SG11201903865TA - Precursors and flowable cvd methods for making low-k films to fill surface features - Google Patents
Precursors and flowable cvd methods for making low-k films to fill surface featuresInfo
- Publication number
- SG11201903865TA SG11201903865TA SG11201903865TA SG11201903865TA SG11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- silicon
- pct
- flowable
- precursors
- Prior art date
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- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111111111011111111111111110110010011111111111100110111111011111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/085093 Al 11 May 2018 (11.05.2018) WIPO I PCT (51) (21) (22) (25) Filing Language: (26) (30) (71) (72) International Patent Classification: Way, #311, Carlsbad, CA 92008 (US). HO, Richard; 5815 C23C 16/30 (2006.01) C23C 16/48 (2006.01) E. La Palma Avenue, #313, Anaheim, CA 92807 (US). C23C 16/40 (2006.01) H01L 21/02 (2006.01) (74) Agent: ROSSI, Joseph, D. et al.; Stradley Ronon Stevens C23C 16/50 (2006.01) & Young, LLP, 30 Valley Stream Parkway, Great Valley International Application Number: Corporate Center, Malvern, PA 19355 (US). PCT/US2017/058320 (81) Designated States (unless otherwise indicated, for every International Filing Date: kind of national protection available): AE, AG, AL, AM, 25 October 2017 (25.10.2017) AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, English DZ, EC, EE, EG, ES, FL GB, GD, GE, GH, GM, GT, HN, Publication Language: English HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, Priority Data: KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, 62/415,756 01 November 2016 (01.11.2016) US 15/789,732 20 October 2017 (20.10.2017) US OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, Applicant: VERSUM MATERIALS US, LLC [US/US]; TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. 8555 S. River Parkway, Tempe, AZ 85284 (US). (84) Designated States (unless otherwise indicated, for every Inventors: XIAO, Manchao; 5534 Caballos Place, San kind of regional protection available): ARIPO (BW, GH, Diego, CA 92130 (US). SPENCE, Daniel, P.; 2334 Hosp GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, = Title: PRECURSORS : A method feature into a flowable CVD reactor; introducing into the reactor at least organoamine wherein the flowable liquid oligomer forms a silicon oxide coating on the substrate and at least the at least one surface feature. Once cured, the silicon carbonitride coating has excellent mechanical (54) -- -- GC multifunctional ,-1 oligomer AND FLOWABLE CVD METHODS FOR MAKING LOW-K FILMS TO FILL SURFACE FEATURES comprising at least one compound and at least one to form a flowable liquid partially fills at least a portion properties. ' SP16561-091 #032 _ , • 4 2.0kV 3.8mm x100k SE(U) 1/19/2016 , - s sk, . --- . 500nm = = _ = = = _ = = FI G. 1 (Prior Art) for depositing a silicon-containing film, the method comprising: placing a substrate compound to at least partially react the at least one one silicon-containing silicon-containing compound 1-1 en en O 1 4n (57) GC c:::: , surface 0 of ei O [Continued on next page] WO 2018/085093 Al MIDEDIMOMOIDEIREIDIONIMHINIECIERVOIMIE UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
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US201662415756P | 2016-11-01 | 2016-11-01 | |
US15/789,732 US11735413B2 (en) | 2016-11-01 | 2017-10-20 | Precursors and flowable CVD methods for making low-k films to fill surface features |
PCT/US2017/058320 WO2018085093A1 (en) | 2016-11-01 | 2017-10-25 | Precursors and flowable cvd methods for making low-k films to fill surface features |
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EP (1) | EP3535436B1 (en) |
JP (1) | JP6882468B2 (en) |
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CN (1) | CN110023535B (en) |
SG (1) | SG11201903865TA (en) |
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Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015199111A1 (en) | 2014-06-25 | 2015-12-30 | 株式会社日立国際電気 | Substrate-processing device, program, and method for manufacturing semiconductor device |
KR102332415B1 (en) * | 2014-10-24 | 2021-12-01 | 버슘머트리얼즈 유에스, 엘엘씨 | Compositions and methods using same for deposition of silicon-containing films |
US10354923B2 (en) * | 2017-05-31 | 2019-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate |
US20190376178A1 (en) * | 2018-06-11 | 2019-12-12 | Versum Materials Us, Llc | Compositions and Methods Using Same for Deposition of Silicon-Containing Film |
US20200003937A1 (en) * | 2018-06-29 | 2020-01-02 | Applied Materials, Inc. | Using flowable cvd to gap fill micro/nano structures for optical components |
EP3844318A4 (en) * | 2018-10-03 | 2022-06-01 | Versum Materials US, LLC | Methods for making silicon and nitrogen containing films |
CN114174553A (en) * | 2019-06-21 | 2022-03-11 | 弗萨姆材料美国有限责任公司 | Composition and method for depositing silicon-containing films using the same |
EP3990676A4 (en) * | 2019-07-25 | 2023-07-05 | Versum Materials US, LLC | Compositions comprising silacycloalkanes and methods using same for deposition of silicon-containing film |
WO2021171466A1 (en) * | 2020-02-27 | 2021-09-02 | 株式会社Kokusai Electric | Production method for semiconductor device, substrate treatment device, and program |
JP2022099123A (en) * | 2020-12-22 | 2022-07-04 | 東京エレクトロン株式会社 | Insulating film forming method and processing device |
US20240158915A1 (en) * | 2021-03-18 | 2024-05-16 | Versum Materials Us, Llc | Composition for atomic layer deposition of high quality silicon oxide thin films |
CN117546277A (en) * | 2021-08-23 | 2024-02-09 | 株式会社国际电气 | Method for manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and program |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6153261A (en) * | 1999-05-28 | 2000-11-28 | Applied Materials, Inc. | Dielectric film deposition employing a bistertiarybutylaminesilane precursor |
JP2005536055A (en) * | 2002-08-18 | 2005-11-24 | アヴィザ テクノロジー インコーポレイテッド | Low temperature deposition of silicon oxide and silicon oxynitride |
US7119016B2 (en) * | 2003-10-15 | 2006-10-10 | International Business Machines Corporation | Deposition of carbon and nitrogen doped poly silicon films, and retarded boron diffusion and improved poly depletion |
US7524735B1 (en) | 2004-03-25 | 2009-04-28 | Novellus Systems, Inc | Flowable film dielectric gap fill process |
US7582555B1 (en) | 2005-12-29 | 2009-09-01 | Novellus Systems, Inc. | CVD flowable gap fill |
US7074690B1 (en) | 2004-03-25 | 2006-07-11 | Novellus Systems, Inc. | Selective gap-fill process |
US7521378B2 (en) | 2004-07-01 | 2009-04-21 | Micron Technology, Inc. | Low temperature process for polysilazane oxidation/densification |
JP4228150B2 (en) * | 2005-03-23 | 2009-02-25 | 東京エレクトロン株式会社 | Film forming apparatus, film forming method, and storage medium |
US7875556B2 (en) * | 2005-05-16 | 2011-01-25 | Air Products And Chemicals, Inc. | Precursors for CVD silicon carbo-nitride and silicon nitride films |
WO2006129773A1 (en) * | 2005-05-31 | 2006-12-07 | Toho Catalyst Co., Ltd. | Aminosilane compounds, catalyst components and catalysts for olefin polymerization, and process for production of olefin polymers with the same |
US7381659B2 (en) * | 2005-11-22 | 2008-06-03 | International Business Machines Corporation | Method for reducing film stress for SiCOH low-k dielectric materials |
US7498273B2 (en) | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
US9245739B2 (en) * | 2006-11-01 | 2016-01-26 | Lam Research Corporation | Low-K oxide deposition by hydrolysis and condensation |
US20080207007A1 (en) * | 2007-02-27 | 2008-08-28 | Air Products And Chemicals, Inc. | Plasma Enhanced Cyclic Chemical Vapor Deposition of Silicon-Containing Films |
US7651961B2 (en) * | 2007-03-30 | 2010-01-26 | Tokyo Electron Limited | Method for forming strained silicon nitride films and a device containing such films |
JP2009032962A (en) | 2007-07-27 | 2009-02-12 | Panasonic Corp | Semiconductor device and its production process |
US7541297B2 (en) | 2007-10-22 | 2009-06-02 | Applied Materials, Inc. | Method and system for improving dielectric film quality for void free gap fill |
US8491967B2 (en) * | 2008-09-08 | 2013-07-23 | Applied Materials, Inc. | In-situ chamber treatment and deposition process |
US7825040B1 (en) | 2009-06-22 | 2010-11-02 | Asm Japan K.K. | Method for depositing flowable material using alkoxysilane or aminosilane precursor |
US8741788B2 (en) | 2009-08-06 | 2014-06-03 | Applied Materials, Inc. | Formation of silicon oxide using non-carbon flowable CVD processes |
US8449942B2 (en) | 2009-11-12 | 2013-05-28 | Applied Materials, Inc. | Methods of curing non-carbon flowable CVD films |
JP2013516763A (en) | 2009-12-30 | 2013-05-13 | アプライド マテリアルズ インコーポレイテッド | Dielectric film growth using radicals generated using a flexible nitrogen / hydrogen ratio |
US8685867B1 (en) | 2010-12-09 | 2014-04-01 | Novellus Systems, Inc. | Premetal dielectric integration process |
JP2013008828A (en) * | 2011-06-24 | 2013-01-10 | Taiyo Nippon Sanso Corp | Formation method of silicon insulating film |
US8846536B2 (en) | 2012-03-05 | 2014-09-30 | Novellus Systems, Inc. | Flowable oxide film with tunable wet etch rate |
US8889566B2 (en) * | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
US10170297B2 (en) * | 2013-08-22 | 2019-01-01 | Versum Materials Us, Llc | Compositions and methods using same for flowable oxide deposition |
US10453675B2 (en) | 2013-09-20 | 2019-10-22 | Versum Materials Us, Llc | Organoaminosilane precursors and methods for depositing films comprising same |
US9233990B2 (en) * | 2014-02-28 | 2016-01-12 | Air Products And Chemicals, Inc. | Organoaminosilanes and methods for making same |
US20150275355A1 (en) * | 2014-03-26 | 2015-10-01 | Air Products And Chemicals, Inc. | Compositions and methods for the deposition of silicon oxide films |
TW201610204A (en) | 2014-07-26 | 2016-03-16 | 應用材料股份有限公司 | Low temperature molecular layer deposition of SiCON |
TW201619428A (en) * | 2014-08-20 | 2016-06-01 | 蘭姆研究公司 | Low-k oxide deposition by hydrolysis and condensation |
US9802828B2 (en) * | 2014-10-03 | 2017-10-31 | Applied Materials, Inc. | Precursors suitable for high temperature atomic layer deposition of silicon-containing films |
KR102332415B1 (en) * | 2014-10-24 | 2021-12-01 | 버슘머트리얼즈 유에스, 엘엘씨 | Compositions and methods using same for deposition of silicon-containing films |
US10421766B2 (en) * | 2015-02-13 | 2019-09-24 | Versum Materials Us, Llc | Bisaminoalkoxysilane compounds and methods for using same to deposit silicon-containing films |
US10566187B2 (en) * | 2015-03-20 | 2020-02-18 | Lam Research Corporation | Ultrathin atomic layer deposition film accuracy thickness control |
US9777025B2 (en) * | 2015-03-30 | 2017-10-03 | L'Air Liquide, Société pour l'Etude et l'Exploitation des Procédés Georges Claude | Si-containing film forming precursors and methods of using the same |
WO2017171817A1 (en) * | 2016-03-31 | 2017-10-05 | Intel Corporation | Flowable dielectrics from vapor phase precursors |
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JP6882468B2 (en) | 2021-06-02 |
JP2019534570A (en) | 2019-11-28 |
KR102329026B1 (en) | 2021-11-19 |
CN110023535A (en) | 2019-07-16 |
CN110023535B (en) | 2022-04-12 |
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EP3535436B1 (en) | 2021-05-12 |
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