EP1192297A1 - Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor - Google Patents
Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener thereforInfo
- Publication number
- EP1192297A1 EP1192297A1 EP00929491A EP00929491A EP1192297A1 EP 1192297 A1 EP1192297 A1 EP 1192297A1 EP 00929491 A EP00929491 A EP 00929491A EP 00929491 A EP00929491 A EP 00929491A EP 1192297 A1 EP1192297 A1 EP 1192297A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gold
- atoms
- sulfonate
- sulfate
- branched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the invention relates to an acid bath for the galvanic deposition of shiny gold and gold alloy layers and a gloss additive therefor.
- Galvanic gold baths usually contain gold and optionally one or more alloy elements in dissolved form.
- Such electrolytes are mainly based on gold cyanide complexes. It is necessary to adjust these electrolytes to a weak to moderately acidic pH using inorganic and / or organic acids and buffer salts.
- shiny gold or gold alloy layers are deposited from such baths, they usually contain certain inorganic or organic compounds as so-called “gloss additives”.
- a typical, very frequently used gloss additive is, as described for example in DE 23 55 581, the compound pyridine-3-sulfonic acid.
- Such additives shift or expand the working range, that is the range of applicable current density, in which a shiny gold plating is deposited, in the direction of high current densities.
- the use of higher current densities in turn allows deposition at a higher speed.
- the working range of such gold baths also depends on the pH of the electrolyte. It applies here that the working range (applicable current density range) is narrowed at a higher pH value, but at the same time the current yield and thus the separation speed is increased.
- the invention thus relates to an acidic bath for the electrodeposition of shiny gold and gold alloy layers, containing gold and optionally one or more alloy elements in dissolved form and at least one organic compound as an additive, characterized in that the bath as at least one compound of the additive general formula R - SO m -H (I)
- the gloss additives according to formula I are selected compounds from the classes of the alkyl sulfonates and the alkyl, aryl or heteroaryl sulfates.
- R means a straight or branched chain or cyclic alkyl group with up to 20 C atoms. If m stands for the number 4, then R can also be an aryl or heteroaryl group with up to 10 C atoms, it being possible for these to be substituted one or more times with straight-chain or branched-chain alkyl groups with 1 to 14 C atoms .
- Preferred gloss additives are compounds of the formula I in which R represents straight-chain or branched-chain or cyclic alkyl groups having 5 to 12 carbon atoms and in particular branched-chain alkyl groups having 6 to 10 carbon atoms.
- Typical gloss additives according to the invention are
- Branched-chain and short-chain connections are particularly suitable due to their lower tendency to foam, especially in processes and systems in which strong foam formation interferes, e.g. in air-moving electrolytes where
- Drum processing in systems for high-speed separation (spraying systems) and in systems for selective separation, e.g. Diving cells.
- the use of the further gloss additive according to the invention in acid baths for the electrodeposition of shiny gold and gold alloy layers is advantageously carried out in a concentration range from 0.01 to 10 g / l.
- Baths according to the invention which contain the gloss additive according to formula I in a concentration of 0.1 to 5 g / l are particularly advantageous.
- the compounds of the formula I according to the invention as a further gloss additive in galvanic gold baths of otherwise customary composition the applicable current density working range is expanded in an unexpected manner and at the same time the current yield and the separation efficiency are drastically increased in part.
- the galvanic gold baths according to the invention typically contain approximately
- alloy metals such as iron, cobalt, nickel, indium, silver, copper, cadmium, tin, zinc, bismuth, arsenic, antimony as salt or complex salt
- a low gold content can be used with the same separation performance.
- the advantages are the lower carry-over due to electrolytes adhering to the goods and the lower capital commitment.
- a maximum current density of 3 A / dm 2 is reached on pre-nickel-plated sheets of size 25 x 40 mm (experimental setup: 1 liter beaker, platinum-coated titanium anode, bath movement 200 rpm using a magnetic stirring bar 60 mm, movement of goods 5 cm / s).
- the cathodic current yield at 3 A / dm 2 is 52% and the deposition rate is 1.0 ⁇ m / min.
- a maximum current density of 5 A / dm 2 is achieved on sheets of size 25 x 40 mm (conditions see example 2).
- the cathodic current yield is 31% and the deposition rate is 1.0 ⁇ m / min.
- the maximum applicable current density is increased to over 6 A / dm 2 .
- the current yield is still 30%; the separation rate increases to 1.16 ⁇ m / min. This corresponds to a speed increase of 16%.
- a working range of up to 5 A / dm 2 is achieved in a Hull cell (test conditions: platinum-plated titanium anode, temperature 50 ° C., duration 2 min, movement 500 rpm by means of a magnetic stirring bar 25 mm) with a cell current of 2 A.
- the current yield at 5 A / dm 2 is 26%; the separation speed is 0.83 ⁇ m / min.
- the maximum applicable current density is increased to over 8 A / dm 2 .
- the current yield is still 19%; the separation rate increases to 1.0 ⁇ m / min.
- the maximum applicable current density is increased to over 5 A / dm 2 by the addition of 1 g / 1 hexyl sulfonate.
- the current yield is 35.1%, the separation efficiency increases to 1.13 ⁇ m / min. This corresponds to a speed increase of 15%.
- the maximum applicable current density is increased to over 7 A / dm 2 by the addition of 1 g / 1 octyl sulfonate.
- the current yield is 26.2%, the separation efficiency increases to 1.18 ⁇ r ⁇ / min. This corresponds to a 20% increase in speed.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19927642 | 1999-06-17 | ||
DE19927642 | 1999-06-17 | ||
DE10007325A DE10007325A1 (en) | 1999-06-17 | 2000-02-17 | Acid bath for galvanically depositing glossy gold and gold alloy layers contains gold and optionally one or more alloying elements in dissolved form as well as an organic compound as brightening agent |
DE10007325 | 2000-02-17 | ||
PCT/EP2000/003993 WO2000079031A1 (en) | 1999-06-17 | 2000-05-04 | Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1192297A1 true EP1192297A1 (en) | 2002-04-03 |
EP1192297B1 EP1192297B1 (en) | 2007-01-10 |
Family
ID=26004396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00929491A Expired - Lifetime EP1192297B1 (en) | 1999-06-17 | 2000-05-04 | Acidic bath for galvanic deposition of lustrous gold and gold alloy layers and lustring additive therfor |
Country Status (8)
Country | Link |
---|---|
US (1) | US6814850B1 (en) |
EP (1) | EP1192297B1 (en) |
JP (1) | JP3933930B2 (en) |
CN (1) | CN1205360C (en) |
DE (1) | DE50013952D1 (en) |
HK (1) | HK1047773B (en) |
TW (1) | TWI234591B (en) |
WO (1) | WO2000079031A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
JP4868116B2 (en) * | 2005-09-30 | 2012-02-01 | 学校法人早稲田大学 | Gold-cobalt amorphous alloy plating film, electroplating solution and electroplating method |
JP4868121B2 (en) * | 2005-12-21 | 2012-02-01 | 学校法人早稲田大学 | Electroplating solution and method for forming amorphous gold-nickel alloy plating film |
JP4945193B2 (en) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Hard gold alloy plating solution |
CH714243B1 (en) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Electroforming process and part or layer obtained by this method. |
CH710184B1 (en) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
EP2312021B1 (en) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals |
JP5471276B2 (en) * | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | Electro copper plating bath and electro copper plating method |
JP2011122192A (en) * | 2009-12-09 | 2011-06-23 | Ne Chemcat Corp | Electrolytic hard gold plating liquid and plating method using the same |
EP2431502B1 (en) * | 2010-09-21 | 2017-05-24 | Rohm and Haas Electronic Materials LLC | Cyanide-free silver electroplating solutions |
JP2013177654A (en) * | 2012-02-28 | 2013-09-09 | Matex Japan Co Ltd | Electrolytic hard gold plating liquid, plating method, and manufacturing method of gold-iron alloy film |
CN105463530A (en) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | Decorative nickel-copper-gold ternary alloy electroplating liquid |
CN105401180A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2355581C3 (en) | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanic bright gold bath with high deposition rate |
CH629258A5 (en) * | 1978-02-23 | 1982-04-15 | Systemes Traitements Surfaces | Bath for electrolytic deposition of white gold alloy |
DE3032469A1 (en) * | 1980-08-28 | 1982-04-01 | Siemens AG, 1000 Berlin und 8000 München | CYANIDIC GOLD BATHS AND GALVANIC DEPOSITION OF SOLID LUBRICANT-CONTAINING GOLD DISPERSION SURFACES AND ITS APPLICATION |
JPS604920B2 (en) | 1981-03-30 | 1985-02-07 | 日本鉱業株式会社 | Method for manufacturing black rhodium plated articles with good wear resistance |
US4402802A (en) | 1981-01-03 | 1983-09-06 | Dequssa Aktiengesellschaft | Electrolytic bath for the deposition of rhodium coatings |
CH680370A5 (en) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
JPH1150295A (en) | 1997-07-28 | 1999-02-23 | Daiwa Kasei Kenkyusho:Kk | Plating bath |
-
2000
- 2000-05-04 EP EP00929491A patent/EP1192297B1/en not_active Expired - Lifetime
- 2000-05-04 CN CNB00808582XA patent/CN1205360C/en not_active Expired - Fee Related
- 2000-05-04 WO PCT/EP2000/003993 patent/WO2000079031A1/en active IP Right Grant
- 2000-05-04 DE DE50013952T patent/DE50013952D1/en not_active Expired - Lifetime
- 2000-05-04 US US10/009,467 patent/US6814850B1/en not_active Expired - Fee Related
- 2000-05-04 JP JP2001505372A patent/JP3933930B2/en not_active Expired - Fee Related
- 2000-06-12 TW TW089111445A patent/TWI234591B/en not_active IP Right Cessation
-
2002
- 2002-12-31 HK HK02109454.8A patent/HK1047773B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO0079031A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE50013952D1 (en) | 2007-02-22 |
WO2000079031A1 (en) | 2000-12-28 |
US6814850B1 (en) | 2004-11-09 |
HK1047773A1 (en) | 2003-03-07 |
JP2003502513A (en) | 2003-01-21 |
CN1205360C (en) | 2005-06-08 |
HK1047773B (en) | 2006-01-27 |
TWI234591B (en) | 2005-06-21 |
EP1192297B1 (en) | 2007-01-10 |
CN1357060A (en) | 2002-07-03 |
JP3933930B2 (en) | 2007-06-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE19653681C2 (en) | Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process | |
EP2283170B1 (en) | Pd and pd-ni electrolyte baths | |
DE3428345A1 (en) | AQUEOUS BATHROOM FOR GALVANIC DEPOSITION OF ZINC AND ZINC ALLOYS | |
DE4105272C2 (en) | ||
DE1062079B (en) | Cyanide bath and process for the galvanic deposition of copper coatings | |
EP1408141B1 (en) | Process and electrolyte for the galvanic deposition of bronze | |
WO2000079031A1 (en) | Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor | |
AT514818A1 (en) | Deposition of Cu, Sn, Zn coatings on metallic substrates | |
DE4023444A1 (en) | Cyanide-free copper plating process - where a portion of the plating bath is electrolysed by an independently-controlled insol. anode to reduce bath impurities | |
DE3012168C2 (en) | ||
DE3628361C2 (en) | ||
DE60111727T2 (en) | COMPLEX PALLADIUM SALT AND ITS USE FOR ADAPTING THE PALLADIUM CONCENTRATION IN ELECTROLYTIC BATHS DETERMINED FOR THE DISPOSAL OF PALLADIUM OR ONE OF ITS ALLOYS | |
WO2015000010A1 (en) | Electrolyte bath and objects or articles coated with the aid of the bath | |
EP3067444B1 (en) | Deposition of decorative palladium iron alloy coatings on metallic substances | |
CH640888A5 (en) | METHOD FOR THE GALVANIC DEPOSITION OF AN IRON AND NICKEL AND / OR COBALT CONTAINING RAIN AND A SUITABLE BATH FOR THIS. | |
DE102012004348B4 (en) | Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys | |
WO2001048273A1 (en) | Bath for electrochemically depositing highly lustrous white rhodium coatings and whitening agent for the same | |
DE2352970A1 (en) | CORROSION-RESISTANT METAL COATINGS CONTAINING ELECTRICALLY DEPOSITED NICKEL AND MICROPOROUS CHROME | |
DE2642666A1 (en) | PROCESS AND COMPOSITION FOR THE PRODUCTION OF AN ELECTRICAL DEPOSIT | |
DE2032867B2 (en) | Galvanic gold bath and process for the deposition of even, thick gold coatings | |
DE10007325A1 (en) | Acid bath for galvanically depositing glossy gold and gold alloy layers contains gold and optionally one or more alloying elements in dissolved form as well as an organic compound as brightening agent | |
DE2839360C2 (en) | Aqueous bath for the galvanic deposition of shiny coatings made of palladium or its alloys | |
DE4040526C3 (en) | Bath for the galvanic deposition of gold alloys | |
EP3047051A1 (en) | Galvanic bath | |
DE2333096B2 (en) | Electroplated multilayer metal coating and process for its manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20011025 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: MANZ, UWE Inventor name: BRONDER, KLAUS |
|
17Q | First examination report despatched |
Effective date: 20020524 |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
RTI1 | Title (correction) |
Free format text: ACIDIC BATH FOR GALVANIC DEPOSITION OF LUSTROUS GOLD AND GOLD ALLOY LAYERS AND LUSTRING ADDITIVE THERFOR |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REF | Corresponds to: |
Ref document number: 50013952 Country of ref document: DE Date of ref document: 20070222 Kind code of ref document: P |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 20070410 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20071011 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20130501 Year of fee payment: 14 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20130531 Year of fee payment: 14 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20140504 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20150130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20140602 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20140504 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20190423 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 50013952 Country of ref document: DE |