EP3067444B1 - Deposition de revetements decoratifs en alliage palladium-fer sur des substances metalliques - Google Patents
Deposition de revetements decoratifs en alliage palladium-fer sur des substances metalliques Download PDFInfo
- Publication number
- EP3067444B1 EP3067444B1 EP16156476.0A EP16156476A EP3067444B1 EP 3067444 B1 EP3067444 B1 EP 3067444B1 EP 16156476 A EP16156476 A EP 16156476A EP 3067444 B1 EP3067444 B1 EP 3067444B1
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- EP
- European Patent Office
- Prior art keywords
- palladium
- iron
- electrolyte bath
- alloy
- electrolyte
- Prior art date
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 61
- 229910052763 palladium Inorganic materials 0.000 title claims description 27
- 238000000576 coating method Methods 0.000 title claims description 24
- 229910000640 Fe alloy Inorganic materials 0.000 title claims description 18
- 230000008021 deposition Effects 0.000 title claims description 12
- 239000007769 metal material Substances 0.000 title 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 55
- 239000003792 electrolyte Substances 0.000 claims description 38
- 229910052742 iron Inorganic materials 0.000 claims description 28
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000005260 corrosion Methods 0.000 claims description 14
- 230000007797 corrosion Effects 0.000 claims description 14
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 11
- 239000000080 wetting agent Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 7
- 229910002651 NO3 Inorganic materials 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 7
- 238000005275 alloying Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000003381 stabilizer Substances 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 6
- 230000001464 adherent effect Effects 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 5
- 239000002280 amphoteric surfactant Substances 0.000 claims description 5
- 229910002056 binary alloy Inorganic materials 0.000 claims description 5
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 5
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 5
- 235000011151 potassium sulphates Nutrition 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- -1 alkyl ether sulfonates Chemical class 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical compound [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 229960003237 betaine Drugs 0.000 claims description 3
- 238000005282 brightening Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 150000002191 fatty alcohols Chemical class 0.000 claims description 3
- 150000002941 palladium compounds Chemical class 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 3
- 229940081974 saccharin Drugs 0.000 claims description 3
- 235000019204 saccharin Nutrition 0.000 claims description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- 229940095064 tartrate Drugs 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 150000003868 ammonium compounds Chemical class 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 150000002505 iron Chemical class 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 150000002940 palladium Chemical class 0.000 claims description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 2
- 235000021317 phosphate Nutrition 0.000 claims description 2
- 150000003871 sulfonates Chemical class 0.000 claims description 2
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 claims 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims 1
- 229940117986 sulfobetaine Drugs 0.000 claims 1
- 239000000047 product Substances 0.000 description 13
- 239000010948 rhodium Substances 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 229910052703 rhodium Inorganic materials 0.000 description 10
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 10
- 239000010931 gold Substances 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 5
- 150000003863 ammonium salts Chemical class 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 3
- 231100000206 health hazard Toxicity 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- PNTWXEIQXBRCPS-CLKGFSLHSA-N Pd-II Natural products C1=CC(=O)OC2=C3[C@H](OC(=O)C(/C)=C/C)[C@H](OC(=O)C(\C)=C\C)C(C)(C)OC3=CC=C21 PNTWXEIQXBRCPS-CLKGFSLHSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001229 Pot metal Inorganic materials 0.000 description 1
- 229910000929 Ru alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- XSKIUFGOTYHDLC-UHFFFAOYSA-N palladium rhodium Chemical compound [Rh].[Pd] XSKIUFGOTYHDLC-UHFFFAOYSA-N 0.000 description 1
- OYJSZRRJQJAOFK-UHFFFAOYSA-N palladium ruthenium Chemical compound [Ru].[Pd] OYJSZRRJQJAOFK-UHFFFAOYSA-N 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/20—Electroplating: Baths therefor from solutions of iron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Definitions
- the present invention is directed to an electrolytic bath composition for depositing white, high-gloss, crack-free, abrasion and corrosion-resistant palladium-iron alloys from alkaline aqueous baths, objects and articles coated with these alloys, and a process for producing the coated objects Items.
- the electrolytes are out JP, 2001-192885, A are also based on ammonium salts and contain additional brighteners and possibly different alloying metals such as iron or tellurium.
- JP, 2001-181887, A describes palladium-iron alloy baths which are also based on ammonium salts, and additionally contain EDTA.
- strong chelating agents are generally undesirable in electrolytes since they introduce difficulties in wastewater treatment.
- JP, 10-046384, A describes palladium alloy baths for the electronics industry. Iron as alloying metal is mentioned, the electrolytes are based on ammonium salts. The examples, however, relate only to palladium-cobalt alloys. Alloys of palladium-iron, palladium-nickel, palladium-rhodium and palladium-ruthenium should be produced in the same way.
- DE2657925 describes ammonia-free, semi-glossy to bright palladium and palladium alloy baths for electrical engineering, but iron is not mentioned as alloying metal.
- EP 1396559A1 is an electrolytic bath for the cathodic deposition of binary alloys to form white, corrosion-resistant, crack-free and (high) glossy coatings on at least on their surface metallic or electrically conductive or conductive coated objects known which bath as alloying metals at least one palladium compound as the primary metal and contains at least one iron compound as secondary metal, and for the deposition of a Pd / Fe alloy having a content in the range of 5 to 15 wt% Fe - as an aqueous alkaline solution having a pH of 7.5 to 9 and as essential other components at least one wetting agent from the group of amphoteric surfactants and additionally contains at least one of the usual in palladium baths contained gloss additives and conductive salts, pH stabilizers and voltage reducer, wherein the electrolyte bath has a content of palladium of 0.5 to 15 g / l and of iron from 0.2 to 2 g / l au f réelle.
- the object of the present invention to develop baths from which high gloss, binary palladium-iron alloys can be deposited without any addition of other metals and.
- the alloy baths during operation should not present an odor nuisance or health hazard through the release of irritating gases or vapors, and moreover contain no strong complexing agents such as EDTA or NTA, which would cause problems in wastewater treatment.
- the production is to be cheapened by the use of such alloy baths, and resources of the expensive palladium are spared.
- Such alloys are therefore particularly well suited for any metallic white decorative coating, e.g. of costume jewelery, but also for industrial applications, especially in the electronics industry.
- the baths contain 0.5-15 g / l of palladium, 0.2-2 g / l of iron, conductive salts, brighteners and wetting agents. It is possible to deposit layer thicknesses> 5 ⁇ high gloss, crack-free.
- the corrosion resistance is comparable to pure palladium, the abrasion resistance is better than pure palladium.
- the invention relates to a novel electrolyte bath for the cathodic deposition of binary alloys with the formation of white, corrosion-resistant, crack-free and (high) glossy coatings on at least metallic or electrically conductive or conductively coated objects on its surface, which bath contains at least one palladium compound as alloying metals.
- a palladium salt as a primary metal and at least one iron compound, in particular an iron salt, as a secondary metal, which for the deposition of a Pd / Fe alloy with a content in the range of 5 to 15 wt% Fe - as an aqueous, alkaline solution with a pH value of 7.5 to 9, and in addition to the metal compounds mentioned as essential further components at least one wetting agent from the group of amphoteric surfactants, and at least one brightener and conductive salts, pH stabilizers and voltage reducer, wherein the electrolyte bath a Content of P alladium of 0.5 to 15 g / l and iron of 0.2 to 2 g / l and is free of ammonia and ammonium compounds.
- the new electrolyte bath is characterized in that it contains betaines and sulfobetaines in quantities of 0.5-2 g / l as wetting agents from the group of the amphoteric surfactants, and aromatic N-heterocycles substituted as brightening agents, and as stress relievers saccharin or organic sulfonates, and as conductive salts and / or pH stabilizers, sodium or potassium sulfate, chloride, nitrate, citrate, tartrate, or malonate.
- the pH of the new alloy bath should be maintained in the range of 7.5 - 9, since at lower pH values (approximately between 7 and 7.5) the incorporation rates of iron decrease. At higher pH values (approximately between 9 and 10), burns occur in the high current density range.
- the pH is advantageously adjusted by means of sodium or potassium hydroxide.
- the iron content of the deposited alloy at 5-15 wt .-% Fe since at incorporation rates> 15 wt .- Fe Fe the layers are cracked, and at incorporation rates ⁇ 5% by weight, the deposition receives a milky appearance.
- palladium in divalent form for example as palladium chloride, sulfate or nitrate, and iron as iron sulfate, chloride, nitrate or citrate are present in the electrolyte bath.
- an electrolyte bath which is characterized in that it has a content of palladium of 2 to 8 g / l, and more preferably of 4 to 6 g / l and of iron preferably 0.5 to 1 Contains 5 g / l.
- conductive salts and pH stabilizers such as sodium or potassium sulfate, - nitrate, chloride, citrate, tartrate, or malonate, and further as wetting agents alkyl ether sulfonates, alkyl ether phosphates or fatty alcohol alkoxylates. All conductive salts or pH stabilizers used in the invention are sodium or potassium salts.
- the total thickness of the binary palladium-iron coating to be achieved in the context of the invention is in each case 0.1 to 5 ⁇ m, in particular approximately 0.5 to 3 ⁇ m, depending on the field of use.
- a further, electrodeposited final layer of gold and / or another noble metal such as, in particular, rhodium, platinum, ruthenium or an alloy of the same, can be arranged, by means of which the already high usability and the gloss of the coating is still increased.
- an adherent gold adherent intermediate layer adhered thereto may be disposed on the palladium-iron overlay and an electrolytically deposited, adherent final layer of gold and / or another thereon Noble metal, in particular rhodium, platinum, ruthenium or an alloy of the same.
- the intermediate layer of adhesive gold may have a thickness of 0.05 to 0.3 microns.
- the coated new objects or articles can be coated with a final layer of an alloy formed with rhodium and ruthenium, preferably in the weight% ratio of (70 to 90) to (30 to 10), in particular of about 80 to 20 his. It is the object of the present invention to adjust the concentration of the metal salts, wetting agents, brighteners and the additional ingredients in the mold and to vary within the weight ratios according to the invention so that the electrolyte solution is clear and remains, so that no metal salts precipitate, and that just according to the invention desired, shiny, adherent, crack-free, abrasion and corrosion resistant layers or coatings are deposited.
- the working temperature of the electrolyte baths according to the invention is between 35 and 75 ° C.
- the current density can be set to between 0.01 and 10 amps / dm 2 , depending on the type of coating system.
- current densities between 0.05 and 0.50 A / dm 2 are particularly preferred.
- insoluble anodes When using the electrolyte baths according to the invention, various insoluble anodes can be used.
- insoluble anodes those of a material selected from the group consisting of platinum-plated titanium and iridium-transition metal mixed oxide or combinations of these materials may be used, with platinized titanium anodes being preferred.
- the production of the objects or articles coated according to the invention is usually carried out as follows: On a respective base material, for example consisting of brass, zinc, iron, steel or their alloys or other materials made conductive at least on its surface is either directly or on a previously applied copper undercoat, deposited from cyanide or non-cyanidic alkaline and / or from acidic copper baths, the new binary palladium-iron alloy is deposited either directly or on Cu / Sn / Zn alloy of cyanide bronze baths applied there.
- This palladium-iron alloy is in itself a final layer. However, it can be further coated by methods known per se. Other coatings may, as mentioned above, be gold-containing or other noble metal-containing layers, such as those of rhodium, platinum, ruthenium or their alloys.
- the base material is first copper-plated, then coated with palladium and finally receives the desired finish by coating with gold, rhodium or other precious metals or their alloys.
- a thickness of the palladium layer of about 0.5-5 microns is recommended. Usually a layer thickness of about 1 ⁇ m is considered sufficient.
- rhodium-ruthenium alloy instead of a rhodium final layer. If, for example, an alloy in the ratio by weight of rhodium to ruthenium of 80:20 is deposited as the final layer, in addition to the savings in the intermediate layers mentioned above, 20% of the very expensive rhodium would be saved.
- the invention further relates to a per se conventional method for cathodic deposition of the binary alloys according to the invention with an Fe content of 5-15% by weight on at least on their surface metallic or electrically conductive or conductive coated objects or articles using the electrolyte according to the invention ,
- the corrosion resistance of the palladium-iron alloy in comparison with a coating of a pure palladium electrolyte (Gapal TS, product of Garhöfer GesmbH), produced on the same base material in the SO 2 test is equally good.
- a brass disc in the palladium-iron electrolyte of example 1 and a brass disc in a pure palladium electrolyte (Gapal TS, product of Garhöfer GesmbH) were coated with 2 .mu.m. Ansch manend both discs were abraded. The pure palladium was rubbed much earlier than the palladium-iron alloy.
- a jewelery blank made of die-cast zinc is electrolytically degreased in a weakly alkaline cyanide-free cleaner (degreasing 1018, product of the company Ing. W. Garhöfer GesmbH) at 25 ° C. for 30 seconds at 10 A / dm 2 .
- a weakly alkaline cyanide-free cleaner degreasing 1018, product of the company Ing. W. Garhöfer GesmbH
- the jewelry blank is rinsed in deionized water and in an alkaline cyanide Vorkupferbad with 22 g / l Cu and 34 g / l KCN ("Cuproga", product of the company Ing. W. Garhöfer GesmbH) were 5 microns of copper at 1 A / dm 2 and 50 ° C deposited.
- the pre-coppered jewelry blank is then dekapiert in 5% sulfuric acid solution for 30 s and in an acidic copper bath with 50 g / l Cu and 60 g / l sulfuric acid ("IWG Cu 550", product of the company Ing. W. Garhöfer GesmbH) 15 ⁇ m copper leveling and high gloss deposited at 4 A / dm 2 and 25 ° C.
- the thus coppered part is rinsed and pre-immersed in a 10% KCN solution.
- the galvanized part of the jewelry performed just as well in the corrosion tests as a jewelery part coated with pure palladium using the same process.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Claims (5)
- Bain électrolytique pour le dépôt cathodique d'alliages binaires avec formation de revêtements blancs, résistants à la corrosion, sans fissure et (hautement) brillants sur des objets qui, au moins au niveau de leur surface, sont métalliques ou électriquement conducteurs ou recouverts d'une couche électriquement conductrice, lequel bain contient comme métaux d'alliage au moins un composé du palladium, en particulier un sel de palladium, comme métal primaire et au moins un composé du fer, en particulier un sel de fer, comme métal secondaire, lequel bain est présent, pour le dépôt d'un alliage Pd/Fe avec une teneur comprise entre 5 et 15 % en poids de fer, sous forme de solution aqueuse alcaline avec une valeur pH de 7,5 à 9 et contient hormis les composés métalliques mentionnés, comme autre composants essentiels, au moins un agent mouillant du groupe des tensioactifs amphotères et au moins un produit brillanteur ainsi que des sels conducteurs, des stabilisateurs de pH et des réducteurs de tension, lequel bain électrolytique présente une teneur en palladium de 0,5 à 15 g/l et en fer de 0,2 à 2 g/l et est exempt d'ammoniac et de composés de l'ammonium,
caractérisé en ce qu'il contient comme agent mouillant du groupe des tensioactifs amphotères 0,5 à 2 g/l de bétaïne et de sulfobétaïne et comme produit brillanteur des hétérocyles N aromatiques substitués et comme réducteurs de tension de la saccharine ou des sulfonates organiques et comme sels conducteurs et/ou stabilisateurs de pH du sulfate de sodium ou de potassium, du chlorure de sodium ou de potassium, du nitrate de sodium ou de potassium, du citrate de sodium ou de potassium, du tartrate de sodium ou de potassium ou du malonate de sodium ou de potassium. - Bain électrolytique selon la revendication 1, caractérisé en ce que le bain électrolytique présente une teneur en palladium de 2 à 8 g/l, de préférence de 4 à 6 g/l, et en fer de 0,5 à 1,5 g/l.
- Bain électrolytique selon la revendication 1 ou 2, caractérisé en ce que les métaux d'alliage contenus dans celui-ci sont présents sous forme bivalente le palladium comme chlorure, sulfate ou nitrate de palladium et le fer comme sulfate, chlorure, nitrate ou citrate de fer III.
- Bain électrolytique selon l'une quelconque des revendications 1 à 3, caractérisé en ce qu'il contient comme autre agent mouillant du sulfonate d'alkyléther, du phosphate d'alkyléther ou de l'alkoxylate d'alcool gras.
- Procédé de fabrication d'objets ou articles, munis d'un revêtement blanc ou d'un revêtement de ce type résistant à la corrosion, sans fissure, fortement résistant à l'abrasion et à l'adhérence, brillant, du groupe des articles de bijouterie ou de décoration, du groupe des composants et éléments électrotechniques ou électroniques en laiton, zinc, étain, fer ou acier ou alliages de ceux-ci ou en un plastique rendu conducteur, dans lequel on dépose un alliage Pd/Fe de préférence sur une couche de substrat métallique, en particulier en cuivre, située sur la surface de l'ébauche d'objet ou article, caractérisé en ce que les objets ou articles à revêtir, le cas échéant après un revêtement de base avec du cuivre, sont soumis à une électrolyse dans un bain électrolytique selon l'une quelconque des revendications 1 à 4 à des températures comprises entre 35 et 75 °C et avec des densités de courant comprises entre 0,1 et 10 A/dm2, en particulier entre 0,2 et 5 A/dm2, en utilisant au moins une anode insoluble.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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ATA50188/2015A AT516876B1 (de) | 2015-03-09 | 2015-03-09 | Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen |
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EP3067444A2 EP3067444A2 (fr) | 2016-09-14 |
EP3067444A3 EP3067444A3 (fr) | 2016-12-07 |
EP3067444B1 true EP3067444B1 (fr) | 2019-03-27 |
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EP16156476.0A Active EP3067444B1 (fr) | 2015-03-09 | 2016-02-19 | Deposition de revetements decoratifs en alliage palladium-fer sur des substances metalliques |
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AT (1) | AT516876B1 (fr) |
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AT522158B1 (de) * | 2019-05-03 | 2020-09-15 | Iwg Ing W Garhoefer Ges M B H | Beschichtungssystem zum Aufbringen durch galvanische Abscheidung auf einen Rohling |
US10612149B1 (en) | 2019-09-05 | 2020-04-07 | Chow Sang Sang Jewellery Company Limited | Platinum electrodeposition bath and uses thereof |
AT523922B1 (de) * | 2020-09-08 | 2022-01-15 | Iwg Ing W Garhoefer Ges M B H | Elektrolytbad für Palladium-Ruthenium-Beschichtungen |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2364980A1 (fr) * | 1976-09-17 | 1978-04-14 | Parker Ste Continentale | Bain et procede pour le depot electrolytique d'alliages a base de palladium |
DE2657925A1 (de) | 1976-12-21 | 1978-06-22 | Siemens Ag | Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen |
DE2906783A1 (de) * | 1979-02-22 | 1980-10-16 | Degussa | Verfahren zur vorbehandlung von leichtmetallen vor dem galvanisieren |
DE19512888A1 (de) * | 1995-04-06 | 1996-10-10 | Vacuumschmelze Gmbh | Verfahren zur elektrolytischen Beschichtung von Seltene Erden enthaltenden Dauermagneten mit minimaler Oberflächenschädigung |
JPH1046384A (ja) | 1996-05-10 | 1998-02-17 | Lucent Technol Inc | パラジウム合金メッキ浴 |
US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
GB2382353B (en) * | 1999-10-27 | 2004-10-27 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
JP3601005B2 (ja) | 1999-10-27 | 2004-12-15 | 小島化学薬品株式会社 | パラジウムめっき液 |
JP3208131B2 (ja) | 1999-12-24 | 2001-09-10 | 株式会社ビクトリア | パラジウム/鉄合金メッキ液及びパラジウム合金メッキ基材 |
JP4811880B2 (ja) * | 2006-01-06 | 2011-11-09 | エントン インコーポレイテッド | 艶消し金属層を堆積するための電解液および工程 |
EP2283170B1 (fr) * | 2008-05-07 | 2012-04-25 | Umicore Galvanotechnik GmbH | Bains d'électrolyte au pd et au pd-ni |
DE502008001789D1 (de) * | 2008-11-21 | 2010-12-23 | Umicore Galvanotechnik Gmbh | Edelmetallhaltige Schichtfolge für dekorative Artikel |
DE102009055828A1 (de) * | 2008-12-19 | 2010-07-01 | Merck Patent Gmbh | Verfahren zur Herstellung metallbeschichteter Partikel |
-
2015
- 2015-03-09 AT ATA50188/2015A patent/AT516876B1/de active
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2016
- 2016-02-19 EP EP16156476.0A patent/EP3067444B1/fr active Active
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EP3067444A2 (fr) | 2016-09-14 |
EP3067444A3 (fr) | 2016-12-07 |
AT516876B1 (de) | 2016-11-15 |
AT516876A1 (de) | 2016-09-15 |
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