SG11201901543YA - Precursors and flowable cvd methods for making low-k films to fill surface features - Google Patents
Precursors and flowable cvd methods for making low-k films to fill surface featuresInfo
- Publication number
- SG11201901543YA SG11201901543YA SG11201901543YA SG11201901543YA SG11201901543YA SG 11201901543Y A SG11201901543Y A SG 11201901543YA SG 11201901543Y A SG11201901543Y A SG 11201901543YA SG 11201901543Y A SG11201901543Y A SG 11201901543YA SG 11201901543Y A SG11201901543Y A SG 11201901543YA
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- SG
- Singapore
- Prior art keywords
- international
- flowable
- silicon
- august
- pct
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/126—Preparation of silica of undetermined type
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- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1111111011110111010101111101 110 1 0011101 111011101111 OH 011 11110111011# Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\"\"1 WO 2018/044712 Al 08 March 2018 (08.03.2018) WIP0 I PCT (51) International Patent C23C 16/40 (2006.01) C23C 16/34 (2006.01) C23C 16/32 (2006.01) C23C 16/30 (2006.01) (21) International Application (22) International Filing Date: (25) Filing Language: (26) Publication Language: (30) Priority Data: 62/381,222 30 August 2016 (30.08.2016) 15/681,102 18 August 2017 (18.08.2017) (71) Applicant: VERSUM 8555 S. River Parkway, Temple, AZ 85284 (US). Classification: (72) Inventors: LI, Jianheng; 2870 Kaiser Drive, Apartment C23C 16/50 (2006.01) 105, Santa Clara, CA 95051 (US). VRTIS, Raymond, C23C 16/56 (2006.01) Nicholas; 1510 Randi Lane, Orefield, PA 18069 (US). H01L 21/02 (2006.01) RIDGEWAY, Robert, Gordon; 3277 Dovecote Drive, Quakertown, PA 18951 (US). XIAO, Manchao; 5534 Ca- Number: ballos Place, San Diego, CA 92130 (US). LEI, Xinjian; PCT/US2017/048599 1928 Cherrywood Street, Vista, CA 92081 (US). (74) Agent: ROSSI, Joseph, D. et al.; Stradley Ronon Stevens 25 August 2017 (25.08.2017) & Young, LLP, 30 Valley Stream Parkway, Great Valley Corporate Center, Malvern, PA 19355 (US). English (81) Designated States (unless otherwise indicated, for every English kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, US CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, US DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, MATERIALS US, LLC [US/US]; KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, AND FLOWABLE CVD METHODS FOR MAKING LOW-K FILMS TO FILL SURFACE FEATURES rx: , :••x...: , nu•x: , m,:r• - - x: ,- ;;;; ; - • rIew - 11•1„i - wm - v• :„,i - • SP16561-123 „;„ — _ „;„ „„, .,_ 15-1 #092 N, ‘1 \ ‘\ \ „vs •• '' ‘‘ ‘,• \\‘‘ ‘,,,? 1 1 \,. , „, eis„ • N \ k , a k .„ \ - „ „ k• N , „,,,IIIIIIIIIII 2.0kV 3.5mm x100k SE(U) A \ \ k 0 500nm comprising at least one introducing into the reactor least one silicon-containing coating on the substrate and has a low k and excellent = (54) Title: PRECURSORS = = _ = = = = = = = FIG. 2 depositing a silicon-containing film, the method comprising: placing a substrate CVD reactor which is at a temperature of from about -20 °C to about 400 °C; compound having at least one acetoxy group to at least partially react the at liquid oligomer wherein the flowable liquid oligomer forms a silicon oxide a portion of the at least one surface feature. Once cured, the silicon oxide coating ,-, ei ,-1 IN (57) : A method for 71. surface feature into a flowable C at least one silicon-containing ---, compound to form a flowable * 1 : at least partially fills at least Il C mechanical properties. ei C [Continued on next page] WO 2018/044712 Al 1#110figinigE1010101HOHOMOHOIREM SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662381222P | 2016-08-30 | 2016-08-30 | |
US15/681,102 US10468244B2 (en) | 2016-08-30 | 2017-08-18 | Precursors and flowable CVD methods for making low-K films to fill surface features |
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- 2017-08-25 SG SG11201901543YA patent/SG11201901543YA/en unknown
- 2017-08-25 EP EP17847260.1A patent/EP3507393B1/en active Active
- 2017-08-25 KR KR1020197008382A patent/KR102265826B1/en active IP Right Grant
- 2017-08-25 JP JP2019511753A patent/JP6849792B2/en active Active
- 2017-08-29 TW TW108105787A patent/TWI706053B/en active
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TWI706053B (en) | 2020-10-01 |
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EP3507393B1 (en) | 2022-04-20 |
JP2019528580A (en) | 2019-10-10 |
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TWI654335B (en) | 2019-03-21 |
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US20180061636A1 (en) | 2018-03-01 |
EP3507393A1 (en) | 2019-07-10 |
TW201920758A (en) | 2019-06-01 |
EP3507393A4 (en) | 2020-02-26 |
US10468244B2 (en) | 2019-11-05 |
TW201816178A (en) | 2018-05-01 |
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