydride molecule is lost and Si-O-Si bonds are formed. The loss of an acetic anhydride molecule leads to the creation and nanoscale pores. Since there are two acetoxy groups on each silicon atom, the cross-linking formation leads to long chains.
  • a precursor with three acetoxy functional groups is needed.
  • an oxidant O 2 or CO 2
  • Film densities typically range from 1.5 to 2.0 g/cm 3 for silicon oxide or carbon doped silicon oxide and 1.8 to 2.8 g/cm 3 for silicon nitride or carbon doped silicon nitride. Thus, such films are suitable for use as low-k material applications.
  • the dielectric constant, k, achieved typically ranges from 2.5 to 2.8, or 2.5 to 3.0, for carbon doped silicon oxide.
  • the resultant silicon-containing films or coatings can be exposed to a post-deposition treatment such as, but not limited to, a plasma treatment including, but not limited to, hydrogen plasma, helium plasm, argon plasma, ammonia plasma, water (H 2 O) plasma, oxygen plasma, ozone (O 3 ) plasma, NO plasma, N 2 O plasma, carbon monoxide (CO) plasma, carbon dioxide (CO 2 ) plasma and combinations thereof, chemical treatment, ultraviolet light exposure, Infrared exposure, electron beam exposure, and/or other treatments to affect one or more properties of the film.
  • a plasma treatment including, but not limited to, hydrogen plasma, helium plasm, argon plasma, ammonia plasma, water (H 2 O) plasma, oxygen plasma, ozone (O 3 ) plasma, NO plasma, N 2 O plasma, carbon monoxide (CO) plasma, carbon dioxide (CO 2 ) plasma and combinations thereof, chemical treatment, ultraviolet light exposure, Infrared exposure, electron beam exposure, and/or other treatments to affect one or more properties of the film
  • the post thermal treatment materials are exposed to a plasma, infrared lights, chemical treatment, an electron beam, or UV light to form a dense film.
  • steps of the methods described herein may be performed in a variety of orders, may be performed sequentially or concurrently (e.g., during at least a portion of another step), and any combination thereof.
  • the respective step of supplying the compounds and other reagents may be performed by varying the duration of the time for supplying them to change the stoichiometric composition of the resulting silicon-containing film.
  • the instant invention comprises a substrate comprising patterned structure having at least one feature (e.g., via or trench) upon which the inventive film (e.g., carbon doped silicon oxide) is deposited and a film comprising a barrier layer (e.g., at least one of cobalt, silicon carbonitride, silicon nitride, carbon oxynitride, TiN and TaN) deposited upon the inventive film.
  • inventive film e.g., carbon doped silicon oxide
  • a barrier layer e.g., at least one of cobalt, silicon carbonitride, silicon nitride, carbon oxynitride, TiN and TaN
  • FCVD Flowable chemical vapor deposition
  • medium resistivity 8-12 ⁇ cm
  • the resultant silicon-containing films or coatings can be exposed to a pre-deposition treatment such as, but not limited to, a plasma treatment, thermal treatment, chemical treatment, ultraviolet light exposure, Infrared exposure, electron beam exposure, and/or other treatments to affect one or more properties of the film.
  • a pre-deposition treatment such as, but not limited to, a plasma treatment, thermal treatment, chemical treatment, ultraviolet light exposure, Infrared exposure, electron beam exposure, and/or other treatments to affect one or more properties of the film.
  • Depositions on a modified FCVD chamber on an Applied Materials Precision 5000 system can be performed using either a silane or a TEOS process kit.
  • the chamber has direct liquid injection (DLI) delivery capability.
  • the precursors are liquids with delivery temperatures dependent on the precursor's boiling point.
  • typical liquid precursor flow rates were 100-5000 mg/min, oxygen (or alternatively carbon dioxide) flow rates were 20-40 sccm, in-situ plasma power density was 0.25 - 3.5 W/cm 2 , pressure was 0.75 - 12 Torr (100 - 1600 Pa).
  • the films were thermally annealed and/or UV cured in vacuum using the modified PECVD chamber at 100-1000 C, preferably 300 ⁇ 400 °C. Thickness and refractive index (RI) at 632 nm were measured by a SCI reflectometer or Woollam ellipsometer. Typical film thickness ranged from 10 to 2000 nm.
  • Bonding properties and hydrogen content (Si-H, C-H and N-H) of the silicon-based films were measured and analyzed by a Nicolet transmission Fourier transform infrared spectroscopy (FTIR) tool. All density measurements were accomplished using X-ray reflectivity (XRR). X-ray Photoelectron Spectroscopy (XPS) and Secondary ion mass spectrometry (SIMS) analysis were performed to determine the elemental composition of the films. The flowability and gap fill effects on patterned wafers were observed by a cross-sectional Scanning Electron Microscopy (SEM) using a Hitachi S-4800 system at a resolution of 2.0 nm. The porosity of the film was measured by ellipsometric porosimetry.
  • Flowable CVD depositions were conducted using a design of experiment (DOE) methodology.
  • the experimental design includes: precursor flows from 100 to 5000 mg/min, preferably 500 to 2000 mg/min; oxygen (or CO 2 ) flow from 0 sccm to 1000 sccm, preferably 0 to 100 sccm; pressure from 0.75 to 12 Torr (100 to 1600 Pa), preferably 6 to 10 Torr (800 to 1300 Pa); RF power (13.56 MHz) 50 to 1000 W, preferably 100 ⁇ 500 W; Low-frequency (LF) power 0 to 100 W; and deposition temperature ranged from -20 to 400°C, preferably - 20 °C to 40 °C.
  • the DOE experiments were used to determine what process parameters produced the optimal film with good flowability.
  • the flowable film was thermally annealed at 300°C for 5 min, followed by 400 °C UV cure for 10 minutes.
  • FIG. 2 shows a cross-sectional SEM indicates that good gap-fill was achieved by the deposition of diacetoxydimethylsilane with O 2 .
  • Figure 3 shows a cross-sectional SEM of the film of Figure 2 that was thermally annealed for 5 min at 300 °C and UV cured for 10 min at 400 °C ( FIG. 4 ).
  • FIG. 4 is a SEM micrograph showing the silicon oxide film of FIG. 3 after UV exposure for 10 min at 400 °C.

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TW201920758A (zh) 2019-06-01
JP2019528580A (ja) 2019-10-10
TWI654335B (zh) 2019-03-21
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WO2018044712A8 (en) 2018-08-23
US20220157601A1 (en) 2022-05-19
EP4047109A1 (en) 2022-08-24
US20180061636A1 (en) 2018-03-01
KR20190034356A (ko) 2019-04-01
US11270880B2 (en) 2022-03-08
KR102265826B1 (ko) 2021-06-16
TW201816178A (zh) 2018-05-01
US10468244B2 (en) 2019-11-05
EP4047109B1 (en) 2024-07-24
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