EP1192297A1 - Bain acide pour deposer par voie electrolytique des couches d'or ou d'alliage d'or brillantes, et agent de brillantage prevu a cet effet - Google Patents
Bain acide pour deposer par voie electrolytique des couches d'or ou d'alliage d'or brillantes, et agent de brillantage prevu a cet effetInfo
- Publication number
- EP1192297A1 EP1192297A1 EP00929491A EP00929491A EP1192297A1 EP 1192297 A1 EP1192297 A1 EP 1192297A1 EP 00929491 A EP00929491 A EP 00929491A EP 00929491 A EP00929491 A EP 00929491A EP 1192297 A1 EP1192297 A1 EP 1192297A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gold
- atoms
- sulfonate
- sulfate
- branched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the invention relates to an acid bath for the galvanic deposition of shiny gold and gold alloy layers and a gloss additive therefor.
- Galvanic gold baths usually contain gold and optionally one or more alloy elements in dissolved form.
- Such electrolytes are mainly based on gold cyanide complexes. It is necessary to adjust these electrolytes to a weak to moderately acidic pH using inorganic and / or organic acids and buffer salts.
- shiny gold or gold alloy layers are deposited from such baths, they usually contain certain inorganic or organic compounds as so-called “gloss additives”.
- a typical, very frequently used gloss additive is, as described for example in DE 23 55 581, the compound pyridine-3-sulfonic acid.
- Such additives shift or expand the working range, that is the range of applicable current density, in which a shiny gold plating is deposited, in the direction of high current densities.
- the use of higher current densities in turn allows deposition at a higher speed.
- the working range of such gold baths also depends on the pH of the electrolyte. It applies here that the working range (applicable current density range) is narrowed at a higher pH value, but at the same time the current yield and thus the separation speed is increased.
- the invention thus relates to an acidic bath for the electrodeposition of shiny gold and gold alloy layers, containing gold and optionally one or more alloy elements in dissolved form and at least one organic compound as an additive, characterized in that the bath as at least one compound of the additive general formula R - SO m -H (I)
- the gloss additives according to formula I are selected compounds from the classes of the alkyl sulfonates and the alkyl, aryl or heteroaryl sulfates.
- R means a straight or branched chain or cyclic alkyl group with up to 20 C atoms. If m stands for the number 4, then R can also be an aryl or heteroaryl group with up to 10 C atoms, it being possible for these to be substituted one or more times with straight-chain or branched-chain alkyl groups with 1 to 14 C atoms .
- Preferred gloss additives are compounds of the formula I in which R represents straight-chain or branched-chain or cyclic alkyl groups having 5 to 12 carbon atoms and in particular branched-chain alkyl groups having 6 to 10 carbon atoms.
- Typical gloss additives according to the invention are
- Branched-chain and short-chain connections are particularly suitable due to their lower tendency to foam, especially in processes and systems in which strong foam formation interferes, e.g. in air-moving electrolytes where
- Drum processing in systems for high-speed separation (spraying systems) and in systems for selective separation, e.g. Diving cells.
- the use of the further gloss additive according to the invention in acid baths for the electrodeposition of shiny gold and gold alloy layers is advantageously carried out in a concentration range from 0.01 to 10 g / l.
- Baths according to the invention which contain the gloss additive according to formula I in a concentration of 0.1 to 5 g / l are particularly advantageous.
- the compounds of the formula I according to the invention as a further gloss additive in galvanic gold baths of otherwise customary composition the applicable current density working range is expanded in an unexpected manner and at the same time the current yield and the separation efficiency are drastically increased in part.
- the galvanic gold baths according to the invention typically contain approximately
- alloy metals such as iron, cobalt, nickel, indium, silver, copper, cadmium, tin, zinc, bismuth, arsenic, antimony as salt or complex salt
- a low gold content can be used with the same separation performance.
- the advantages are the lower carry-over due to electrolytes adhering to the goods and the lower capital commitment.
- a maximum current density of 3 A / dm 2 is reached on pre-nickel-plated sheets of size 25 x 40 mm (experimental setup: 1 liter beaker, platinum-coated titanium anode, bath movement 200 rpm using a magnetic stirring bar 60 mm, movement of goods 5 cm / s).
- the cathodic current yield at 3 A / dm 2 is 52% and the deposition rate is 1.0 ⁇ m / min.
- a maximum current density of 5 A / dm 2 is achieved on sheets of size 25 x 40 mm (conditions see example 2).
- the cathodic current yield is 31% and the deposition rate is 1.0 ⁇ m / min.
- the maximum applicable current density is increased to over 6 A / dm 2 .
- the current yield is still 30%; the separation rate increases to 1.16 ⁇ m / min. This corresponds to a speed increase of 16%.
- a working range of up to 5 A / dm 2 is achieved in a Hull cell (test conditions: platinum-plated titanium anode, temperature 50 ° C., duration 2 min, movement 500 rpm by means of a magnetic stirring bar 25 mm) with a cell current of 2 A.
- the current yield at 5 A / dm 2 is 26%; the separation speed is 0.83 ⁇ m / min.
- the maximum applicable current density is increased to over 8 A / dm 2 .
- the current yield is still 19%; the separation rate increases to 1.0 ⁇ m / min.
- the maximum applicable current density is increased to over 5 A / dm 2 by the addition of 1 g / 1 hexyl sulfonate.
- the current yield is 35.1%, the separation efficiency increases to 1.13 ⁇ m / min. This corresponds to a speed increase of 15%.
- the maximum applicable current density is increased to over 7 A / dm 2 by the addition of 1 g / 1 octyl sulfonate.
- the current yield is 26.2%, the separation efficiency increases to 1.18 ⁇ r ⁇ / min. This corresponds to a 20% increase in speed.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19927642 | 1999-06-17 | ||
DE19927642 | 1999-06-17 | ||
DE10007325 | 2000-02-17 | ||
DE10007325A DE10007325A1 (de) | 1999-06-17 | 2000-02-17 | Saures Bad zur galvanischen Abscheidung von glänzenden Gold- und Goldlegierungsschichten und Glanzzusatz hierfür |
PCT/EP2000/003993 WO2000079031A1 (fr) | 1999-06-17 | 2000-05-04 | Bain acide pour deposer par voie electrolytique des couches d'or ou d'alliage d'or brillantes, et agent de brillantage prevu a cet effet |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1192297A1 true EP1192297A1 (fr) | 2002-04-03 |
EP1192297B1 EP1192297B1 (fr) | 2007-01-10 |
Family
ID=26004396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00929491A Expired - Lifetime EP1192297B1 (fr) | 1999-06-17 | 2000-05-04 | Bain acide pour deposer par voie electrolytique des couches d'or ou d'alliage d'or brillantes, et agent de brillantage prevu a cet effet |
Country Status (8)
Country | Link |
---|---|
US (1) | US6814850B1 (fr) |
EP (1) | EP1192297B1 (fr) |
JP (1) | JP3933930B2 (fr) |
CN (1) | CN1205360C (fr) |
DE (1) | DE50013952D1 (fr) |
HK (1) | HK1047773B (fr) |
TW (1) | TWI234591B (fr) |
WO (1) | WO2000079031A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
JP4868116B2 (ja) * | 2005-09-30 | 2012-02-01 | 学校法人早稲田大学 | 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
JP4868121B2 (ja) * | 2005-12-21 | 2012-02-01 | 学校法人早稲田大学 | アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法 |
JP4945193B2 (ja) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 硬質金合金めっき液 |
CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
CH710184B1 (fr) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
JP5471276B2 (ja) * | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
EP2312021B1 (fr) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
JP2011122192A (ja) * | 2009-12-09 | 2011-06-23 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
JP5854727B2 (ja) * | 2010-09-21 | 2016-02-09 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | シアン化物を含まない銀電気めっき液 |
JP2013177654A (ja) * | 2012-02-28 | 2013-09-09 | Matex Japan Co Ltd | 電解硬質金めっき液、めっき方法、及び、金−鉄合金被膜の製造方法 |
CN105401180A (zh) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | 一种耐磨镀金膜的电镀液及其电镀方法 |
CN105463530A (zh) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | 一种装饰性镍铜金三元合金电镀液 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2355581C3 (de) | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
CH629258A5 (en) | 1978-02-23 | 1982-04-15 | Systemes Traitements Surfaces | Bath for electrolytic deposition of white gold alloy |
DE3032469A1 (de) * | 1980-08-28 | 1982-04-01 | Siemens AG, 1000 Berlin und 8000 München | Cyanidische goldbaeder und verfahren zur galvanischen abscheidung von feststoffschmiermittel-haltigen gold-dispersionsueberzuegen und seine anwendung |
JPS604920B2 (ja) | 1981-03-30 | 1985-02-07 | 日本鉱業株式会社 | 耐摩耗性良好な黒色ロジウムメッキ被覆物品の製造方法 |
US4402802A (en) | 1981-01-03 | 1983-09-06 | Dequssa Aktiengesellschaft | Electrolytic bath for the deposition of rhodium coatings |
CH680370A5 (fr) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
JPH1150295A (ja) | 1997-07-28 | 1999-02-23 | Daiwa Kasei Kenkyusho:Kk | めっき浴 |
-
2000
- 2000-05-04 US US10/009,467 patent/US6814850B1/en not_active Expired - Fee Related
- 2000-05-04 EP EP00929491A patent/EP1192297B1/fr not_active Expired - Lifetime
- 2000-05-04 JP JP2001505372A patent/JP3933930B2/ja not_active Expired - Fee Related
- 2000-05-04 WO PCT/EP2000/003993 patent/WO2000079031A1/fr active IP Right Grant
- 2000-05-04 CN CNB00808582XA patent/CN1205360C/zh not_active Expired - Fee Related
- 2000-05-04 DE DE50013952T patent/DE50013952D1/de not_active Expired - Lifetime
- 2000-06-12 TW TW089111445A patent/TWI234591B/zh not_active IP Right Cessation
-
2002
- 2002-12-31 HK HK02109454.8A patent/HK1047773B/zh not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO0079031A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE50013952D1 (de) | 2007-02-22 |
CN1205360C (zh) | 2005-06-08 |
US6814850B1 (en) | 2004-11-09 |
HK1047773A1 (en) | 2003-03-07 |
WO2000079031A1 (fr) | 2000-12-28 |
TWI234591B (en) | 2005-06-21 |
JP2003502513A (ja) | 2003-01-21 |
JP3933930B2 (ja) | 2007-06-20 |
HK1047773B (zh) | 2006-01-27 |
EP1192297B1 (fr) | 2007-01-10 |
CN1357060A (zh) | 2002-07-03 |
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