SG11201903865TA - Precursors and flowable cvd methods for making low-k films to fill surface features - Google Patents

Precursors and flowable cvd methods for making low-k films to fill surface features

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Publication number
SG11201903865TA
SG11201903865TA SG11201903865TA SG11201903865TA SG11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA SG 11201903865T A SG11201903865T A SG 11201903865TA
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SG
Singapore
Prior art keywords
international
silicon
pct
flowable
precursors
Prior art date
Application number
SG11201903865TA
Inventor
Manchao Xiao
daniel Spence
Richard Ho
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Versum Materials Us Llc
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Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG11201903865TA publication Critical patent/SG11201903865TA/en

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    • H01L21/02211Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111111111011111111111111110110010011111111111100110111111011111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/085093 Al 11 May 2018 (11.05.2018) WIPO I PCT (51) (21) (22) (25) Filing Language: (26) (30) (71) (72) International Patent Classification: Way, #311, Carlsbad, CA 92008 (US). HO, Richard; 5815 C23C 16/30 (2006.01) C23C 16/48 (2006.01) E. La Palma Avenue, #313, Anaheim, CA 92807 (US). C23C 16/40 (2006.01) H01L 21/02 (2006.01) (74) Agent: ROSSI, Joseph, D. et al.; Stradley Ronon Stevens C23C 16/50 (2006.01) & Young, LLP, 30 Valley Stream Parkway, Great Valley International Application Number: Corporate Center, Malvern, PA 19355 (US). PCT/US2017/058320 (81) Designated States (unless otherwise indicated, for every International Filing Date: kind of national protection available): AE, AG, AL, AM, 25 October 2017 (25.10.2017) AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, English DZ, EC, EE, EG, ES, FL GB, GD, GE, GH, GM, GT, HN, Publication Language: English HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, Priority Data: KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, 62/415,756 01 November 2016 (01.11.2016) US 15/789,732 20 October 2017 (20.10.2017) US OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, Applicant: VERSUM MATERIALS US, LLC [US/US]; TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. 8555 S. River Parkway, Tempe, AZ 85284 (US). (84) Designated States (unless otherwise indicated, for every Inventors: XIAO, Manchao; 5534 Caballos Place, San kind of regional protection available): ARIPO (BW, GH, Diego, CA 92130 (US). SPENCE, Daniel, P.; 2334 Hosp GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, = Title: PRECURSORS : A method feature into a flowable CVD reactor; introducing into the reactor at least organoamine wherein the flowable liquid oligomer forms a silicon oxide coating on the substrate and at least the at least one surface feature. Once cured, the silicon carbonitride coating has excellent mechanical (54) -- -- GC multifunctional ,-1 oligomer AND FLOWABLE CVD METHODS FOR MAKING LOW-K FILMS TO FILL SURFACE FEATURES comprising at least one compound and at least one to form a flowable liquid partially fills at least a portion properties. ' SP16561-091 #032 _ , • 4 2.0kV 3.8mm x100k SE(U) 1/19/2016 , - s sk, . --- . 500nm = = _ = = = _ = = FI G. 1 (Prior Art) for depositing a silicon-containing film, the method comprising: placing a substrate compound to at least partially react the at least one one silicon-containing silicon-containing compound 1-1 en en O 1 4n (57) GC c:::: , surface 0 of ei O [Continued on next page] WO 2018/085093 Al MIDEDIMOMOIDEIREIDIONIMHINIECIERVOIMIE UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201903865TA 2016-11-01 2017-10-25 Precursors and flowable cvd methods for making low-k films to fill surface features SG11201903865TA (en)

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015199111A1 (en) 2014-06-25 2015-12-30 株式会社日立国際電気 Substrate-processing device, program, and method for manufacturing semiconductor device
KR102332415B1 (en) * 2014-10-24 2021-12-01 버슘머트리얼즈 유에스, 엘엘씨 Compositions and methods using same for deposition of silicon-containing films
US10354923B2 (en) * 2017-05-31 2019-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method for atomic layer deposition of a dielectric over a substrate
US20190376178A1 (en) * 2018-06-11 2019-12-12 Versum Materials Us, Llc Compositions and Methods Using Same for Deposition of Silicon-Containing Film
US20200003937A1 (en) * 2018-06-29 2020-01-02 Applied Materials, Inc. Using flowable cvd to gap fill micro/nano structures for optical components
EP3844318A4 (en) * 2018-10-03 2022-06-01 Versum Materials US, LLC Methods for making silicon and nitrogen containing films
CN114174553A (en) * 2019-06-21 2022-03-11 弗萨姆材料美国有限责任公司 Composition and method for depositing silicon-containing films using the same
EP3990676A4 (en) * 2019-07-25 2023-07-05 Versum Materials US, LLC Compositions comprising silacycloalkanes and methods using same for deposition of silicon-containing film
WO2021171466A1 (en) * 2020-02-27 2021-09-02 株式会社Kokusai Electric Production method for semiconductor device, substrate treatment device, and program
JP2022099123A (en) * 2020-12-22 2022-07-04 東京エレクトロン株式会社 Insulating film forming method and processing device
US20240158915A1 (en) * 2021-03-18 2024-05-16 Versum Materials Us, Llc Composition for atomic layer deposition of high quality silicon oxide thin films
CN117546277A (en) * 2021-08-23 2024-02-09 株式会社国际电气 Method for manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and program

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153261A (en) * 1999-05-28 2000-11-28 Applied Materials, Inc. Dielectric film deposition employing a bistertiarybutylaminesilane precursor
JP2005536055A (en) * 2002-08-18 2005-11-24 アヴィザ テクノロジー インコーポレイテッド Low temperature deposition of silicon oxide and silicon oxynitride
US7119016B2 (en) * 2003-10-15 2006-10-10 International Business Machines Corporation Deposition of carbon and nitrogen doped poly silicon films, and retarded boron diffusion and improved poly depletion
US7524735B1 (en) 2004-03-25 2009-04-28 Novellus Systems, Inc Flowable film dielectric gap fill process
US7582555B1 (en) 2005-12-29 2009-09-01 Novellus Systems, Inc. CVD flowable gap fill
US7074690B1 (en) 2004-03-25 2006-07-11 Novellus Systems, Inc. Selective gap-fill process
US7521378B2 (en) 2004-07-01 2009-04-21 Micron Technology, Inc. Low temperature process for polysilazane oxidation/densification
JP4228150B2 (en) * 2005-03-23 2009-02-25 東京エレクトロン株式会社 Film forming apparatus, film forming method, and storage medium
US7875556B2 (en) * 2005-05-16 2011-01-25 Air Products And Chemicals, Inc. Precursors for CVD silicon carbo-nitride and silicon nitride films
WO2006129773A1 (en) * 2005-05-31 2006-12-07 Toho Catalyst Co., Ltd. Aminosilane compounds, catalyst components and catalysts for olefin polymerization, and process for production of olefin polymers with the same
US7381659B2 (en) * 2005-11-22 2008-06-03 International Business Machines Corporation Method for reducing film stress for SiCOH low-k dielectric materials
US7498273B2 (en) 2006-05-30 2009-03-03 Applied Materials, Inc. Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes
US9245739B2 (en) * 2006-11-01 2016-01-26 Lam Research Corporation Low-K oxide deposition by hydrolysis and condensation
US20080207007A1 (en) * 2007-02-27 2008-08-28 Air Products And Chemicals, Inc. Plasma Enhanced Cyclic Chemical Vapor Deposition of Silicon-Containing Films
US7651961B2 (en) * 2007-03-30 2010-01-26 Tokyo Electron Limited Method for forming strained silicon nitride films and a device containing such films
JP2009032962A (en) 2007-07-27 2009-02-12 Panasonic Corp Semiconductor device and its production process
US7541297B2 (en) 2007-10-22 2009-06-02 Applied Materials, Inc. Method and system for improving dielectric film quality for void free gap fill
US8491967B2 (en) * 2008-09-08 2013-07-23 Applied Materials, Inc. In-situ chamber treatment and deposition process
US7825040B1 (en) 2009-06-22 2010-11-02 Asm Japan K.K. Method for depositing flowable material using alkoxysilane or aminosilane precursor
US8741788B2 (en) 2009-08-06 2014-06-03 Applied Materials, Inc. Formation of silicon oxide using non-carbon flowable CVD processes
US8449942B2 (en) 2009-11-12 2013-05-28 Applied Materials, Inc. Methods of curing non-carbon flowable CVD films
JP2013516763A (en) 2009-12-30 2013-05-13 アプライド マテリアルズ インコーポレイテッド Dielectric film growth using radicals generated using a flexible nitrogen / hydrogen ratio
US8685867B1 (en) 2010-12-09 2014-04-01 Novellus Systems, Inc. Premetal dielectric integration process
JP2013008828A (en) * 2011-06-24 2013-01-10 Taiyo Nippon Sanso Corp Formation method of silicon insulating film
US8846536B2 (en) 2012-03-05 2014-09-30 Novellus Systems, Inc. Flowable oxide film with tunable wet etch rate
US8889566B2 (en) * 2012-09-11 2014-11-18 Applied Materials, Inc. Low cost flowable dielectric films
US10170297B2 (en) * 2013-08-22 2019-01-01 Versum Materials Us, Llc Compositions and methods using same for flowable oxide deposition
US10453675B2 (en) 2013-09-20 2019-10-22 Versum Materials Us, Llc Organoaminosilane precursors and methods for depositing films comprising same
US9233990B2 (en) * 2014-02-28 2016-01-12 Air Products And Chemicals, Inc. Organoaminosilanes and methods for making same
US20150275355A1 (en) * 2014-03-26 2015-10-01 Air Products And Chemicals, Inc. Compositions and methods for the deposition of silicon oxide films
TW201610204A (en) 2014-07-26 2016-03-16 應用材料股份有限公司 Low temperature molecular layer deposition of SiCON
TW201619428A (en) * 2014-08-20 2016-06-01 蘭姆研究公司 Low-k oxide deposition by hydrolysis and condensation
US9802828B2 (en) * 2014-10-03 2017-10-31 Applied Materials, Inc. Precursors suitable for high temperature atomic layer deposition of silicon-containing films
KR102332415B1 (en) * 2014-10-24 2021-12-01 버슘머트리얼즈 유에스, 엘엘씨 Compositions and methods using same for deposition of silicon-containing films
US10421766B2 (en) * 2015-02-13 2019-09-24 Versum Materials Us, Llc Bisaminoalkoxysilane compounds and methods for using same to deposit silicon-containing films
US10566187B2 (en) * 2015-03-20 2020-02-18 Lam Research Corporation Ultrathin atomic layer deposition film accuracy thickness control
US9777025B2 (en) * 2015-03-30 2017-10-03 L'Air Liquide, Société pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
WO2017171817A1 (en) * 2016-03-31 2017-10-05 Intel Corporation Flowable dielectrics from vapor phase precursors

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